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Diamond/graphene composite heat conduction film, preparation method thereof and heat dissipation system

A graphene composite, diamond thin film technology, applied in chemical instruments and methods, heat exchange materials, metal material coating processes, etc., can solve the problems of low binding force between graphene and diamond, complex preparation process, and high interface thermal resistance. , to achieve the effect of easy industrial production and use, excellent thermal conductivity structure, and excellent heat dissipation performance

Pending Publication Date: 2019-05-07
SHENZHEN INST OF ADVANCED TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, in this patent, the graphene based on the PMMA substrate is transferred to the diamond. The obtained graphene and diamond have low bonding force, poor interface bonding, high interface thermal resistance, and complicated preparation process.

Method used

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  • Diamond/graphene composite heat conduction film, preparation method thereof and heat dissipation system
  • Diamond/graphene composite heat conduction film, preparation method thereof and heat dissipation system
  • Diamond/graphene composite heat conduction film, preparation method thereof and heat dissipation system

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preparation example Construction

[0041] The second aspect of the embodiment of the present invention provides a method for preparing a diamond / graphene composite heat-conducting film, including:

[0042] S01, providing a substrate, depositing a microcrystalline diamond film on the surface of the substrate;

[0043] S02, removing the substrate by etching to obtain a self-supporting microcrystalline diamond film; wherein, the self-supporting microcrystalline diamond film includes a surface to be nucleated, and the surface to be nucleated is the microcrystalline diamond film before etching a contact surface with said substrate;

[0044] S03, depositing a transition metal layer on the surface to be nucleated, placing the self-supporting microcrystalline diamond film deposited with the transition metal layer in the cavity of a hot wire vapor deposition chamber for rapid annealing, the transition metal layer The transition metal catalyzes part of the carbon elements in the microcrystalline diamond film to form a g...

Embodiment 1

[0079] A kind of diamond / graphene composite heat conduction film and preparation method thereof, it comprises the steps:

[0080] (1) Depositing a highly thermally conductive microcrystalline diamond film on the surface of a silicon substrate:

[0081] Microcrystalline diamond thin film preparation method 1: a 1 mm thick diamond thin film layer is prepared on a single crystal (100) silicon wafer with a size of Φ200 mm by using the hot wire chemical vapor deposition (HFCVD) method. Place silicon wafers in NH before growth 4 OH / H 2 o 2 / deionized water (1:1:5) mixed solution, heated to 70 ° C for 1 hour, rinsed the silicon wafer, then put the silicon wafer in acetone solution for ultrasonic cleaning for 10 minutes, and deionized water for 10 minutes , ultrasonic cleaning in alcohol solution for 10 minutes. Subsequently, the cleaned silicon wafer was placed in the suspension of nano-diamond powder for ultrasonic treatment for 1 hour. The average particle size of the diamond...

Embodiment 2

[0087] A kind of diamond / graphene composite heat conduction film and preparation method thereof, it comprises the steps:

[0088] Step (1) is with embodiment 1;

[0089] (2) Preparation of graphene layer on the surface of microcrystalline diamond film:

[0090] (a) Put the diamond / silicon sample into a mixed solution of hydrofluoric acid / sulfuric acid / glacial acetic acid at a ratio of 1:1:2 to corrode the silicon substrate (or put it into a 30% (w / v) KOH solution, heat to 85°C for silicon etching), and the etching time is 5-24 hours. Then the obtained self-supporting diamond film was washed and dried. The smooth diamond surface obtained after etching the silicon substrate is called the diamond film nucleation surface. Using the bottom surface of diamond as the deposition surface of high-purity nickel metal, put the self-supporting diamond film into the electron beam deposition equipment, turn on the equipment until the background vacuum reaches 10 -8 Torr, turn on the elec...

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Abstract

The invention provides a diamond / graphene composite heat conduction film. The diamond / graphene composite heat conduction film comprises a micro-grain diamond thin film and a graphene layer arranged onthe surface of the micron-grain diamond thin film. The diamond and the graphene in the diamond / graphene composite heat conduction film form an excellent heat conduction structure, and the obtained composite heat conduction film has efficient heat conduction performance. The invention further provides a preparation method of the diamond / graphene composite heat conduction film. The preparation method comprises the following steps that a substrate is provided, and the micron-grain diamond thin film is deposited on the surface of the substrate; the substrate is corroded and removed, and the self-supported micron-grain diamond thin film is obtained; the self-supported micron-grain diamond thin film comprises a to-be-nucleated surface; and a transition metal layer is deposited on the to-be-nucleated surface, the self-supported micron-grain diamond thin film with the transition metal layer deposited is placed in a hot-filament vapor deposition chamber cavity for rapid annealing treatment toobtain the diamond / graphene composite heat conduction film, wherein the annealing temperature is 800-1100 DEG C, and the annealing time is 1-5 min. The invention further provides a heat dissipation system.

Description

technical field [0001] The invention relates to the field of thermally conductive materials, in particular to a diamond / graphene composite thermally conductive film, a preparation method thereof, and a heat dissipation system. Background technique [0002] At present, diamond heat sinks and graphene-based composite materials have been used in the thermal management of high-end high-power devices. advantage has become a research hotspot. For example, the invention patent CN201510406256.7 discloses "a method for preparing an ultra-high directional thermal conductivity carbon-based composite material". The surface of natural or synthetic diamond is precisely polished and cleaned to achieve atomic level flatness; Graphene based on methyl acrylate (PMMA) substrate is directly spread on the diamond surface to obtain a highly directional thermal conductivity composite material. However, in this patent, the graphene based on the PMMA substrate is transferred to the diamond. The ob...

Claims

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Application Information

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IPC IPC(8): C23C16/01C23C16/27C23C16/56C09K5/14
Inventor 杨扬唐永炳谷继腾
Owner SHENZHEN INST OF ADVANCED TECH
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