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Preparation method for ultrathin copper foil Ni-Cr-B-P stripping layer

A technology of ultra-thin copper foil and peeling layer, which is applied in the direction of coating, metal material coating process, liquid chemical plating, etc., can solve the problem of difficulty in achieving the anti-peeling strength of ultra-thin copper foil, increased economic cost, and complicated process and other problems, to achieve the effect of firm joint, stable anti-peeling strength and uniform texture

Active Publication Date: 2017-12-15
ANQING NORMAL UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The designed process is too complicated and the control conditions are too strict, which brings additional processing steps, which increases the economic cost; or it is difficult to achieve the stability of the anti-peeling strength of the ultra-thin copper foil within the required range

Method used

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  • Preparation method for ultrathin copper foil Ni-Cr-B-P stripping layer
  • Preparation method for ultrathin copper foil Ni-Cr-B-P stripping layer

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Embodiment Construction

[0025] The present invention will be further described below in combination with specific embodiments.

[0026] The carrier foil is subjected to alkaline degreasing, pickling, ultrasonic washing, drying, put into the plating tank, and a certain amount of sodium hypophosphite (NaH 2 PO 2 ·H 2 O) (mass concentration 40g / L), sodium fluoride (mass concentration 3.5g / L), mercaptobenzothiazole sodium (mass concentration 0.5g / L) and citric acid (mass concentration 12g / L) were dissolved and mixed with distilled water respectively , add nickel sulfate NiSO 4 ·6H 2 O (mass concentration 13g / L), CrCl 3 ·6H 2 O (mass concentration 20g / L), adjust the pH value to 4.5 with 10% NaOH solution, dilute to the specified volume with water, and finally get 200mL mixed solution, mix 54g / L KBH 4 100mL of the solution was evenly dropped into the mixed solution within 15 minutes as an electroless plating solution, and the plating was carried out for 25 minutes. After the plated parts were washed ...

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Abstract

The invention discloses a preparation method for an ultrathin copper foil Ni-Cr-B-P stripping layer. The preparation method comprises the following steps that a certain amount of sodium hypophosphite (NaH2PO2.H2O), sodium fluoride, sodium 2-mercaptobenzothiazole and citric acid are dissolved and mixed through distilled water; nickel sulfate NiSO4.6H2O and chromium chloride CrCl3.6H2O are added in sequence under a certain temperature and the stirring effect; the pH value is adjusted to the specified value through a 10% of NaOH solution, and dilution is conducted through water to be the specified volume; a certain concentration of KBH4 is uniformly dripped into a mixture solution to serve as a chemical plating solution; and carrier foil is chemically plated for a certain period, and after a plated part is washed through distilled water and anhydrous ethanol, the ultrathin copper foil Ni-Cr-B-P stripping layer is obtained. The stripping layer obtained through the preparation method presents a uniform single amorphous structure and has good thermal stability after hot press processing, the stripping resistance strength of the stripping layer is more stable, the process is simple, the industrialization cost is low, and the new preparation method for the ultrathin copper foil stripping layer has development prospects.

Description

technical field [0001] The invention belongs to the technical field of hydrometallurgy, in particular to a method for preparing an ultra-thin copper foil peeling layer Ni-Cr-B-P. Background technique [0002] The peeling layer is the key to the preparation of carrier-supported ultra-thin copper foil, which has a significant impact on the peel strength of carrier-supported ultra-thin copper foil. The earliest carrier-supported ultra-thin copper foil was not prepared with copper foil as the carrier foil, but with other metal foils as the carrier foil, so there was no peeling layer at the beginning. Later, in order to reduce the pinholes of ultra-thin copper foil and the cycle of the process, copper foil was gradually adopted as the carrier foil, and the peeling layer was introduced in order to obtain stable anti-peeling strength. [0003] The peeling layer used today can be divided into four categories according to the formation process and composition: a single organic peeli...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/50C25D3/56
CPCC23C18/50C25D3/562
Inventor 杜荣斌周峰刘涛夏宏宇王伟
Owner ANQING NORMAL UNIV
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