The invention discloses the technical field of
chip cutting protection films, and particularly relates to an antistatic
semiconductor chip cutting protection film. The protection film comprises an antistatic release
coating, a PVC blue film, a blue film protection base
coating and an antistatic
acrylic adhesive layer, and has the advantages of good flexibility, high
temperature resistance, easiness in
wafer expansion and
wafer cutting, and capability of eliminating
static electricity generated by friction in
wafer expansion and cutting; the arrangement of the blue film protection prime coat can prevent a
plasticizer in the PVC blue film from being separated out and permeating into the
adhesive layer to a certain extent, the high
temperature resistance and
solvent resistance of the PVC blue film are improved, the PVC blue film is not prone to shrinkage, and the antistatic
acrylic adhesive layer is stable in peel strength, resistant to high temperature of 180 DEG C and antistatic. And the PVC blue film can be used for striking and effectively identifying the protective film, so the use is convenient. The
total thickness of the protective film is 80 + / -2 [mu]m, the peel strength is 100 + / -20 gf / inch, no
adhesive is left, the antistatic resistance value is 106-109
omega, and the release force is 20 gf / inch.