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Copper foil for processing copper clad laminate, copper clad laminate and printed wiring board equipped with copper clad laminate

A technology of copper-clad laminates and treatment layers, which is applied to printed circuit components, secondary treatment of printed circuits, improvement of metal adhesion of insulating substrates, etc., and can solve the problems of reduced peel strength, circuit peeling, falling off, and less infiltration. Problems, achieve the effect of reducing the deterioration rate of the peel strength, strengthening the peel strength, and high industrial applicability

Active Publication Date: 2011-10-12
FUKUKA METAL FOIL & POWDER CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, in the manufacture of printed wiring boards, there is a process of etching the treated copper foil in order to form copper circuits. If the amount of roughening treatment of the treated copper foil is large, etching residues (dissolved roughened particles remain) will be generated, Therefore, in order to improve the peel strength characteristics, the amount of roughening treatment cannot be excessively increased to improve the surface roughness. In particular, with the thinner and smaller electronic devices, the fine pitch (fine pitch) Therefore, it is necessary to suppress the occurrence of etching residue as much as possible, so reducing the amount of roughening treatment and reducing the surface roughness of the foil surface is an effective method
[0006] That is, for the treated copper foil provided with a roughening treatment layer for printed wiring boards, it is necessary to increase the amount of roughening treatment to improve the surface roughness from the perspective of peel strength characteristics, and from the perspective of etching characteristics It is necessary to reduce the amount of roughening treatment to reduce the surface roughness, so it is difficult to satisfy these two characteristics
[0007] However, in the printed wiring board manufacturing process, there are various processes such as cleaning processes using sulfuric acid, hydrochloric acid, and caustic soda, tin plating processes, electroless nickel plating processes, and electroless gold plating processes, including etching processes using etching solutions. Multiple steps of active treatment liquid, when the peel strength of the treated copper foil is weak, the active treatment liquid penetrates from the bonding interface between the treated copper foil and the insulating resin base material, which is likely to cause a reduction (deterioration) of the peel strength, If the peeling strength is reduced, in the printed wiring board manufactured, especially in the printed wiring board with fine pitch, the peeling and falling off of the circuit caused by thermal shock and mechanical shock will easily occur. Treated copper foil that does not decrease in peel strength after liquid immersion and has little infiltration

Method used

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  • Copper foil for processing copper clad laminate, copper clad laminate and printed wiring board equipped with copper clad laminate
  • Copper foil for processing copper clad laminate, copper clad laminate and printed wiring board equipped with copper clad laminate
  • Copper foil for processing copper clad laminate, copper clad laminate and printed wiring board equipped with copper clad laminate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0118] Untreated electrolytic copper foil was prepared under the following electrolyte composition, additives, electrodes, liquid temperature, and electrolytic conditions.

[0119] (Manufacturing method of untreated electrolytic copper foil)

[0120] Adjust sulfuric acid to 100g / L, copper sulfate pentahydrate to 280g / L sulfuric acid-copper sulfate aqueous solution, add as additives: 20mg / L polyethylene glycol (average molecular weight: 20000; manufactured by Sanyo Chemical Co.), 20mg / L polyethylene Imine (trade name: Epomin; product code: PP-061; average molecular weight: 1200; manufactured by Nippon Shokubai Co., Ltd.), 6 μmol / L sodium 3-mercapto-1-propanesulfonate, 20 mg / L chloride ion. The electrolyte solution containing the additive is filled between the insoluble anode made of titanium coated with platinum metal oxide and the titanium cathode roll as the cathode, and the current density is 50A / dm 2 , A current was passed at a liquid temperature of 50° C. to obtain an unt...

Embodiment 2～6 and comparative example 1～6

[0135](untreated electrolytic copper foil)

[0136] The same untreated electrodeposited copper foil as used in Example 1 was used.

[0137] (first stage coarsening layer)

[0138] As shown in Table 1, in addition to changing the concentration of each additive added in the electrolytic solution forming the first-stage roughening treatment layer, changing the current density and the electric quantity, other conditions and methods are the same as those of the aforementioned Example 1 to obtain the first step. One-stage coarsening process layers.

[0139] (Second stage coarsening layer)

[0140] According to the same electrolyte composition, liquid temperature, electrodes, and electrolysis conditions as in Example 1, a second-stage roughening treatment layer is set.

[0141] (chromate layer)

[0142] According to the same electrolyte composition, liquid temperature, pH, electrodes and electrolysis conditions as in Example 1, a chromate layer is set.

[0143] (silane coupling ...

Embodiment 7

[0174] (untreated electrolytic copper foil)

[0175] The same untreated electrodeposited copper foil as used in Example 1 was used.

[0176] (first stage coarsening layer)

[0177] According to the same electrolyte composition, additives, liquid temperature, electrodes, and electrolysis conditions as in Example 3, the first-stage roughening treatment layer is set.

[0178] (Second stage coarsening layer)

[0179] According to the same electrolyte composition, liquid temperature, electrodes, and electrolysis conditions as in Example 1, a second-stage roughening treatment layer is set.

[0180] Next, according to the electrolyte composition, liquid temperature, pH, electrodes, and electrolysis conditions shown below, a nickel layer containing molybdenum is applied to the surface of the aforementioned second-stage roughening layer.

[0181] (nickel layer containing molybdenum)

[0182] Adjust nickel sulfate hexahydrate to be 45g / L, disodium molybdenum (VI) dihydrate to be 15g...

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Abstract

The invention provides a treatment copper foil, which is low in roughness and high in peeling strength with an insulating resin substrate. After an absorption treatment, an active processing liquid after being impregnated is low in deterioration rate of the peeling strength, less in penetration amount and excellent in etching property. The copper foil is characterized in that the surface of the copper foil is sequentially equipped with a roughening treatment layer, a chromate layer and a silane coupling agent layer. The ten-point average roughness Rz of the copper foil surface is 1.0 mu m to 2.7 mu m. When the surface of the copper coil with the area thereof 177 mu M2 is measured by purple laser of visible light with the wavelength thereof 408 nm, the average interval S of local peaks is below 0.0230 mm and S does not include 0.

Description

technical field [0001] The present invention relates to a treated copper foil for a copper-clad laminate, a copper-clad laminate obtained by bonding the treated copper foil to an insulating resin base material, and a printed wiring board using the copper-clad laminate. Copper laminates are suitable as printed wiring board materials used in electronic equipment. Background technique [0002] As is well known, in rolled copper foil and electrolytic copper foil used for printed wiring boards, various treatment layers such as roughening treatment layer, heat-resistant treatment layer, and rust-proof treatment layer are provided according to the use of the copper foil (hereinafter referred to as Copper foil with a treated layer is called "treated copper foil", and copper foil without a treated layer is called "untreated copper foil"). [0003] In addition, for the processed copper foil used in the printed wiring board which is a representative application of the copper-clad lami...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/09H05K3/38
Inventor 真锅久德冈本健
Owner FUKUKA METAL FOIL & POWDER CO LTD
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