33 results about "Platinum-iridium alloy" patented technology

The invention discloses a graphene cladded copper-base biological material as well as a preparation method and an application thereof. The graphene-packaged composite material contains copper and graphene, wherein the surface of copper is totally packaged with graphene. The material has a good cladding effect, the toxin introduced by copper can be eliminated, and the death of cells and the necrosis and edema of tissues are avoided. The material can be taken as an electrode, particularly a neural electrode and can be applied to an in vivo or in vitro signal recording such as the signal recording of neuronal discharging and / or local field potential change. The material and a commercial platinum-iridium alloy electrode do not generate an artifact in a nuclear magnetic resonance imaging technique, and the observation of the quality and an implementation position of a nuclear magnetic resonance is greatly assisted.

The invention discloses a novel platinum alloy electrical contact material and a preparation method thereof, belonging to the electrical contact material. The platinum-iridium alloy comprises the following chemical compositions by weight percent: 5.0-30.0% of Ir, 0.1-5.0% of Nb, 0.1-5.0% of Zr, 0.1-5.0% of Mo, 0.1-5.0% of Ta, 0.1-5.0% of Yb, 0.1-5.0% of Gd, 0.1-5.0% of Tb and the the balance Pt. The preparation method comprises the following steps: proportioning with the metal elemets such as Pt, Ir, Nb, Zr, Mo, Ta, Yb, Gd and Tb according to the design formulation of the chemical compositions, preparing PtIrNbZrMoTaYbGdTb alloy containing nine elemets in a high frequency melting furnace or a medium frequency melting furnace, and adopting rolling, drawing, heat treatment and other technologies to process the alloy and finally obtain the finished product which is shaped like a sheet, a rod, a contact or the like. The alloy material is characterized by high melting point and hardness, corrosion resistance, low contact resistance, high fusion welding resistance and arc ablation resistance and the like, is an electrical contact material with good performance and has wide application prospect in the fields such as aviation, aerospace, ships, automobiles, electrical and mechanical, electric appliances, electronics and communication.

The invention relates to an electrode array manufacturing method. The method includes the following steps of stamping platinum sheets to form platinum electrode wafers, sizing platinum-iridium alloy wires through a wire winding machine to form platinum-iridium electrode lead wires, welding one end of each platinum-iridium electrode lead wire to the center of the corresponding platinum electrode wafer through the electric resistance welding technology to form an electrode, plating the surfaces of the electrodes with insulating layers through the vacuum coating technology to form electrodes with the insulating surfaces, sequentially loading the multiple electrodes with the insulating surfaces onto an electrode array die with silica-gel carriers, conducting thermal processing on the electrode array die to form a solidified blank piece of an electrode array, and trimming the blank piece to form the electrode array. The electrodes are made of safe and stable materials, and therefore biological safety of the electrode array is improved; the vacuum coating technology is adopted, and therefore interference of electric fields between every two adjacent electrodes is reduced, and effectiveness of stimulation is improved.