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24538results about "Optically investigating flaws/contamination" patented technology

Methods and Scatterometers, Lithographic Systems, and Lithographic Processing Cells

In a method of determining the focus of a lithographic apparatus used in a lithographic process on a substrate, the lithographic process is used to form a structure on the substrate, the structure having at least one feature which has an asymmetry in the printed profile which varies as a function of the focus of the lithographic apparatus on the substrate. A first image of the periodic structure is formed and detected while illuminating the structure with a first beam of radiation. The first image is formed using a first part of non-zero order diffracted radiation. A second image of the periodic structure is foamed and detected while illuminating the structure with a second beam of radiation. The second image is formed using a second part of the non-zero order diffracted radiation which is symmetrically opposite to the first part in a diffraction spectrum. The ratio of the intensities of the measured first and second portions of the spectra is determined and used to determine the asymmetry in the profile of the periodic structure and / or to provide an indication of the focus on the substrate. In the same instrument, an intensity variation across the detected portion is determined as a measure of process-induced variation across the structure. A region of the structure with unwanted process variation can be identified and excluded from a measurement of the structure.
Owner:ASML NETHERLANDS BV

System and method for inspecting semiconductor wafers

A method for inspecting semiconductor wafers is provided in which a plurality of independent, low-cost, optical-inspection subsystems are packaged and integrated to simultaneously perform parallel inspections of portions of the wafer, the wafer location relative to the inspection being controlled so that the entire wafer is imaged by the system of optical subsystems in a raster-scan mode. A monochromatic coherent-light source illuminates the wafer surface. A darkfield-optical system collects scattered light and filters patterns produced by valid periodic wafer structures using Fourier filtering. The filtered light is processed by general purpose digital-signal processors. Image subtraction methods are used to detect wafer defects, which are reported to a main computer to aid in statistical process control, particularly for manufacturing equipment.
Owner:KLA TENCOR CORP

Methods and systems for providing illumination of a specimen for a process performed on the specimen

Methods and systems for providing illumination of a specimen for a process performed on the specimen are provided. One system configured to provide illumination of a specimen for a process performed on the specimen includes a laser configured to generate excitation light. The system also includes focusing optics configured to focus the excitation light to a plasma in an electrodeless lamp such that the plasma generates light. The system is also configured such that the light illuminates the specimen during the process.
Owner:KLA TENCOR TECH CORP

Methods and systems for inspection of wafers and reticles using designer intent data

Methods and systems for inspection of wafers and reticles using designer intent data are provided. One computer-implemented method includes identifying nuisance defects on a wafer based on inspection data produced by inspection of a reticle, which is used to form a pattern on the wafer prior to inspection of the wafer. Another computer-implemented method includes detecting defects on a wafer by analyzing data generated by inspection of the wafer in combination with data representative of a reticle, which includes designations identifying different types of portions of the reticle. An additional computer-implemented method includes determining a property of a manufacturing process used to process a wafer based on defects that alter a characteristic of a device formed on the wafer. Further computer-implemented methods include altering or simulating one or more characteristics of a design of an integrated circuit based on data generated by inspection of a wafer.
Owner:KLA TENCOR TECH CORP

Inspectable buried test structures and methods for inspecting the same

Disclosed is a semiconductor die having a lower test structure formed in a lower metal layer of the semiconductor die. The lower conductive test structure has a first end and a second end. The first end is coupled to a predetermined voltage level. The semiconductor die also includes an insulating layer formed over the lower metal layer. The die further includes an upper test structure formed in an upper metal layer of the semiconductor die. The upper conductive test structure is coupled with the second end of the lower conductive test structure. The upper metal layer is formed over the insulating layer. In a specific implementation, the first end of the lower test structure is coupled to ground. In another embodiment, the semiconductor die also includes a substrate and a first via coupled between the first end of the lower test structure and the substrate. In yet another aspect, the lower test structure is an extended metal line, and the upper test structure is a voltage contrast element. Methods for inspecting and fabricating such semiconductor die are also disclosed.
Owner:KLA TENCOR CORP

Aerial Inspection System(s) and Method(s)

An aerial inspection system has at least one transmission line, an aerial vehicle, and a detection device coupled to the aerial vehicle. The detection device is configured to detect a condition of the transmission line as the aerial vehicle flies across the transmission line. The aerial vehicle may be in the form of a drone.
Owner:QUANTA ASSOC

System and Method of Automated Civil Infrastructure Metrology for Inspection, Analysis, and Information Modeling

A system and method of automated civil infrastructure metrology for inspection, analysis, and information modeling utilizes an unmanned aerial vehicle (UAV) equipped with a position tracking system and digital cameras to capture a plurality of images of a structure to be inspected. The UAV is flown in a scan pattern around the structure while continually capturing images of the structure while position and orientation data is also recorded and linked for each of the images. Image processing and pattern recognition software algorithms are used to analyze the images and create an information model of the structure which is then used to carry out a virtual inspection of the structure in a three dimensional software environment.
Owner:SCOTT MICHAEL L
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