The invention provides an
adhesive for grade-E0
medium density fiberboards. The raw materials of the
adhesive include
formaldehyde,
polyvinyl alcohol,
urea and tripolycyanamide. The production process of the
adhesive comprises: firstly, adding all
formaldehyde into a reaction kettle, regulating the pH value of
formaldehyde solution to 7.5 to 8.5 by using
sodium hydroxide solution, adding the 40 to 50 percent of
polyvinyl alcohol and
urea and adding 80 to 90 percent of tripolycyanamide and adding the 10 to 20 percent of
urea; secondly, adjusting the pH value to 5 to 6 by using
formic acid, reacting for 20 to 30 minutes till a
cloud point, regulating the pH value to 705 to 8.5 with caustic soda solution, and adding the 10 to 20 percent of tripolycyanamide and 20 to 30 percent of urea; and finally, adding 10 to 20 percent of urea, regulating the pH value of the adhesive to 6.6 to 7.5, and discharging. The adhesive has the advantages that: the free formaldehyde content is very low, and the manufactured
medium density board is of grade E0; the
curing time is proper, the storage stability is high, and the normal-temperature storage period is about 1 month; and the manufactured
medium density board has high internal combining strength and high waterproof and dampproof performance.