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348results about How to "Good bonding" patented technology

Waterproof electrical connector

A waterproof electrical connector utilizing polyurethane bonded to electrical conductive pins, sleeves, polyurethane core, electrical cable conductor insulation, and cable jacket to form a water impenetrable molecular composition around the cable connection in combination with rubber to rubber isolators surrounding the separatable pin and sleeve connection. The connector is useable with or without coupling sleeves.
Owner:BROUSSARD BLAINE L

Balloons having a crosslinkable layer

A dilatation balloon for use in combination with a catheter device, the balloon having a waist, cone and body portion and having a first layer formed from a first polymeric composition, the balloon having a second layer disposed on at least a portion of the first layer, the second layer formed from a second polymeric composition which is crosslinked on at least a portion of the dilatation balloon, and methods of making and using the same.
Owner:BOSTON SCI SCIMED INC

Device for pressing a tape

A device is disclosed for pressing a tape, in particular a thermoplastic, carbon-fiber reinforced tape, for a fiber / tow placement method. A portion of the tape can be pressed by means of a pressure roller on a variable surface contour of a laminating device. An elastomer coating for even pressing of the tape adheres to the circumference of the pressure roller with a material bond. This may provide the advantage that a permanent and reliable connection is created between the elastomer coating and the pressure roller, which furthermore can be easily produced.
Owner:AIRBUS OPERATIONS GMBH

Micro-voltage high-overload sensor chip of beam membrane single island structure

The invention provides a micro-voltage high-overload sensor chip of a beam membrane single island structure, comprising a silicon base, wherein a mass block and four single beams are machined at the middle part of the silicon base; a thin film with the thickness of 10-30 mu m is machined in a space surrounded by the silicon base, the mass block and the four single beams; the back side of the silicon base is bonded with Pyrex7740 glass and a gap of 5-10 mu m is reserved between the mass block and the Pyrex7740 glass under a vacuum environment by thinning the back side of the mass block; meanwhile, an anti-adsorbing electrode on the Pyrex7740 glass is inserted into a bonding region and a cavity formed among the thin film, the mass block and the Pyrex7740 glass is vacuumized; and at the front side of the silicon base, four piezoresistor strips are mutually connected to form a semi-open-loop Wheatstone bridge. The four piezoresistor strips are introduced to improve the rigidity of the whole body and the stress is concentrated again; the micro-voltage high-overload sensor chip has the characteristics of good linearity and high flexibility; and meanwhile, the micro-voltage high-overload sensor chip can resist 500 times of high overload.
Owner:XI AN JIAOTONG UNIV

Attapulgite-based carbon composite ceramsite, its preparation method and use

The invention discloses attapulgite-based carbon composite ceramic particles and a preparation method and use thereof. The raw materials of the composite ceramic particles comprise attapulgite clay, biomass and sodium silicate. The preparation method is to prepare the attapulgite-based carbon composite ceramic particles by using attapulgite clay and biomass raw materials and industrial sodium silicate as a bonding agent and by calcining and carbonizing in an inert atmosphere. The composite ceramic particles prepared have the advantages of high specific surface area, low activation energy, high porosity, high catalytic activity, high water absorption rate and the like. The composite ceramic particles can be used as fillers for biofilters and catalyst carriers.
Owner:HEFEI UNIV OF TECH

Curing resin composition, sealing material for liquid crystal display device and liquid crystal display device

It is the object of the invention to provide a curable resin composition which causes no liquid crystal contamination, which are excellent in the adhesive property to a glass, and which causes no cell gap inequality in the case it is used as a sealant for a liquid crystal display element to produce a liquid crystal display element by a one drop fill process, a sealant for a liquid crystal displayelement, and a liquid crystal display element. The invention is a curable resin composition, which contains a curable resin to be cured by light and / or heat and a polymerization initiator, the curable resin being a crystalline (meth)acrylic acid-modified epoxy resin comprising a (meth)acrylic group and an epoxy group in one molecule.
Owner:SEKISUI CHEM CO LTD

Self-circulation micro-fluidic chip as well as preparation method and usage of micro-fluidic chip

The invention discloses a self-circulation micro-fluidic chip, as well as a preparation method and a usage of the self-circulation micro-fluidic chip. The micro-fluidic chip comprises a microfluid layer, an electroosmosis driving layer and a chip base layer from top to bottom, wherein the electroosmosis driving layer defines a microfluid flow channel and a wide/narrow electrode liquid metal flow channel with the microfluid layer and the chip base layer respectively; the microfluid flow channel and the wide/narrow electrode liquid metal flow channel are independent and are filled with a to-be-driven solution and a liquid metal respectively; the electroosmosis driving layer and the wide/narrow electrode liquid metal flow channel are interdigital; the lower surface of the electroosmosis driving layer is completely covered with the wide/narrow electrode liquid metal flow channel; the upper surface of the electroosmosis driving layer is exposed in the microfluid flow channel; and the two ends of the wide/narrow electrode liquid metal flow channel are communicated with a power supply via four metal electrodes. The micro-fluidic chip has the advantages of small size, high integration level, portability, good stability and the like, is low in preparation cost and wide in application scope, and a preparation technology of the micro-fluidic chip is also very simple and practicable.
Owner:SHENZHEN GRADUATE SCHOOL TSINGHUA UNIV

Preparation method of waste paint slag compatibilized wood-plastic composite material

The invention relates to a preparation method of a waste paint slag compatibilized wood-plastic composite material, which comprises the following steps: mixing waste paint slag with thermoplastic resin and wood flour, compounding, and performing die pressing or extrusion to produce the wood-plastic composite material, wherein the paint slag is mainly composed of film forming matter, pigment, solvent and additive; the film former component in the paint slag contains multiple active functional groups such as hydroxyl groups, carboxyl groups, ester groups, amido groups and the like, and can be bonded with active groups on the surfaces of the wood flour and resin, such as hydroxyl groups, carboxyl groups, ester groups or the like; alkyl plastic chain segments in the film former or plasticizer in the paint slag are attached to soft chain segments of the resin, thereby increasing the interface bonding force and compatibility between the wood flour and the resin and improving the mechanical property of the wood-plastic composite material; and the pigment in the paint slag is used instead of master batches and added into the wood-plastic composite material, so that the decoration effect of a wood-plastic product is enhanced, and the production cost is lowered. Thus, the problems that waste paint slag pollutes environment and the waste paint slag treatment cost of an automobile manufacturer is high are effectively solved, and the unification of environmental benefits, social benefits and economic benefits is realized.
Owner:SHANDONG UNIV OF TECH

Compound cathode foil and solid electrolytic capacitor comprising same

The invention provides a compound cathode foil comprising an aluminum base material, a metal layer, a metallic carbide layer and a carbon layer, wherein the metal layer is formed on the aluminum base material, and metal is selected from a class composed of the free IVB group elements, the VB group elements and the VIB group elements; the metallic carbide layer is formed on the metal layer; and the carbon layer is formed on the metallic carbide layer. The invention also provides a solid electrolytic capacitor comprising the compound cathode foil.
Owner:IND TECH RES INST

Flame-proof treatment method of real silk fabrics by biological enzyme method

The invention discloses a flame-proof treatment method of real silk fabrics by a biological enzyme method, belonging to the biotechnical field of spinning. The method disclosed by the invention aims to overcome the deficiencies that real silk fabrics in flame-proof treatment by conventional chemical methods are not high in washability, the real silk is easy to damage in high temperature baking, the whiteness of fiber products is easy to decrease and the like. According to the method disclosed by the invention, tyrosine residues in silk fibroin are oxidized to dopaquinone structures with stronger reactivity by means of the characteristic of tyrosinase which has a catalytic oxidation effect on the tyrosine residues in real silk fiber to promote a grafting reaction on an organophosphorus flame retardant containing a primary amine base and the dopaquinone structures, and the flame retardant function of the real silk fabrics is improved through a nitrogen-phosphorus synergistic effect, so that flame-proof treatment of the real silk fabrics by the biological enzyme method is realized. The method disclosed by the invention comprises the following process flows: real silk fabric pre-treatment, and catalyzation of the organophosphorus flame retardant containing the primary amine base by the tyrosinase to graft, water-washing and drying post-treatment. For the fabrics treated by the method disclosed by the invention, not only is the flame retardant performance improved, but also the mechanical properties of the fabrics are further enhanced. Compared with conventional chemical methods, with the adoption of flame-proof treatment by tyrosinase catalyzation on the real silk fabrics, the method is low in energy consumption, high in efficiency and less in pollution in the processing process and is beneficial to environment protection.
Owner:苏州大上科高新材料有限公司

Method for preparing superamphiphobic polysulfone membrane for membrane distillation

The invention discloses a simple efficient method for preparing a superamphiphobic polysulfone membrane, and relates to the field of membrane separation. Firstly, a polysulfone membrane having an interpenetrating network pore structure is prepared by a conventional solvent-induced phase inversion manner, and interpenetrating network pores form a 'concave angle structure' on the surface of the membrane; then a stepwise sol-gel process is used to generate, in an in-situ manner, uniformly distributed silica nanoparticles on walls of the interpenetrating network pores to provide a certain nano-scale roughened structure for the polysulfone membrane; and finally, the roughened polysulfone membrane surface is coated with a fluorosilane compound film having low surface energy to obtain the superamphiphobic polysulfone membrane. Dual infiltration resistant functions for water droplets and organic liquid droplets are achieved, the contact angle of a water droplet can be 150 degrees or above, andthe contact angle of n-hexane can reach 65 degrees or above. The prepared superamphiphobic polysulfone membrane when applied in a membrane distillation process has a salt interception rate of 99.5% or above and has high anti-wetting stability.
Owner:QINGDAO UNIV OF SCI & TECH

Kit for plugging a hole with a fire resistant material

ActiveUS20080216432A1Good bondingFacilitate creationEngine sealsPipesEngineeringAdhesive
Methods and systems for securing cored penetration in a concrete slab are described. The method and system may include providing a concrete hole plug. The concrete hole may include a lower hole plug and a top cover securely attached to the lower hole plug for sealing the hole. The lower hole plug may include an adhesive on the outside surface for adhering to the concrete wall of the hole and a well for holding fire-resistant sealant to form a perimeter seal on installed pipe. The top cover may include one or more securing mechanism for attaching the top cover to the hole plug. Further, the method and system may include exposing the adhesive on the outside surface of the lower hole plug, disposing the concrete hole plug into a hole bored in a concrete slab and securing the top cover to the lower hole plug using the securing mechanism.
Owner:CATALANOTTO JAMES WILLIAM

MEMS wafer level vacuum package structure and manufacturing method thereof

The invention provides an MEMS wafer level vacuum package structure and a manufacturing method thereof. The package structure comprises a silicon cover plate and an MEMS wafer with a movable structure, wherein a vertical through hole is formed on the cover plate, the through hole is internally filled with a conductive material, a bonding surface of the cover plate is provided with a groove, a layer of getter film is arranged at the bottom of the groove, and the silicon cover plate and the MEMS wafer with the movable structure form the vacuum package structure by wafer bonding. The manufacturing method provided by the invention comprises the following steps: at first, manufacturing the through hole on the cover plate, and filling the conductive material in the hole; and then, forming the groove on the bonding surface, depositing a layer of getter film on the bottom of the groove, depositing a layer of multilayer metal film in a bonding area, and wafer bonding the cover plate with the MEMS wafer with the movable structure in a vacuum environment. According to the MEMS wafer level vacuum package structure provided by the invention, the groove with the getter and the through hole are formed on the silicon cover plate to export an electrode from the closed groove without carrying out wire bonding, so that the procedures are simple, meanwhile, the vacuum maintenance ability in the package structure is improved, contamination of granules to the movable structure during cutting is avoided, and performance of the device is guaranteed.
Owner:BEIJING MXTRONICS CORP +1

Beam-film double island structure micro-pressure high-overload sensor chip

The invention relates to a beam-film double island structure micro-pressure high-overload sensor chip. The beam-film double island structure micro-pressure high-overload sensor chip comprises a silicon substrate, wherein two mass blocks and three single beams are processed on the silicon substrate; the single beams are connected between the mass blocks and the silicon substrate and between the two mass blocks; a spaced surrounded by the silicon substrate, the mass blocks and the three single beams is processed into a thin film; the rear surface of the silicon substrate is bonded with Pyrex7740 glass; gaps are formed between the mass blocks and the Pyrex7740 glass in vacuum environment; two anti-adsorbent electrodes on the Pyrex7740 glass are inserted into a bonding region; a cavity formed by the thin film, the mass blocks and the Pyrex7740 glass is vacuumized; and four piezoresistor stripes are mutually connected to form an open-loop wheatstone bridge on the front surface of the silicon substrate. The whole rigidity is improved by introducing the three single beams, and the stress is concentrated again. The beam-film double island structure micro-pressure high-overload sensor chip has the characteristics of high linearity, high sensitivity and low zero position and can resist 500 times of high overload at the same time.
Owner:XI AN JIAOTONG UNIV

Automatic wiring device of electric power cable

The invention discloses an automatic wiring device of an electric power cable. The automatic wiring device comprises a device base, wherein the upper part of the device base is provided with one group of push-and-pull frames and a vertical frame; the middle position of the device base is provided with one group of cutoff oil cylinders; each push-and-pull frame is provided with a push-and-pull oil cylinder; each push-and-pull oil cylinder is cooperated with a push-and-pull arm; the upper part of each push-and-pull arm is provided with a cable lower clamp for clamping the oil cylinder; the top of the vertical frame is provided with a device top frame; the top of the device top frame is provided with a gear motor and a programmable logic controller, wherein the gear motor is cooperated with a spindle, and one group of rotation seats penetrates through the middle of the spindle; one side of each rotation seat is provided with a fixed cutoff tool; and the other side of each rotation seat is provided with a conducting rod attaching clamp. By use of the automatic wiring device of the electric power cable, the breakpoint detection of the cable can be carried out, the reconnection of a cut breakpoint cable can be quickly and automatically carried out, the automatic wiring device has the advantages of being simple in operation, good in connection effect and high in speed and efficiency, and a great quantity of overhauling time is saved.
Owner:国网山东省电力公司招远市供电公司
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