The invention provides a preparation method of a
germanium and
tin nano material under normal pressure, and belongs to the technical field of
semiconductor nano materials. The preparation method comprises the following steps that S1, a
silicon wafer is taken, and a
metal catalyst is sprayed to the surface of the
silicon wafer to achieve treatment; and S2, the
silicon wafer treated in the step S1 is flatly placed at one end in a round-bottom porcelain boat, the face, with the
metal catalyst sprayed, of the silicon wafer is upward,
germanium powder and
tin powder with the
mass ratio being (20-10):1 are put at the other end in the round-bottom porcelain boat, the round-bottom porcelain boat is placed in a heating cavity of a
tube furnace,
inert gas is continuously introduced into the end withthe
germanium powder and the
tin powder with the gas flow being 200 sc.cm, after the temperature of the
tube furnace is increased to 800-850 DEG C from the
room temperature with the rate of 5 DEG C / min, heat preservation is carried out for 50 min to 110 min, then the temperature is reduced to the
room temperature with the rate of 5 DEG C / min, and the germanium and tin nano material is obtained onthe surface of the silicon wafer. By means of the preparation method, the germanium and tin nano material can be rapidly and directly prepared, no
waste gas treatment is needed in the whole preparation process,
continuous production can be achieved, equipment is simple, and operation is easy.