196 results about "Thermal solution" patented technology

A method and corresponding software for automatically validating a computer platform thermal solution. An application program is employed to selectively execute thermal stress code to cause the platform's processor to dissipate an amount of power corresponding to a predetermined value, such as a thermal design power dissipation value specified by the processor's manufacturer. In one embodiment, tests are performed while operating at this power dissipation level to determine if a thermal overload condition exists, which may be determined by the processor's temperature, an indication that the processor is throttled, or a signal provided by the processor indicating the processor has detected a thermal overload condition. In another embodiment, a thermal resistance value is calculated based on the processor power dissipation, the temperature of the processor, and the ambient temperature of the test environment. In one embodiment the entire validation process is automatically performed by the application program without requiring any extraneous test equipment or temperature probes.

The invention relates to a data center machine room cooling system featuring cool air distribution according to needs, comprising an air-conditioning unit and a heat dissipation air channel. Cold air provided by a refrigerating unit is distributed to equipment cabinets through an air inlet header pipe and an air inlet adapter pipe according to cold energy the equipment cabinets need and then is distributed to servers according to the cold energy the servers in the equipment cabinet need through a cold air distribution box, so as to carry out forced air cooling on heated components. The cooling system optimizes airflow movement and realizes air distribution according to needs, thus being an efficient and energy-saving data center machine room cooling system heat dissipation solution.

The invention relates to the technical field of mobile communication, and discloses a middle frame of a mobile terminal and the mobile terminal. The middle frame comprises a middle frame body, a heat radiation apparatus for radiating heat of devices is inlaid in the middle frame, and the thickness of the heat radiation apparatus is no greater than the thickness of the middle frame body. The heat radiation solution comprises two heat sinks oppositely arranged, and a capillary structure and a steam channel structure arranged between the heat sinks, and the capillary structure and the steam channel structure communicate with each other to form a gas-liquid loop. The capillary structure is filled with phase-changing working substances. The heat radiation apparatus for radiating heat of devices is inlaid in the middle frame, the heat radiation apparatus employs spliced heat sinks, and a capillary structure is formed between the two heat sinks. The thickness of the entire heat radiation apparatus is effectively reduced, and the thickness of the heat radiation apparatus is no greater than the thickness of the middle frame. Such a structure allows a mobile terminal to be designed thinner.

The invention relates to a plate heat pipe radiator, which comprises a sheet sealed case made from metallic sheet, whose inner chamber is vacuum and filled with liquid working substance which can be gasified when heated; the outer side of the bottom of case has a heat adsorption end face which is close to the surface of heating electric element to adsorb the heat; the chamber of case has a support element which is connected to the inner surface of said case to eliminate the case deformation caused by the pressure generated by the outer atmosphere pressure of the gasified liquid working substance. The invention via the heat pipe and strengthening the structure of sheet case, overcomes the defects of traditional aluminum alloy heat radiator on the miniaturization and high speed development.

A thermal solution for an electronic device, which is positioned between a heat source and an external surface of the electronic device and/or another component of the electronic device, where the thermal solution facilitates heat dissipation from the heat source while shielding the external surface and/or second component from the heat generated by the heat source.

A thermal solution for equipment containing a heat-generating component, which is positioned between the heat-generating component and an external surface of the equipment, where the thermal solution facilitates heat dissipation from the heat-generating component while shielding the external surface from the heat generated by the heat-generating component.

Present thermal solutions to conduct heat from pluggable optical modules into heat sinks use a metal heat sink attached with a spring clip. The interface between the pluggable module and the heat sink is simple metal-on-metal contact, which is inherently a poor thermal interface and limits heat dissipation from the optical module. Heat dissipation from pluggable optical modules is enhanced by the application of thermally conductive fibers, such as an advanced carbon nanotube velvet. The solution improves heat dissipation while preserving the removable nature of the optical modules.

This invention provides a method and apparatus for device designers to overcome such limitations by incorporating a dynamic fluid cooling system to transfer heat within the device amongst various subsystems and convect the heat externally, versus current static thermal solutions which conductively spread heat in a limited manner at significant cost. Specifically these dynamic fluid cooling methods and apparatus for electronic device enable increased performance and decreased cost across many of the device subsystems including but not limited to: electronics, integrated circuits, batteries, display panels, touch panels, lighting, audio transducers, imaging, flash LEDs and chargers.

A thermal management system (300) includes a first heat transfer body (330) for providing a opposing heat flux to at least one localized region of elevated heat flux residing in adjacency to a region of lesser flux, such as on a surface (315a) of a circuit die (315) due to a integrated circuit hot-spot (310). A contact (320, 321 962a, 962b, 970a, 970b or 950) defines a thermal conduction path for the opposing flux. A second heat transfer body (350) is in a heat transport relationship with the first heat transfer boy (330) and a second heat transport relationship with the region of lesser heat flux. In such arrangement, each region of heat flux is provided a thermal solution commensurate with the level of heat flux in the region. For example, the opposing heat flux of an active first heat transfer body (330), such as a thermoelectric cooler, may be provided at the hot-spot (310), while at the same time the lesser heat flux is absorbed by a passive second heat transfer body (350), such as a heat spreader.

An apparatus for removably retaining an IC package in engagement with a socket such that the contacts of both the IC package and the socket are properly engaged is disclosed. Specifically, a universal retention mechanism (URM) which may be fabricated in a diecast material, may comprise a retention frame to engage a socket. A load plate hinged to the retention frame may be caused to press the socket and IC package together through force selectively applied through the use of a load lever. In addition, the frame may contain features to attach a thermal solution (e.g. a heat sink or other cooling device) directly to the frame thus eliminating the need to attach it directly to a motherboard or through a backplate.

An improved capacitor packaging solution is presented that incorporates both thermal and electrical considerations. A package can include capacitor elements electrically coupled to a bus bar, and a thermally enhanced isolation layer between the bus bar and a case. The isolation layer can be provided adjacent a case base and sidewall portions. The bus bar can be disposed adjacent the isolation layer and be configured to extend along the package side and along the package length below the capacitor elements to provide an extended path for heat dissipation from the bus bar prior to its contact with capacitor elements. The enhanced isolation layer is configured to conduct heat away from the bus bar to the case to avoid the hotspot temperature of the capacitor. Reduced capacitor temperature allows use of smaller, cheaper capacitors, reducing inverter costs without compromising performance.

The invention relates to a preparation method of vertically arrayed graphene thin films. The preparation method comprises the following steps: a), preparing an oxidized graphene solution; b), coating a substrate with the oxidized graphene solution; c), reducing oxidized graphene into a graphene thin film through a strong reducing agent; d), cutting the graphene thin film in a designed mold, and folding the cut graphene thin films into vertically arrayed graphene thin films; e), curing the vertically arrayed graphene thin films with a binding agent; f), polishing the surfaces of the cured graphene thin films to ensure that the polished graphene thin films are in better contact with the surface of a device, and finally filling the polished graphene thin films with a polymer adhesive to improve the interlayer contact between the graphene thin films. The vertically arrayed graphene thin films prepared according to the preparing method can be applied to the field of high-power electronic devices, such as being used as an interface heat dissipation material to provide a heat dissipation solution.

A method, system, and apparatus are disclosed. In one embodiment method includes causing a cooling medium to flow through a hollow cable. The cable couples an external cooling station to a heat exchanging unit. The heat exchanging unit is located within a mobile computing device. The method then transfers heat from within the mobile computing device to the cooling medium at the heat exchanging unit. Then the cooling medium contained the transferred heat is expelled out of the mobile computing device.

A bottom heat dissipating device may be attached to a bottom surface of a printed circuit board (PCB). A top surface of the bottom heat dissipating device may be thermally coupled with a backside surface of one or more electronic components mounted on the bottom surface of the PCB. A top heat dissipating device may be attached to a top surface of the PCB. The top heat dissipating device may be thermally coupled with the bottom heat dissipating device through a thermally conductive coupling member to provide a conductive path for heat transfer from the bottom heat dissipating device to the top heat dissipating device. An opening adjacent to an edge of the thermally conductive coupling member may allow air flow between the top and bottom heat dissipating devices. The PCB may be part of a mezzanine card, such as a Peripheral Component Interconnect (PCI) mezzanine card (PMC).

The invention provides a platinoid bimetallic nanometer material. The grain diameter of the material is 4-10 nanometers; the material has a multi-legged appearance; and the mole ratio of the platinoid is adjustable. The preparation method comprises the following steps of: filling soluble platinum precursor solution in 140-180 DEG C polyhydric alcohol thermal solution containing soluble copper precursor and little alkali liquor, and maintaining the temperature and stirring for 1-3 hours. The raw material of the preparation method is cheap and easy to obtain; the equipment technology is simple; and the yield is higher. The material has large potential application in the fields such as heterogeneous catalysis, electro-catalysis and photocatalysis, and particularly has excellent catalytic performance in the electro-catalysis.