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Gradient-boron-doped diamond strengthened metal matrix composite and preparation method and application thereof

A technology of diamond reinforced and composite materials, applied in the field of thermal management composite material preparation, can solve the problems of low thermal conductivity, affecting the thermal conductivity of composite materials, etc., so as to improve thermal conductivity, maintain thermal conductivity, and improve wettability. Effect

Active Publication Date: 2020-10-16
CENT SOUTH UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the thermal conductivity of the formed carbide transition layer is often low, which also seriously affects the thermal conductivity of the composite material.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0068] Example 1. Boron-doped diamond-reinforced copper-based composite material (reinforcement body configuration is a three-dimensional network configuration)

[0069] (1) Substrate pretreatment: In this example, the three-dimensional network configuration uses foamed copper with a pore size of 0.25mm, a diameter of 12.3mm, and a thickness of 2.0mm as the substrate. Firstly, according to step (2), the copper foil substrate of the three-dimensional network configuration is cleaned, and then according to step (2), a chromium film with a thickness of 50 nm is deposited on the surface of the copper skeleton of the three-dimensional network configuration by magnetron sputtering as an intermediate transition Floor.

[0070] (2) Mix the nanocrystals and the metal skeleton substrate in (1) in a beaker, heat to boiling, and then vibrate in a high-power ultrasonic wave. After the dispersion is uniform, take out the three-dimensional continuous network skeleton substrate and dry it to ...

Embodiment 2

[0076] Embodiment 2. Boron-doped diamond-reinforced copper-based composite material (reinforcement body configuration is the coupling of three-dimensional network configuration and zero-dimensional particle configuration)

[0077] (1) Substrate pretreatment: In this example, the three-dimensional network configuration uses copper foam with a pore size of 0.25 mm, a diameter of 12.3 mm, and a thickness of 2.0 mm as the substrate, and natural diamond particles with an average size of 50 μm in the zero-dimensional particle configuration . First, clean the three-dimensional network substrate of metal copper skeleton according to step (2), and then use magnetron sputtering technology to deposit a chromium film with a thickness of 50nm on the surface of the foam copper three-dimensional network skeleton as an intermediate transition layer according to step (2).

[0078] (2) Mix the nanocrystalline grains and the three-dimensional metal skeleton substrate in (1) in a beaker, heat to ...

Embodiment 3

[0085] Example 3 Boron-doped diamond-reinforced aluminum matrix composite (the metal matrix is ​​an aluminum-titanium alloy, and the reinforcement configuration is the coupling of a three-dimensional network configuration and a zero-dimensional particle configuration)

[0086] (1) Substrate pretreatment: In this example, copper foam with a pore size of 0.25 mm, a diameter of 12.3 mm, and a thickness of 2.0 mm is used as the substrate. First, the copper foam three-dimensional network substrate is cleaned according to step (2), and then According to step (2), a chromium film with a thickness of 50 nm is deposited on the surface of the copper foam three-dimensional network skeleton as an intermediate transition layer by using magnetron sputtering technology.

[0087] (2) Mix the nanocrystalline diamond particles and the three-dimensional continuous network framework substrate in (1) in a beaker, heat to boiling, then vibrate in a high-power ultrasonic wave, and after the dispersio...

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Abstract

The invention discloses a gradient-boron-doped diamond strengthened metal matrix composite and a preparation method and application thereof. The composite includes gradient-boron-doped diamond strengthened bodies, and metal matrices, and the gradient-boron-doped diamond strengthened bodies include diamond strengthened bodies, and gradient-boron-doped diamond modified layers arranged on the surfaces of the diamond strengthened bodies. The configuration of the diamond strengthened bodies include one or more of a zero-dimensional particle configuration, a one-dimensional linear configuration, a two-dimensional piece-shaped configuration, and a three-dimensional continuous network skeleton configuration. The coupling of the gradient-boron-doped diamond strengthened bodies with different dimensions can greatly improve the mass of diamonds on the composite, and improve the heat conductivity. In addition, according to the added gradient-boron-doped diamond strengthened bodies, the gradient-boron-doped diamond modified layers account for less, so that the heat conductivity of the diamonds can not be affected, and the humidity between the diamonds and metal can be greatly improved.

Description

technical field [0001] The invention relates to a gradient boron-doped diamond-reinforced metal matrix composite material and its preparation method and application, belonging to the technical field of thermal management composite material preparation. Background technique [0002] With the development of information technology and the advent of the 5G era, the pace of the Internet of Everything is accelerating, and electronic products are gradually developing in the direction of intelligence, multi-function, and thinness. In the process of increasing the performance of electronic products, the volume of integrated circuit chips and electronic components is continuously shrinking, and the continuous improvement of high-density integrated assembly technology has led to a sharp increase in power consumption and heat generation. Therefore, people's heat dissipation requirements for thermal management materials are getting higher and higher come higher. In addition, the rapid d...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C28/00C23C26/00C23C16/27C23C16/56B22D23/04C22C26/00C23C14/35C23C14/16H01L23/373
CPCC23C28/322C23C28/34C23C26/00C23C16/27C23C16/278C23C16/56B22D23/04C22C26/00C23C16/271C23C14/35C23C14/165H01L23/3732H01L23/3735
Inventor 魏秋平马莉周科朝康翱龙
Owner CENT SOUTH UNIV
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