348results about How to "Good bonding" patented technology

A waterproof electrical connector utilizing polyurethane bonded to electrical conductive pins, sleeves, polyurethane core, electrical cable conductor insulation, and cable jacket to form a water impenetrable molecular composition around the cable connection in combination with rubber to rubber isolators surrounding the separatable pin and sleeve connection. The connector is useable with or without coupling sleeves.

The invention discloses a composite diaphragm which comprises a supporting layer and an organic / inorganic particle blended coating layer, laminated; the coating layer comprises a polymer particle and an inorganic particle, uniformly mixed in an adhesive; micropore structures are arranged on the surface and at the inner part of the coating layer; the porosity is 20%-80%; the aperture average is 0.01 to 10 micrometers; the polymer particle comprises one or more of polytetrafluoroethylene, polyvinylidene fluoride, polyvinylidene fluoride-hexafluoropropylene copolymer, polyimide, polyacrylonitrile and aramid fiber resin; the particle size of the polymer particle is 0.01-10 micrometers; the inorganic particle comprises any one or more of SiO2, Al2O3, CaO, TiO2, MgO, ZnO, SnO2 and ZrO2; the particle size of the inorganic particle is 0.01-10 micrometers; the mass ratio of the polymer particle to the inorganic particle is (1:10) to (10:1). The invention further discloses a method for preparing the composite diaphragm. The composite diaphragm and the method have good thermal safety and strong in electrolyte absorption stiffness value, and meanwhile, and can achieve the advantages of low cost and low pollution.

A dilatation balloon for use in combination with a catheter device, the balloon having a waist, cone and body portion and having a first layer formed from a first polymeric composition, the balloon having a second layer disposed on at least a portion of the first layer, the second layer formed from a second polymeric composition which is crosslinked on at least a portion of the dilatation balloon, and methods of making and using the same.

The present invention relates to the field of lithium battery processing, and discloses a coating composite separation membrane and a preparation method thereof. The coating composite separation membrane comprises a base film and a polymer covering layer coated on the surface of the base film, wherein the polymer covering layer comprises a water-soluble adhesive, a surfactant, a dispersing agent, a thickening agent, deionized water and polymer powder particles. The invention further discloses the preparation method for the coating composite separation membrane. The preparation method comprises: 1) preparing an aqueous slurry; 2) coating the polymer covering layer on the base film; 3) drying; and 4) winding. According to the present invention, absorption capacity and retention capacity of the separation membrane on the electrolyte are well improved, safety of the liquid state lithium battery during the use process is increased, and advantages of environmental protection and low cost are provided.

A device is disclosed for pressing a tape, in particular a thermoplastic, carbon-fiber reinforced tape, for a fiber / tow placement method. A portion of the tape can be pressed by means of a pressure roller on a variable surface contour of a laminating device. An elastomer coating for even pressing of the tape adheres to the circumference of the pressure roller with a material bond. This may provide the advantage that a permanent and reliable connection is created between the elastomer coating and the pressure roller, which furthermore can be easily produced.

A composite of a metal with a resin in which the metal and the resin, especially a shaped base made of an ordinary steel material and a resin composition, can be tenaciously bonded and united to each other; and a process for producing the composite. A surface of a shaped ordinary steel material is treated by chemical etching or the like to form a thin iron autoxidation film layer the surface of which almost wholly has ultrafine irregularities. Hydrazine, ammonia, or a water-soluble amine is chemically adsorbed onto the treated steel material. The resultant steel material shape (1) is inserted into an injection die (10), and a specific resin composition (4) is injected thereinto. The surface of the steel material shape (1) may have a thin layer of a metal oxide or metal-phosphorus oxide. By this injection, a composite (7) is obtained in which the ordinary steel material has been tenaciously bonded and united to the resin. The resin composition (4) to be used contains a crystalline polyphenylene sulfide resin (PPS) or polybutylene terephthalate resin (PBT) as the main resin component.

It is an object of the present invention to securely and integrally join a metal and a resin, more particularly, a shaped titanium alloy substrate and a resin composition. A titanium alloy substrate is used that has undergone surface roughening by chemical etching or the like so as to have a ultrafine textured face in which bent, ridge-like protrusions having a width and height of from ten to a few hundred nanometers and a length of from a few to a few hundred microns rise up on the surface at a spacing period of from ten to a few hundred nanometers. A titanium alloy piece 1 with its surface treated is inserted into the cavity of a metallic mold for injection molding 10 and a specific resin composition 4 is injected to obtain an integrated composite 7. The main resin component of the resin composition 4 that is used can be a polyphenylene sulfide resin (PPS) or a polybutylene terephthalate resin (PBT). High injection joining strength is obtained if the resin composition contains, as an auxiliary component, a polyethylene terephthalate resin and / or polyolefin resin in the case of PBT and a polyolefin resin in the case of PPS.

The invention provides a micro-voltage high-overload sensor chip of a beam membrane single island structure, comprising a silicon base, wherein a mass block and four single beams are machined at the middle part of the silicon base; a thin film with the thickness of 10-30 mu m is machined in a space surrounded by the silicon base, the mass block and the four single beams; the back side of the silicon base is bonded with Pyrex7740 glass and a gap of 5-10 mu m is reserved between the mass block and the Pyrex7740 glass under a vacuum environment by thinning the back side of the mass block; meanwhile, an anti-adsorbing electrode on the Pyrex7740 glass is inserted into a bonding region and a cavity formed among the thin film, the mass block and the Pyrex7740 glass is vacuumized; and at the front side of the silicon base, four piezoresistor strips are mutually connected to form a semi-open-loop Wheatstone bridge. The four piezoresistor strips are introduced to improve the rigidity of the whole body and the stress is concentrated again; the micro-voltage high-overload sensor chip has the characteristics of good linearity and high flexibility; and meanwhile, the micro-voltage high-overload sensor chip can resist 500 times of high overload.

The invention discloses attapulgite-based carbon composite ceramic particles and a preparation method and use thereof. The raw materials of the composite ceramic particles comprise attapulgite clay, biomass and sodium silicate. The preparation method is to prepare the attapulgite-based carbon composite ceramic particles by using attapulgite clay and biomass raw materials and industrial sodium silicate as a bonding agent and by calcining and carbonizing in an inert atmosphere. The composite ceramic particles prepared have the advantages of high specific surface area, low activation energy, high porosity, high catalytic activity, high water absorption rate and the like. The composite ceramic particles can be used as fillers for biofilters and catalyst carriers.

It is the object of the invention to provide a curable resin composition which causes no liquid crystal contamination, which are excellent in the adhesive property to a glass, and which causes no cell gap inequality in the case it is used as a sealant for a liquid crystal display element to produce a liquid crystal display element by a one drop fill process, a sealant for a liquid crystal displayelement, and a liquid crystal display element. The invention is a curable resin composition, which contains a curable resin to be cured by light and / or heat and a polymerization initiator, the curable resin being a crystalline (meth)acrylic acid-modified epoxy resin comprising a (meth)acrylic group and an epoxy group in one molecule.

A guide wire that due to its wide elastic region and high Young's modulus, simultaneously has pliability and pushability, and that even when its surface is coated with a plastic material of high melting point, is highly impervious to influences of heat treatment, and that has excellent slidability and excels in weldability between a distal-end-side base material and a proximal-end-side core material. The guide wire has a core material comprising a distal-end-side core material and a proximal-end-side core material. The distal-end-side core material is made of an iron alloy having shape memorycapability and superelasticity, consisting essentially of two phases of gamma-phase and gamma'-phase and exhibiting, in a thermal hysteresis of martensite transformation and reverse transformation, adifference between reverse transformation completion temperature (Af-point) and martensite transformation starting temperature (Ms-point) of 100 DEG C or below. The proximal-end-side core material ismade of an alloy containing iron and has an elastic modulus higher than that of the distal-end-side core material. The distal-end-side core material and the proximal-end-side core material are weldedtogether.

The invention provides a preparation method of a polycrystal cubic boron nitride sintering body material, which comprises the steps of preparing a new composite binding agent from metal powder, carbide and / or nitride, mixing and ball-milling cubic boron nitride micropowder and the composite binding agent, breaking cubic boron nitride into 0-7 micrometres micro-nano mixed powder under a protective atmosphere, and performing compression molding at last. According to the method, ingredients in the binding agent are subjected to mutual diffusion, permeation and solid solution form the homogeneous composite binding agent by high-temperature smelting; the composite binding agent can reduce temperature and pressure required by synthesis of polycrystal cubic boron nitride (PcBN) and improve comprehensive performance of polycrystal cubic boron nitride; by taking measures, a dense oxidation layer film on a single crystal surface of cubic boron nitride (CBN) is destroyed to facilitate bonding between CBN and CBN to form high strength polycrystal cubic boron nitride; many CBN surfaces free from oxidation films are generated at the same time.

The invention discloses a preparation method for a high-density interposer for microelectronic system-in-package. The preparation method comprises the following steps of: 1, preparing a drectionally growing carbon nanotube bundle array, wherein the diameter of each carbon nanotube bundle is 0.5 to 30 microns, the gap of the carbon nanotube bundle is 0.8 to 100 microns, and the carbon nanotube bundle is 40 to 500 microns long; 2, depositing metal tungsten on the surface of the drectionally growing carbon nanotube bundle so as to form a conductor array; 3, melting borosilicate glass and compounding the melted borosilicate glass with the conductor array so as to form a compound body; and 4, grinding the upper surface and the lower surface of the formed compound body so as to expose the end of the carbon nanotube bundle deposited with the metal tungsten, and obtaining the high-density interposer for the system-in-package. The material adopted by the preparation method has low thermal expansivity and the process method is low in time consumption, so the prepared high-density interposer has the advantages of high density, high reliability and low cost.

The invention discloses a self-circulation micro-fluidic chip, as well as a preparation method and a usage of the self-circulation micro-fluidic chip. The micro-fluidic chip comprises a microfluid layer, an electroosmosis driving layer and a chip base layer from top to bottom, wherein the electroosmosis driving layer defines a microfluid flow channel and a wide / narrow electrode liquid metal flow channel with the microfluid layer and the chip base layer respectively; the microfluid flow channel and the wide / narrow electrode liquid metal flow channel are independent and are filled with a to-be-driven solution and a liquid metal respectively; the electroosmosis driving layer and the wide / narrow electrode liquid metal flow channel are interdigital; the lower surface of the electroosmosis driving layer is completely covered with the wide / narrow electrode liquid metal flow channel; the upper surface of the electroosmosis driving layer is exposed in the microfluid flow channel; and the two ends of the wide / narrow electrode liquid metal flow channel are communicated with a power supply via four metal electrodes. The micro-fluidic chip has the advantages of small size, high integration level, portability, good stability and the like, is low in preparation cost and wide in application scope, and a preparation technology of the micro-fluidic chip is also very simple and practicable.

The invention relates to a preparation method of a waste paint slag compatibilized wood-plastic composite material, which comprises the following steps: mixing waste paint slag with thermoplastic resin and wood flour, compounding, and performing die pressing or extrusion to produce the wood-plastic composite material, wherein the paint slag is mainly composed of film forming matter, pigment, solvent and additive; the film former component in the paint slag contains multiple active functional groups such as hydroxyl groups, carboxyl groups, ester groups, amido groups and the like, and can be bonded with active groups on the surfaces of the wood flour and resin, such as hydroxyl groups, carboxyl groups, ester groups or the like; alkyl plastic chain segments in the film former or plasticizer in the paint slag are attached to soft chain segments of the resin, thereby increasing the interface bonding force and compatibility between the wood flour and the resin and improving the mechanical property of the wood-plastic composite material; and the pigment in the paint slag is used instead of master batches and added into the wood-plastic composite material, so that the decoration effect of a wood-plastic product is enhanced, and the production cost is lowered. Thus, the problems that waste paint slag pollutes environment and the waste paint slag treatment cost of an automobile manufacturer is high are effectively solved, and the unification of environmental benefits, social benefits and economic benefits is realized.

The invention provides a compound cathode foil comprising an aluminum base material, a metal layer, a metallic carbide layer and a carbon layer, wherein the metal layer is formed on the aluminum base material, and metal is selected from a class composed of the free IVB group elements, the VB group elements and the VIB group elements; the metallic carbide layer is formed on the metal layer; and the carbon layer is formed on the metallic carbide layer. The invention also provides a solid electrolytic capacitor comprising the compound cathode foil.

Provided are: an austenitic stainless steel clad steel plate which exhibits excellent corrosion resistance, particularly excellent sensitization resistance characteristics, and in which excellent junction is achieved between a base metal and a cladding material,and a process for manufacturing the same. An austenitic stainless steel clad steel plate which comprises both a cladding material that contains, in mass%, 0.020% or less of C, 1.00% or less of Si, 2.00% or less of Mn, 0.045% or less of P, 0.030% or less of S, 12.00 to 15.00% of Ni, 16.00 to 18.00% of Cr and 2.00 to 3.00% of Mo with the balance being Fe and unavoidable impurities and that has either a partially recrystallized austenite grain structure or a recrystallized austenite grain structure and a base metal that is superposed on the cladding material and bonded thereto and which exhibits a shear strength of 300MPa or more.

The invention discloses a high-temperature resistant downhole micro-dynamic pressure or micro-flow sensor, composed of elastic component, primary protective cover board, secondary protective cover board, SOI silicon micro-solid piezoresistive chip and connecting screw, the former three things linked together by the screw, the elastic component designed into the cantilever girder which is set withthe SOI silicon micro-solid piezoresistive chip, whose top is set inside the protective cover board and whose under part outside the protective cover board extends through into the channel with the fluid. It changes the length, width and thickness of the girder to resolve the measuring problem. It has characters of good dynamic property, high-temperature resistance and high measuring precision.

The invention discloses a flame-proof treatment method of real silk fabrics by a biological enzyme method, belonging to the biotechnical field of spinning. The method disclosed by the invention aims to overcome the deficiencies that real silk fabrics in flame-proof treatment by conventional chemical methods are not high in washability, the real silk is easy to damage in high temperature baking, the whiteness of fiber products is easy to decrease and the like. According to the method disclosed by the invention, tyrosine residues in silk fibroin are oxidized to dopaquinone structures with stronger reactivity by means of the characteristic of tyrosinase which has a catalytic oxidation effect on the tyrosine residues in real silk fiber to promote a grafting reaction on an organophosphorus flame retardant containing a primary amine base and the dopaquinone structures, and the flame retardant function of the real silk fabrics is improved through a nitrogen-phosphorus synergistic effect, so that flame-proof treatment of the real silk fabrics by the biological enzyme method is realized. The method disclosed by the invention comprises the following process flows: real silk fabric pre-treatment, and catalyzation of the organophosphorus flame retardant containing the primary amine base by the tyrosinase to graft, water-washing and drying post-treatment. For the fabrics treated by the method disclosed by the invention, not only is the flame retardant performance improved, but also the mechanical properties of the fabrics are further enhanced. Compared with conventional chemical methods, with the adoption of flame-proof treatment by tyrosinase catalyzation on the real silk fabrics, the method is low in energy consumption, high in efficiency and less in pollution in the processing process and is beneficial to environment protection.

The invention discloses a simple efficient method for preparing a superamphiphobic polysulfone membrane, and relates to the field of membrane separation. Firstly, a polysulfone membrane having an interpenetrating network pore structure is prepared by a conventional solvent-induced phase inversion manner, and interpenetrating network pores form a 'concave angle structure' on the surface of the membrane; then a stepwise sol-gel process is used to generate, in an in-situ manner, uniformly distributed silica nanoparticles on walls of the interpenetrating network pores to provide a certain nano-scale roughened structure for the polysulfone membrane; and finally, the roughened polysulfone membrane surface is coated with a fluorosilane compound film having low surface energy to obtain the superamphiphobic polysulfone membrane. Dual infiltration resistant functions for water droplets and organic liquid droplets are achieved, the contact angle of a water droplet can be 150 degrees or above, andthe contact angle of n-hexane can reach 65 degrees or above. The prepared superamphiphobic polysulfone membrane when applied in a membrane distillation process has a salt interception rate of 99.5% or above and has high anti-wetting stability.

The invention provides a liquid crystal display panel. The liquid crystal display panel comprises a display area and a border area which are adjacent, the border area comprises an underlayer substrate, a metal wiring layer arranged on the underlayer substrate, a flat layer arranged on the metal wiring layer, an insulating layer arranged on the flat layer and the metal wiring layer, a bonding terminal arranged on the insulating layer and the metal wiring layer, an anisotropic conductive adhesive arranged on the bonding terminal, a connecting terminal arranged on the anisotropic conductive adhesive and an alignment film arranged on the insulating layer; at least one blocking groove is formed between the display area and the bonding terminal, the alignment film of the border area can only flow into the blocking grooves, the phenomenon that the alignment film covers the bonding terminal due to certain mobility is prevented, the phenomenon that the effective contact area of the connecting terminal and the bonding terminal is reduced is avoided, the phenomenon that liquid crystal display panel bonding is poor is avoided, the display effect is improved, and narrow bezel of the liquid crystal display panel is facilitated.

The invention relates to an electronic assembly and a display device; the electronic assembly comprises a first binding zone and a second binding zone mutually matched; the first and second binding zones respectively comprise a plurality of first and second pins arranged at intervals, wherein the first pin has a first end and a second end, and the second pin has a third end and a fourth end; in the arrangement direction of the first pins, a first distance between the most outer sides of two first ends of the two most outer first pins is smaller than a second distance between the most outer sides of the two second ends; a first width ratio is formed between the first and third ends of at least one corresponding first pin and second pin, and a second width ratio is formed between the secondand fourth ends, wherein the first width ratio and the second width ratio are different. The contraposition deviations between the plurality of first and second pins can be effectively rectified; theavailable binding zone is relatively large in area, thus greatly improving the binding yield rate.

The invention discloses a rapid-hardening terrace material comprising following components, by weight, 30-34 parts of Portland cement, 5-10 parts of high-aluminum cement, 35-45 parts of quartz sand, 0.08-0.22 parts of a water reducing agent, 0.06-0.13 parts of a defoaming agent, 0.6-1.5 parts of a redispersible latex powder, 2.5-4 parts of gypsum powder, 0.1-0.2 parts of a retarder and 0.1-0.15 parts of a thickening agent. A preparation method of the rapid-hardening terrace material comprises following steps: (1) mixing the components uniformly to obtain a mixture material; and (2) adding water to the mixture material with stirring uniformly with an addition amount of the water accounting for 20-22% of the total mass of the mixture material. The rapid-hardening terrace material can be dried and hardened rapidly, is good in anti-shock performance, is not liable to swelling, is gravity roller compaction resistant, is good in joint performance with concrete ground, is sun-tolerant and is especially suitable for repairing and renewing old terraces and constructing a new terrace.

Methods and systems for securing cored penetration in a concrete slab are described. The method and system may include providing a concrete hole plug. The concrete hole may include a lower hole plug and a top cover securely attached to the lower hole plug for sealing the hole. The lower hole plug may include an adhesive on the outside surface for adhering to the concrete wall of the hole and a well for holding fire-resistant sealant to form a perimeter seal on installed pipe. The top cover may include one or more securing mechanism for attaching the top cover to the hole plug. Further, the method and system may include exposing the adhesive on the outside surface of the lower hole plug, disposing the concrete hole plug into a hole bored in a concrete slab and securing the top cover to the lower hole plug using the securing mechanism.

The invention is designed for use in a wafer to define a circuit and a contact window required by next bumping process. The re-wiring layer is located on a wafer's active side and has a line construction mainly comprising a first metal layer, a second metal layer and a conducting layer. Wherein, said conducting layer is mad of aluminum material, and said first and second metal layer are respectively overlapped on each of two side of said conducting layer. The connectivity between the first and second metal layers and a high polymer is higher than the one between said conducting layer and said high polymer. Said first and second metal layer can notably avoid the delaminating between a circuit layer and dielectric layer, and improve the reliability of wafer package.

The invention provides an MEMS wafer level vacuum package structure and a manufacturing method thereof. The package structure comprises a silicon cover plate and an MEMS wafer with a movable structure, wherein a vertical through hole is formed on the cover plate, the through hole is internally filled with a conductive material, a bonding surface of the cover plate is provided with a groove, a layer of getter film is arranged at the bottom of the groove, and the silicon cover plate and the MEMS wafer with the movable structure form the vacuum package structure by wafer bonding. The manufacturing method provided by the invention comprises the following steps: at first, manufacturing the through hole on the cover plate, and filling the conductive material in the hole; and then, forming the groove on the bonding surface, depositing a layer of getter film on the bottom of the groove, depositing a layer of multilayer metal film in a bonding area, and wafer bonding the cover plate with the MEMS wafer with the movable structure in a vacuum environment. According to the MEMS wafer level vacuum package structure provided by the invention, the groove with the getter and the through hole are formed on the silicon cover plate to export an electrode from the closed groove without carrying out wire bonding, so that the procedures are simple, meanwhile, the vacuum maintenance ability in the package structure is improved, contamination of granules to the movable structure during cutting is avoided, and performance of the device is guaranteed.

The invention relates to a beam-film double island structure micro-pressure high-overload sensor chip. The beam-film double island structure micro-pressure high-overload sensor chip comprises a silicon substrate, wherein two mass blocks and three single beams are processed on the silicon substrate; the single beams are connected between the mass blocks and the silicon substrate and between the two mass blocks; a spaced surrounded by the silicon substrate, the mass blocks and the three single beams is processed into a thin film; the rear surface of the silicon substrate is bonded with Pyrex7740 glass; gaps are formed between the mass blocks and the Pyrex7740 glass in vacuum environment; two anti-adsorbent electrodes on the Pyrex7740 glass are inserted into a bonding region; a cavity formed by the thin film, the mass blocks and the Pyrex7740 glass is vacuumized; and four piezoresistor stripes are mutually connected to form an open-loop wheatstone bridge on the front surface of the silicon substrate. The whole rigidity is improved by introducing the three single beams, and the stress is concentrated again. The beam-film double island structure micro-pressure high-overload sensor chip has the characteristics of high linearity, high sensitivity and low zero position and can resist 500 times of high overload at the same time.

The invention discloses an automatic wiring device of an electric power cable. The automatic wiring device comprises a device base, wherein the upper part of the device base is provided with one group of push-and-pull frames and a vertical frame; the middle position of the device base is provided with one group of cutoff oil cylinders; each push-and-pull frame is provided with a push-and-pull oil cylinder; each push-and-pull oil cylinder is cooperated with a push-and-pull arm; the upper part of each push-and-pull arm is provided with a cable lower clamp for clamping the oil cylinder; the top of the vertical frame is provided with a device top frame; the top of the device top frame is provided with a gear motor and a programmable logic controller, wherein the gear motor is cooperated with a spindle, and one group of rotation seats penetrates through the middle of the spindle; one side of each rotation seat is provided with a fixed cutoff tool; and the other side of each rotation seat is provided with a conducting rod attaching clamp. By use of the automatic wiring device of the electric power cable, the breakpoint detection of the cable can be carried out, the reconnection of a cut breakpoint cable can be quickly and automatically carried out, the automatic wiring device has the advantages of being simple in operation, good in connection effect and high in speed and efficiency, and a great quantity of overhauling time is saved.