A manufacturing process of plating
copper by using aluminum-
magnesium copper-plating wire comprises the following steps: arranging wire, cleaning by alkali, cleaning by water, cleaning by
sulfuric acid, cleaning by water, cleaning by alkali, cleaning by water, a first time soaking
zinc, cleaning by water, removing the
zinc by
nitric acid, cleaning by water, a second time soaking
zinc, cleaning by water, cleaning by hot water, pre-plating
nickel, cleaning by water, activating, acidicly plating
copper, cleaning by water, carrying out the anti-oxidation treatment, cleaning by hot water,
drying and taking out the wire. The manufacturing process is characterized in that the process of the first time zinc soaking is that completing the first time zinc soaking in solution with temperature of 12-27DEG C for 30-60 sec after mixing with 60 parts water, 7 parts zinc
oxide, 31 parts superalkali, 2 parts
potassium sodium tartrate and 0.06 parts iron trichloride. By adopting the manufacturing process of the invention, the aluminum-
magnesium copper-plating wire has the double advantages that
aluminium conductor has light weight and low cost,
copper conductor has
high conductivity and good
chemical stability, wherein the
specific weight of copper is about 18-19%, mean density is 2.8g / cm3, the length of aluminum-
magnesium copper plating wire whose size and weight are the same with that of pure
copper wire is 3.1 times than that of the pure
copper wire, tensile strength is more than or equal to 210, which enables the aluminum-magnesium
copper plating wire uneasily to break and improves the quality of the products.