Anti-CMAS-corrosion ultrahigh-temperature-resistant long-service-life thermal barrier coating and preparation method thereof
A thermal barrier coating and long-life technology, applied in the coating, metal material coating process, superimposed layer plating, etc., can solve the problems of YSZ coating corrosion, short thermal cycle life of thermal barrier coating, etc., to achieve Ease of preparation, improved CMAS corrosion resistance, and improved thermal shock life
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
preparation example Construction
[0041] The invention provides a method for preparing a long-life thermal barrier coating resistant to CMAS corrosion and ultra-high temperature, comprising the following steps:
[0042] Step 1, substrate preparation and pretreatment
[0043] Select the high-temperature alloy with the grade of IN600, K3 or DD6 as the substrate, polish the substrate with 200#, 400#, 600#, and 800# sandpaper in sequence, put the polished substrate into the acetone solution, clean it with ultrasonic waves, and then dry it. Sandblast the substrate to make its surface roughness Ra>15.
[0044] Step 2, prepare the MCrAlX bonding layer on the surface of the substrate
[0045] A) Preparation of MCrAlX bonding layer by electron beam physical vapor deposition
[0046] a) Prepare the target for the bonding layer
[0047] The material of the bonding layer is MCrAlX alloy, M is Ni, Co or a combination of the two, X is one of Y, Hf, Si, Pt or a combination of both, and the bonding layer is weighed in prop...
Embodiment 1
[0069] When the thermal barrier coating TC2(La 0.99 sc 0.01 ) 2 Zr 2 o 7 For / TC1 YSZ / BC, the specific steps are as follows:
[0070] Step 1: Substrate preparation and pretreatment
[0071] Choose IN600 nickel-based superalloy as the substrate, polish the substrate with 200#, 400#, 600#, and 800# sandpaper in sequence, put the polished substrate in acetone, clean it with ultrasonic waves, dry it, and then sandblast the substrate Treatment to make the surface roughness Ra>15. Step 2: Deposit a bonding layer on the surface of the substrate
[0072] 1) Prepare the target for the bonding layer
[0073]The material of the bonding layer is a NiCoCrAlY alloy, and the composition (percentage by weight) is 54.2% Ni, 18.2% Co, 19.6% Cr, 7.0% Al, 1.0% Y, and the bond is weighed according to the proportion The components of the alloy in the material of the layer are smelted at 1600°C to obtain the target material of the bonding layer.
[0074] 2) Deposition of the bonding layer ...
Embodiment 2
[0086] When the thermal barrier coating TC2(Nd 0.5 sc 0.5 ) 2 Zr 2 o 7 When / TC1 YSZ / BC, specifically include the following
[0087] Step 1: Substrate preparation and pretreatment
[0088] Select K3 high-temperature alloy as the substrate, polish the substrate with 200#, 400#, 600#, and 800# sandpaper in sequence, put the polished substrate in acetone, clean it with ultrasonic waves and dry it, and then sandblast the substrate. Make its surface roughness Ra>15. Step 2: Deposit a bonding layer on the surface of the substrate
[0089] 1) Prepare the target for the bonding layer
[0090] The material of the bonding layer is CoCrAlY alloy, and its composition (weight percentage) is 67.4% Co, 22% Cr, 8.6% Al, and 2.0% Y. The components of the alloy in the material of the bonding layer are weighed according to the proportion, and the target material of the bonding layer obtained is melted at 1600°C.
[0091] 2) Deposition of the bonding layer
[0092] The main process para...
PUM
Property | Measurement | Unit |
---|---|---|
thickness | aaaaa | aaaaa |
thickness | aaaaa | aaaaa |
thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com