Manufacturing method for rigid-flexible circuit board

Abstract

The invention discloses a manufacturing method for a rigid-flexible circuit board. The manufacturing method comprises the following steps of: providing a flexible circuit board, wherein the flexible circuit board comprises a bending region and a fixing region which are connected to each other; providing a film and a hard copper-clad substrate, wherein an opening is formed in the film, and the copper-clad substrate comprises a substrate and a copper foil layer and is provided with a windowing region and a product region which correspond to each other; forming a first cut at one side away from the copper foil layer in the substrate along the boundary of the windowing region, wherein the first cut does not penetrate through the substrate; sequentially stacking and laminating the copper-clad substrate, the film and the flexible circuit board, wherein the substrate of the copper-clad substrate is contacted with the film, the copper coil layer is away from the film and the windowing region is overlapped with the bending region; manufacturing the copper foil layer to form an outer-layer circuit; forming a second cut in the substrate along the boundary of the windowing region, wherein the second cut is communicated with the first cut; and removing a material in the windowing region from the copper-clad substrate.

Description

technical field [0001] The invention relates to the field of circuit board production, in particular to a method for producing a circuit board with a groove structure. Background technique [0002] Printed circuit boards have been widely used due to their advantages such as high assembly density. For the application of the circuit board, please refer to the literature Takahashi, A.Ooki, N.Nagai, A.Akahoshi, H.Mukoh, A.Wajima, M.Res.Lab, High density multilayer printed circuit board for HITAC M-880, IEEE Trans .on Components, Packaging, and Manufacturing Technology, 1992, 15(4): 418-425. [0003] A rigid-flex circuit board is a circuit board structure that includes interconnected flexible boards and rigid boards, which can not only have the flexibility of a rigid-flex circuit board, but also include the hardness of a rigid circuit board. In the production process of the flexible and rigid circuit board, it is usually formed by pressing the rigid substrate on the flexible an...

AI Technical Summary

Problems solved by technology

However, such a manufacturing method has the following disadvantages: First, due to the large thickness difference between the bending area of ​​the soft board and the hard board, the circuit on the soft board is easy to be broken due to uneven pressing during pressing.

Secondly, during the production process of the conductive circuit of the rigid substrate, the potion often erodes the joint between the prepreg and the flexible circuit board, so that there is a risk of explosion of the rigid-flex circuit board in the subsequent process.

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