32results about How to "Improve thermal cycle life" patented technology

The invention discloses a pyrochlore structural rare-earth zirconate material system capable of being used for a heat barrier coating. The chemical composition of the material is (0.5-x)R'2O3-0.5Sm2O3-xR''2O3-2ZrO2, wherein x is more than 0 and less than or equal to 0.25; the R' is rare-earth elements or composition thereof, the ion radius of which is greater than that of Sm; and R'' is rare-earth elements or composition thereof, the ion radius of which is smaller than that of Sm. The material provided by the invention has low thermal conductivity, high thermal stability and high-temperature sintering resistance; the thermal expansion performance of the material is stable compared with a single pyrochlore structural material; and the material is favorable for reducing thermal stress generated by mismatching of thermal expansion coefficients in the thermal cycle process, and can prolong the thermal cycle life of the coating. Because of good high-temperature phase stability, the pyrochlore structural rare-earth zirconate material can be used for designing and preparing a novel high-temperature heat barrier coating material, the use temperature of which is below 1,550 DEG C.

The invention relates to a series of ceramic materials used as high temperature thermal barrier coating materials and their use, wherein the chemical constitution of the ceramic material being A2ZrxCe(1-x)2O7, wherein 0<=x<=0.9, an is one or combination of two of Nd, Sm, Eu, Gd and Tb. The ceramic material has high coefficient of thermal expansion, thus can be designed into thermal barrier coating material, whose application temperature interval is between room temperature to 1400 deg. C.

The invention discloses a preparation method of a CMAS corrosion-resistance micronanometer composite thermal barrier coating layer. The thermal barrier coating layer includes a bonding layer prepared on an alloy basal body, a first ceramic layer and a second ceramic layer; the first ceramic layer is a yttrium oxide part stable zirconium oxide coating layer, can be prepared by atmosphere plasma spraying, an electronic beam physical vapor deposition method or a plasma evaporation deposition method, and has a thickness of 50-200 microns; and the second ceramic layer is a CMAS-resistance coating layer prepared by a plasma evaporation deposition system, and has a thickness of 1-100 microns. At high temperature, molten CMAS is not wet on the surface of the prepared second ceramic layer. The prepared multi-layer thermal barrier coating layer system including the bonding layer, the first ceramic layer and the CMAS-resistance second ceramic layer can effectively stop permeation of molten CMAS, and is excellent in molten CMAS corrosion resistance.

The present invention provides a 3D printing packaging method of a flip chip. The method is characterized by comprising the following steps of S1 utilizing a computer to design a three-dimensional digital model of an LED device, programming the LED device, after the hierarchical slicing processing, introducing a 3D printer, and utilizing the computer to control the hierarchical printing; S2 utilizing a suction nozzle to absorb the flip chip, and fixing under a reflector cup; S3 carrying out the 3D printing on a solder layer and a radiating substrate, wherein the radiating substrate is equipped with a leading-out circuit in electrode connection with the chip, and further can comprises a step S4 of filling the fluorescent powder. Relative to the general packaging, according to the present invention, the die bonding wires and the eutectic solders are not needed, the packaging yield is improved, a support and a PCB or a COB do not need to purchase, the packaging cost is reduced, the packaging research and development cycle is shortened, and the packaging appearance diversity is increased, and the LED thinning and miniaturization are promoted.

The invention discloses a low-temperature lead-free solder paste and a preparation method thereof. The low-temperature lead-free solder paste is composed of the following raw materials in mass percent: low-temperature tin-bismuth-silver-copper quaternary lead-free solder powder 86% to 91%; flux 9 %~14%; wherein, the low-temperature tin-bismuth-silver-copper quaternary lead-free solder powder is composed of four elements: tin-bismuth-silver-copper, wherein the mass percentage of bismuth is 46-52%, and the mass percentage of copper 0.3-1.2%, the mass percentage composition of silver is 0.4-1.2%, and the mass percentage composition of tin is 45.6-53.3%; Adopt the solder paste that the present invention makes, its bismuth content is relatively high but the range is reasonable, can The solidus temperature of the product is increased from 138°C to 151°C, which is suitable for low-temperature packaging technology, and the peak soldering temperature does not exceed 200°C. Compared with the Sn42Bi58 alloy, this product has better tensile strength, shear strength, drop resistance and thermal cycle Life expectancy has been greatly improved.

The application provides a particle used for a thermal barrier coating, a preparation method thereof, a thermal barrier coating and an engine, and relates to the field of new materials. Particles used for thermal barrier coatings, including shells and cores; the porosity of the surface of the shells is less than or equal to 5%; the cores have first closed cells with a pore size of 1-5 μm, and the first closed cells There are first skeleton microparticles in between, and the particle diameter of the first skeleton microparticles is 0.1-2 μm. Thermal barrier coatings, obtained by plasma jet deposition using particulate matter for thermal barrier coatings. Engines, including thermal barrier coatings. The particles used in the thermal barrier coating and the thermal barrier coating provided by the present application have good performance of high temperature thermal cycle resistance.

The invention discloses a thermal barrier coating layer with a particle scouring resistant surface layer and a preparation method thereof. The thermal barrier coating layer is a ceramic layer with a feather structure and arranged on a basal body by adopting a plasma spraying-physical vapor deposition process; the upper end part of the ceramic layer is a high-cohesion-strength surface layer; the part, below the high-cohesion-strength surface layer, of the ceramic layer is in no-interface connection with the high-cohesion-strength surface layer; and the high-cohesion-strength surface layer has the same material components, object phases and macroscopic feather structures with the ceramic layer below the surface layer. The thermal barrier coating layer is simple in process, low in cost and high in coating bonding strength; and the prepared thermal barrier coating layer with the high-cohesion-strength surface layer can greatly improve the particle scouring resistance, and is long in service life.