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Heat-conducting hot melt adhesive and preparation method thereof

A hot melt adhesive, particle size technology, applied in the direction of adhesives, adhesive additives, polymer adhesive additives, etc., can solve the problems of long operation time, limited protection ability, affecting production efficiency, etc., and achieve high-efficiency thermal conductivity, The effect of good refractive index and strong ability to absorb axial heat source

Inactive Publication Date: 2014-02-05
YANTAI DARBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Today's technological products are changing with each passing day, and their development is even more rapid. It is very important for the stability and life of electronic products. Therefore, almost all electronic products must protect their electronic components. Currently, the protection methods for electronic components are: , Conformal protection, that is, three anti-paint, its process is convenient and fast, simple and practical, but because the coated coating is thin, the protection ability is limited; potting protection, comprehensive and reliable, effective protection, but its long operation time is not conducive to Assembly line operation affects production efficiency; another is comprehensive injection protection, which is comprehensive, effective, convenient and quick

Method used

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  • Heat-conducting hot melt adhesive and preparation method thereof
  • Heat-conducting hot melt adhesive and preparation method thereof

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Effect test

Embodiment

[0019] First, heat the synthetic resin to generate a hot-melt adhesive resin; the preparation of the hot-melt adhesive resin is specifically: the synthetic resin is made by the high-temperature reaction of a diamine and a dibasic acid through a traditional process, and is heated to melt to synthesize a hot-melt adhesive resin , in the final stage of hot melt adhesive resin synthesis, the temperature is 240 ° C, and the following heat-conducting components are added while stirring: add silicon dioxide, titanium dioxide, zirconium silicate, boron nitride, and three Aluminum oxide, silicon carbide, dispersant, defoamer and anti-settling agent; after the feeding is completed, start the dispersion and stirring, and vacuumize, disperse for 2 hours, after the dispersion is uniform, the normal production of granulation and discharge, the finished product .

[0020] Table 1

[0021]

[0022]

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PUM

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Abstract

The invention relates to a heat-conducting hot melt adhesive, which comprises the following components by weight percent: 1%-20% of silicon dioxide, 1%-10% of titanium dioxide, 1%-20% of zirconium silicate, 1%-10% of boron nitride, 1%-10% of aluminum oxide, 1%-10% of silicon carbide. 0.5%-5% of dispersant, 0.5%-5% of anti-sedimentation agent, 0.5%-5% of defoamer and the balance of synthetic resin. According to the invention, elements having excellent refractive index, high axial heat source absorption capability and fine thermal conductivity such as aluminum, boron, titanium, silicon and zirconium are processed into oxides, nitrides and carbides, and the oxides, the nitrides and the carbides are ground into powdery particles within the range from 10 nm to 25 microns; next, the powdery particles are mixed with hot melt adhesive resin in a certain ratio to obtain the hot melt adhesive; and the obtained hot melt adhesive has efficiency heat conductivity and is capable of quickly transferring heat in three ways of conduction, convection and radiation.

Description

technical field [0001] The invention relates to a thermally conductive hot melt adhesive and a preparation method thereof, belonging to the field of hot melt adhesive preparation. Background technique [0002] Today's technological products are changing with each passing day, and their development is even more rapid. It is very important for the stability and life of electronic products. Therefore, almost all electronic products must protect their electronic components. Currently, the protection methods for electronic components are: , Conformal protection, that is, three anti-paint, its process is convenient and fast, simple and practical, but because the coated coating is thin, the protection ability is limited; potting protection, comprehensive and reliable, effective protection, but its long operation time is not conducive to Assembly line operation affects production efficiency; another is comprehensive injection protection, which is comprehensive, effective, convenient...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J177/06C09J9/00C09J11/04C09J11/08C09J11/06
Inventor 马其祥王建斌陈田安解海华
Owner YANTAI DARBOND TECH
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