Middle frame of mobile terminal and mobile terminal

Abstract

The invention relates to the technical field of mobile communication, and discloses a middle frame of a mobile terminal and the mobile terminal. The middle frame comprises a middle frame body, a heat radiation apparatus for radiating heat of devices is inlaid in the middle frame, and the thickness of the heat radiation apparatus is no greater than the thickness of the middle frame body. The heat radiation solution comprises two heat sinks oppositely arranged, and a capillary structure and a steam channel structure arranged between the heat sinks, and the capillary structure and the steam channel structure communicate with each other to form a gas-liquid loop. The capillary structure is filled with phase-changing working substances. The heat radiation apparatus for radiating heat of devices is inlaid in the middle frame, the heat radiation apparatus employs spliced heat sinks, and a capillary structure is formed between the two heat sinks. The thickness of the entire heat radiation apparatus is effectively reduced, and the thickness of the heat radiation apparatus is no greater than the thickness of the middle frame. Such a structure allows a mobile terminal to be designed thinner.

Description

technical field [0001] The present invention relates to the technical field of mobile communication, in particular to a middle frame of a mobile terminal and a mobile terminal Background technique [0002] Smartphone SP (Smart Phone) is integrating functions and services of traditional feature phone FP (Feature Phone), notebook NB (Notebook), PDA, camera, projector, Walkman, MP3, etc., such as figure 1 shown. Correspondingly, the 2013SP mobile phone application processor (CPU) hardware configuration (main frequency & CPU core number) has developed rapidly, and has exceeded the 2010 notebook NB CPU hardware configuration level, and the fan radiator cannot be used. In the next three years (2014-2016), due to the rapid popularization of LTE, the application of mobile Internet and high-definition, high-performance multimedia will bring rapid growth of data services. It is predicted that the data services in 2016 will be 5 times that of 2013. Take a certain PXX SP mobile phone ...

AI Technical Summary

Problems solved by technology

However, the above two solutions have the following problems: 1) At present, the limit thickness of the heat pipe in the industry is 0.4mm, and the use of a 0.1mm middle frame is added. 0.5mm mobile phone application

2) The Qmax of the 0.4mm heat pipe≤4W, the ultra-thin heat pipe solution cannot meet the application requirements

[0004] Therefore, in the prior art, there is no better technical solution for the heat dissipation of mobile terminals.

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