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Polyimide double-sided flexible heat-conducting copper-clad plate as well as preparation method and application thereof

A technology of polyimide and copper clad laminate, applied in the field of polyimide double-sided flexible thermal conductive copper clad laminate and its preparation, can solve the problems of mechanical properties decline of composite materials, inability to meet requirements, etc., and achieve peel strength and heat resistance. The effect of good performance and efficient thermal conduction path

Active Publication Date: 2021-02-19
SUN YAT SEN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, there is a polymer barrier between low levels of thermally conductive fillers
Current research reports (Chen Y, Gao X, Wang J, et al. Properties and application of polyimide-based composites by blending surface functionalized boron nitride nanoplates [J]. Journal of Applied Polymer Science, 2015, 132 (16)), only when Only when the amount of thermally conductive filler added reaches more than 50%, can the thermal conductivity of the composite material be significantly improved, but correspondingly, the mechanical properties of the composite material will be greatly reduced.
Chinese patent application CN111253601A discloses a heat-conducting polyimide film. The fillers used are modified nano-boron nitride and modified nano-silicon dioxide. The content of the filler is 15 to 20 wt%, but the heat-conducting polyimide film Thermal conductivity≤0.95W·m -1 ·K -1 , cannot meet the demand

Method used

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  • Polyimide double-sided flexible heat-conducting copper-clad plate as well as preparation method and application thereof
  • Polyimide double-sided flexible heat-conducting copper-clad plate as well as preparation method and application thereof
  • Polyimide double-sided flexible heat-conducting copper-clad plate as well as preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0055] This example provides four kinds of polyimide composite films (h-BN@DMY-200°C / PI composite film) containing different contents of dihydromyricetin modified hexagonal boron nitride microsheets, and combined with pure polyimide Comparison of imide films to determine the optimal addition amount of dihydromyricetin-modified hexagonal boron nitride microsheets in polyimide double-sided flexible thermally conductive copper clad laminates.

[0056] The preparation method of polyimide composite film is as follows:

[0057] S1. Ultrasonic disperse 100 parts of hexagonal boron nitride (h-BN) in 1000 parts of dihydromyricetin-ethanol solution with a mass concentration of 50 mg / ml, stir and react at room temperature for 24 hours, filter, and vacuum dry at 70°C for 12 hours. Dihydromyricetin-modified hexagonal boron nitride microsheets (h-BN@DMY) were obtained, and h-BN@DMY was heat-treated at 200°C for 4 hours to obtain dihydromyricetin-modified hexagonal boron nitride microsheets ...

Embodiment 2

[0061] This embodiment provides a polyimide double-sided flexible heat-conducting copper-clad laminate. The preparation method of the polyimide double-sided flexible heat-conducting copper-clad laminate is as follows:

[0062] S1. Preparation of sodium cholate modified hexagonal boron nitride nanosheets (BNNS@SC):

[0063] Weigh 2 parts of hexagonal boron nitride powder and place it in a zirconia ball mill jar, add 10 parts of sodium cholate aqueous solution (0.1%) and 68 parts of zirconia balls, and ball mill for 12 hours at 200 rpm. Use sodium cholate-tert-butanol / water (0.1% sodium cholate, 60% tert-butanol) solution to wash out the powder after ball milling, put it in a beaker, ultrasonicate at 250W for 3h, and centrifuge the mixture at 3000rpm for 20min after ultrasonication, and take the upper layer The suspension was filtered, washed and dried to obtain BNNS@SC.

[0064] S2. Preparation of dihydromyricetin-modified hexagonal boron nitride microsheets (h-BN@DMY-200°C): ...

Embodiment 3

[0076] This embodiment provides a polyimide double-sided flexible heat-conducting copper-clad laminate. The difference between the preparation method of the polyimide double-sided flexible heat-conducting copper-clad laminate and Example 2 is that the pattern of the mask in step S3 is parallel Straight stripes, the stripe hollow width is 1mm, and the stripe interval is 9mm. After the mask is removed, the patterned copper foil Cu-P2 is obtained, such as figure 1 b.

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Abstract

The invention discloses a polyimide double-sided flexible heat-conducting copper-clad plate as well as a preparation method and an application thereof. The preparation method comprises the following steps: coating sodium cholate modified hexagonal boron nitride nanosheets and a thermoplastic polyimide adhesive on the surfaces of copper foils in a patterning manner, filling and coating a polyimideacid solution containing dihydromyricetin modified hexagonal boron nitride micron sheets to obtain single-sided polyimide copper foils, superposing the two single-sided polyimide copper foils to obtain the copper-clad laminate, and carrying out hot pressing and thermal imidization to obtain the polyimide double-sided flexible heat-conducting copper-clad plate. The polyimide double-sided flexible heat-conducting copper-clad plate prepared by the method has efficient out-of-plane and in-plane heat-conducting passages, and is good in peel strength and heat resistance.

Description

technical field [0001] The invention relates to the technical field of circuit boards, and more specifically, to a polyimide double-sided flexible heat-conducting copper-clad laminate and its preparation method and application. Background technique [0002] Polyimide can withstand high and low temperatures, has good dielectric properties and high mechanical strength, and is also resistant to hydrolysis, acid and alkali corrosion, and self-extinguishing. It is one of the good copper clad laminate substrates. Polyimide flexible copper clad laminate, which integrates the advantages of polyimide, is one of the most commonly used copper clad laminates in actual industrial production. It is often used in various electronic products, flexible and bendable equipment, and aerospace in the field. However, the thermal conductivity of pure polyimide is only about 0.2W·m -1 ·K -1 , It is often necessary to improve its thermal conductivity and heat dissipation by adding inorganic therm...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B15/01B32B15/20B32B33/00B32B37/06B32B37/10H05K1/02C09D179/08C09D7/62
CPCB32B15/01B32B15/20B32B33/00B32B37/06B32B37/10H05K1/0203C09D179/08C09D7/62C09D7/70B32B2255/06B32B2255/26B32B2307/302B32B2307/306B32B2457/08C08K2003/385C08K9/04C08K7/00C08K3/38
Inventor 容敏智肖华张泽平黄梓鑫章明秋
Owner SUN YAT SEN UNIV
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