The invention provides a method used for manufacturing a multi-layer circuit board by employing the 3D printing technology. The method is additionally provided with a heatproof insulation layer on the basis of an original printed circuit board. Raw material powder of the circuit comprises copper alloy powder and tin powder which are in a certain proportion, the heatproof insulation layer is ceramic powder, the 3D molding method is a laser irradiation molding method. During processing, the computer auxiliary manufacturing (CAM) technology is firstly utilized, circuit board design is accomplished on computer software and is transmitted to a 3D printer. The ceramic powder is fixed on the circuit board to form the heatproof insulation layer by utilizing the laser 3D printer, circuit molding of the powder is directly carried out on the heatproof insulation layer base body by utilizing the 3D printing technology, the steps above are repeated, and thereby the multi-layer circuit board is formed. Compared with a traditional printed circuit board, the multi-layer circuit board can be rapidly produced in a lab or under the small-batch production condition, moreover, the circuit does not easily generate defects, cost is low, response is rapid, equipment investment is small, and the method employing the 3D printing technology provides feasible small-batch customized production.