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Electronic equipment

A technology of electronic equipment and electronic components, applied in the field of electronic equipment using heat pipes for heat dissipation, can solve the problems of increased heating power and power density of electronic equipment, structure and performance that cannot meet the heat dissipation requirements of thin electronic products, etc., to ensure heat transfer , Conducive to design and save volume

Inactive Publication Date: 2012-12-05
FU ZHUN PRECISION IND SHENZHEN +1
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AI Technical Summary

Problems solved by technology

[0003] However, the high-frequency and high-speed operation of electronic chips and the density and miniaturization of integrated circuits have led to a sharp increase in the heating power and power density of electronic equipment. Traditional heat dissipation methods cannot meet the heat dissipation requirements of thin electronic products in terms of structure and performance.

Method used

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Embodiment Construction

[0012] Please refer to figure 1 The electronic device 100 provided by the first embodiment of the present invention includes a casing 10, a heating electronic component 20 installed in the casing 10, and a flat plate installed in the casing 10 for dissipating the heat generated by the heating electronic component 20. The heat pipe 30 and the circuit board 40 carry the heat-generating electronic components 20 and provide power. The electronic device 100 may be a thin product such as a tablet computer, a smart phone, an all-in-one machine, a camera, etc. In this embodiment, the electronic device 100 is a tablet computer.

[0013] The casing 10 is the casing of the electronic device 100 and is used to protect the components inside the electronic device 100 , such as the circuit board 40 , the heating electronic components 20 and so on.

[0014] The heating electronic component 20 is a plate-shaped electronic component, such as a CPU of a tablet computer. The heating electronic ...

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Abstract

The invention provides electronic equipment comprising a shell, and an electronic heating element and a flat heat pipe installed in the shell, wherein the flat heat pipe comprises an evaporation part and a condensation part opposite to each other; the evaporation part is connected to the electronic heating element in an attaching manner; and the condensation part is connected to the shell in an attaching manner. The flat heat pipe is connected to the shell of the electronic equipment in an attaching manner directly, thus reducing the volume of the electronic equipment effectively at the same time of ensuring the heat transfer, and being beneficial to designing a thin structure of the electronic equipment.

Description

technical field [0001] The invention relates to an electronic device, in particular to an electronic device using a heat pipe to dissipate heat. Background technique [0002] At present, electronic products are increasingly becoming thinner, such as various thinner products, tablet computers, smart phones, all-in-one computers, and cameras. [0003] However, the high-frequency and high-speed operation of electronic chips and the density and miniaturization of integrated circuits have led to a sharp increase in the heating power and power density of electronic equipment. Traditional heat dissipation methods cannot meet the heat dissipation requirements of thin electronic products in terms of structure and performance. Therefore, the heat dissipation of electronic equipment has become a key technology affecting the development of thin electronic products. Contents of the invention [0004] In view of this, it is necessary to provide an electronic device with good heat dissi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/2099H01L2924/0002H04M1/0202H01L23/427G06F1/20H01L2924/00
Inventor 严清平王德玉胡江俊侯春树
Owner FU ZHUN PRECISION IND SHENZHEN
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