Semiconductor laser heat sink

Abstract

The invention discloses a semiconductor laser heat sink. The semiconductor laser heat sink has the characteristics of excellent heat-dissipation performance, difficult oxidation, long service life and stable heat dissipation. The semiconductor laser heat sink adopts a chemical vapor deposition (CVD) method to prepare a graphene thin-film layer with high thermal conductivity and low thermal expansion coefficient on the surface of a copper heat sink so as to realize coating of the copper heat sink. The semiconductor laser heat sink utilizes stable performance and high-efficiency heat-conducting performance of graphene materials to realize high-efficiency fast transmission of heat generated by a semiconductor laser chip to copper heat sink, and the heat transmitted from the graphene thin-film layer is dissipated into air or other cooling mediums by the copper heat sink. According to the semiconductor laser heat sink disclosed by the invention, the preparation process is simple, the cost is low, the heat dissipation performance is stable, the service life is long, the heat dissipation problem of the semiconductor laser can be effectively solved and the performance of a semiconductor laser device can be improved.

Description

technical field [0001] The present invention relates to the field of semiconductor lasers, in particular to a heat sink for semiconductor lasers. The semiconductor laser heat sink utilizes the stability and high-efficiency thermal conductivity of graphene materials, and combines traditional copper (Cu) heat sinks to form graphene- Cu heat sink. Background technique [0002] High-brightness and high-power semiconductor lasers are ideal pump sources for solid-state lasers and fiber lasers, and are widely used in material processing, free space communication, medical treatment and other fields. With the wide application of high-power semiconductor lasers, reliability has become an important factor limiting their application. In semiconductor lasers, as the output power increases, the requirements for the heat dissipation capability of the laser are also getting higher and higher. When the temperature rises, the device will have mode competition. At the same time, the spectral ...

AI Technical Summary

Problems solved by technology

The linear thermal expansion coefficient of the heat sink material of the semiconductor laser has a better match with the linear thermal expansion coefficient of the semiconductor chip material. If the heat generated by the semiconductor laser cannot be taken away in time, the temperature of the entire laser will rise, the expansion coefficient will be different, and the thermal deformation will increase. Different, the smile effect occurs when the stress is generated between the epitaxial material and the heat sink material, thereby straining the laser chip and deteriorating the photoelectric characteristics of the laser; if the stress is too large, the laser chip may even break, causing the laser to suddenly fail

At present, passive heat sinks and active heat sinks usually use metal copper as the heat sink material. The thermal expansion coefficient of the copper material and the semiconductor laser chip material is very different. Stress, which will greatly reduce the life of the semiconductor laser array chip, and will also cause irregular changes in the directivity of the output beams of each light-emitting unit of the semiconductor laser array, thereby reducing the beam quality of the output laser of the semiconductor laser array

Micro-channel heat sink has good heat dissipation capability, but its internal channel structure is complex, and the channel width is about 0.2mm. It is usually made of multi-layer grooved oxygen-free copper plate through brazing or thermal diffusion welding, the yield is low, the price is expensive, and The channel of the copper material is easily corroded by water, and the copper material is easily oxidized at high temperature, resulting in a short service life

Images