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Teflon-based polyphenylene sulfide-doped heat radiation material for LED light source and preparation method thereof

A polytetrafluoroethylene, LED light source technology, applied in the field of LED heat dissipation materials, can solve the problems of difficult cutting and molding, easy environmental corrosion, low power consumption, etc., to achieve outstanding radiation resistance and thermal conductivity, and environmental corrosion resistance. , The effect of easy machining and cutting

Inactive Publication Date: 2015-08-12
明光泰源安防科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] LED is the abbreviation of light-emitting diode. It is a semiconductor electronic component that converts electrical energy into light energy. It has the advantages of small size, long life, low power consumption, fast response, high luminous efficiency, energy saving and environmental protection. It is recognized in the industry As the most competitive product to replace traditional light sources, it has also been widely used in real life. There are still many problems in current LED products, among which heat dissipation has always been the top priority. Common heat dissipation materials are mostly high thermal conductivity metals. , high thermal conductivity inorganic materials, and these materials are compounded and sintered. These materials have disadvantages such as difficult cutting and forming, high cost, and easy to be corroded by the environment. Excellent heat dissipation effect, and can improve the environmental adaptability of the material to achieve efficient and stable performance

Method used

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Embodiment

[0012] The heat dissipation material of this embodiment is made of the following raw materials in parts by weight: 300-mesh tin bronze powder 4, nano-nickel powder 3, silica sol with a solid content of 25% 5, polyphenylene sulfide 6, aluminum dihydrogen phosphate 3, sodium silicate 2. 5% ethanol aqueous solution 40, 400 mesh aluminum nitride fine powder 22, 300 mesh polytetrafluoroethylene fine powder 50, additive 3.

[0013] The auxiliary agent is made of the following raw materials in parts by weight: silane coupling agent kh550 8, potassium methyl silicate 1, titanium acetylacetonate (25% isopropanol aqueous solution) 2, nano silicon dioxide 4, sodium hydroxide 0.2, water 25, the preparation method is: first dissolve sodium hydroxide in an appropriate amount of water to prepare a solution with a pH value of 10.5, then add nano-silica, soak in ultrasonic for 50 minutes, and wash the powder after alkali treatment until neutral After drying, add water to prepare a sol, then mi...

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Abstract

The invention relates to a LED heat radiation material and especially relates to a Teflon-based polyphenylene sulfide-doped heat radiation material for a LED light source and a preparation method thereof. The Teflon-based polyphenylene sulfide-doped heat radiation material is prepared from 3-5 parts by weight of tin bronze micro-powder of 150-300 meshes, 2-3 parts by weight of nanometer nickel powder, 4-5 parts by weight of silica sol with solid content of 20-25%, 5-8 parts by weight of polyphenylene sulfide, 2-3 parts by weight of aluminum dihydrogen phosphate, 1-3 parts by weight of sodium silicate, 30-40 parts by weight of an ethanol aqueous solution with content of 5%, 20-25 parts by weight of aluminum nitride micro-powder of 400-600 meshes, 40-50 parts by weight of Teflon micro-powder of 200-300 meshes and 2-3 parts by weight of an assistant. The LED heat radiation material has the advantages of high efficiency, uniform and stable thermal conductivity, environment corrosion resistance, light aging resistance, cleanliness, stain resistance, safety, insulation and cutting easiness and is an ideal LED lamp heat radiation material.

Description

technical field [0001] The invention relates to an LED heat dissipation material, in particular to a polytetrafluoroethylene base-doped polyphenylene sulfide heat dissipation material for an LED light source and a preparation method thereof. Background technique [0002] LED is the abbreviation of light-emitting diode. It is a semiconductor electronic component that converts electrical energy into light energy. It has the advantages of small size, long life, low power consumption, fast response, high luminous efficiency, energy saving and environmental protection. It is recognized in the industry As the most competitive product to replace traditional light sources, it has also been widely used in real life. There are still many problems in current LED products, among which heat dissipation has always been the top priority. Common heat dissipation materials are mostly high thermal conductivity metals. , high thermal conductivity inorganic materials, and these materials are co...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L27/18C08L81/02C08K13/06C08K9/06C08K9/10C08K3/08C08K3/34C08K3/28C08K3/32C08K3/36
CPCC08L27/18C08K2201/011C08L2201/08
Inventor 张英才刘德时
Owner 明光泰源安防科技有限公司
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