The invention provides an acceleration sensor
chip with a compound multiple-beam structure and a manufacturing method thereof. The acceleration sensor
chip is characterized in that: four support beams and two sensitive beams support a hanging
mass block, and the hanging
mass block is suspended; the sensitive beam is provided with a plurality of
voltage dependent resistors which are connected to form a semi-open-loop
Wheatstone bridge, and an output terminal of the bridge is connected with pads of a
chip. The manufacturing method of the chip comprises the following steps:
thinning a hang
mass block area
silicon chip, and carrying out
lithography and
sputtering on a right side of the chip to form a
metal lead wire and the pads; carrying out
lithography at a back side of the
silicon chip andwet method
etching to form a movable structure composed of the sensitive beam, the support beam, and the hang mass block, bonding
boron glass at a back side of a
silicon chip substrate, and carrying out right side
lithography and
etching to form gap between a chip movable part and a silicon substrate to obtain the chip. When ensuring measure sensitivity of the sensor,
response frequency of the acceleration sensor is raised, and performance of the sensor in dynamic acceleration measurement is enhanced. The manufacturing method of the chip has the characteristics of simplicity and high reliability, and realization of micromation and low cost is facilitated.