The invention discloses a manufacturing method for a rigid-flexible circuit board. The manufacturing method comprises the following steps of: providing a flexible circuit board, wherein the flexible circuit board comprises a bending region and a fixing region which are connected to each other; providing a film and a hard
copper-clad substrate, wherein an opening is formed in the film, and the
copper-clad substrate comprises a substrate and a
copper foil layer and is provided with a windowing region and a product region which correspond to each other; forming a first
cut at one side away from the
copper foil layer in the substrate along the boundary of the windowing region, wherein the first
cut does not penetrate through the substrate; sequentially stacking and laminating the copper-clad substrate, the film and the flexible circuit board, wherein the substrate of the copper-clad substrate is contacted with the film, the
copper coil layer is away from the film and the windowing region is overlapped with the bending region; manufacturing the
copper foil layer to form an outer-layer circuit; forming a second
cut in the substrate along the boundary of the windowing region, wherein the second cut is communicated with the first cut; and removing a material in the windowing region from the copper-clad substrate.