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Cover film and electronic component package using same

A technology of covering film and heat-sealing layer, which is applied in packaging, wrapping paper, transportation and packaging, etc. It can solve the problems of insufficient stability of peel strength and achieve the effect of excellent transparency and not easy to break the film

Active Publication Date: 2020-07-24
DENKA CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this method has insufficient stability of peel strength after heat sealing

Method used

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  • Cover film and electronic component package using same
  • Cover film and electronic component package using same
  • Cover film and electronic component package using same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0117] Using a rotating drum, the styrene-butadiene-styrene triblock copolymer hydrogenated resin (manufactured by Asahi Kasei Chemical Co., Ltd., "Tuftec H1041", olefin component) as the resin constituting the sealant layer (heat seal layer) Amount 70% by mass) 50% by mass and a hydrogenated resin of a triblock copolymer of styrene-butadiene-styrene (manufactured by Asahi Kasei Chemical Co., Ltd., "Tuftec H1043", olefin content 33% by mass) 30% by mass and Potassium ion polymer (manufactured by Mitsui DuPont Co., Ltd., "MK440") 20% by mass was pre-blended, and kneaded at 200°C using a single-screw extruder with a diameter of 40 mm, and obtained at a linear speed of 20 m per minute The resin composition constituting the sealant layer. The resin composition and the metallocene-based linear low-density polyethylene (Ube Maruzen Polyethylene Co., Ltd.) as the olefin-based resin constituting (C) the intermediate layer described in Tables 1 and 2 were extruded from respective uniaxi...

Embodiment 2～11、 Embodiment 13～24、 Embodiment 26～40

[0118] (Examples 2-11, Examples 13-24, Examples 26-40, Comparative Examples 1-22)

[0119] Except for forming the adhesive layer and the heat-sealing layer using raw materials such as resins described in Tables 1 to 5, the same procedure as in Example 1 was carried out to produce a cover film.

Embodiment 12

[0121] By using the laminated film obtained in Example 4, after corona treatment is performed on the surface of the (D) heat-seal layer, it is coated with 20% by mass of styrene-methacrylic acid so that the thickness after drying becomes 0.3 μm. The random copolymer of butyl ester [(e-1) resin] contains 80% by mass of a solution of [(e-2) conductive filler] to obtain a cover film for carrier tape having conductive properties.

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Abstract

The present invention provides a cover film which is stable in peel strength continuously within a predetermined value range when the cover film is peeled off, excellent in transparency, and less prone to "film breakage" during high-speed peeling. To provide a cover film comprising at least (A) a substrate layer and (B) an adhesive layer, (C) an intermediate layer and (D) a heat-sealing layer having a heat-sealable resin, (B) a The main agent is polyester resin, 50% by mass or more of the curing agent is isophorone diisocyanate, and (D) the heat sealing layer contains: 50-90% by mass of (d-1) olefin-based resin and 10-40% by mass % (d-2) a potassium ion polymer with antistatic properties, the (d-1) olefin-based resin comprises: an olefin-styrene block copolymer containing 58-82 mass % of an olefin component and an olefin-styrene block copolymer containing 75- Any one or more of ethylene-vinyl acetate copolymers containing 88% by mass of olefin content.

Description

Technical field [0001] The present invention relates to a cover film for an electronic component package and an electronic component package using the cover film. Background technique [0002] With the miniaturization of electronic equipment, the miniaturization and high performance of the electronic components used are also developing. At the same time, in the assembly process of electronic equipment, electronic components are automatically mounted on printed circuit boards. The electronic component for surface mounting is accommodated in a carrier tape in which a pocket formed by embossing that can accommodate the shape of the electronic component is formed along with it. After accommodating the electronic components, a cover film is superimposed on the upper surface of the carrier tape as a cover material, and both ends of the cover film are continuously heat-sealed in the longitudinal direction with a heated seal bar to form a package. As the cover film material, a product ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B27/36B32B27/34B32B7/12B32B7/023B32B27/32B32B27/20B32B27/30B32B33/00B65D65/40B65D73/02B32B7/02
CPCB32B7/02B32B7/12B32B27/00B32B27/18B32B27/28B32B27/32B65D65/40B65D73/02C09J167/00B32B27/308B32B2307/21B32B2264/105B32B2307/31
Inventor 佐佐木彰岩崎贵之阿津坂高范弘冈忠昭坂本繁
Owner DENKA CO LTD
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