The invention discloses an epoxylite low temperature cured type high strength
adhesive. The epoxylite low temperature cured type high strength
adhesive is prepared from, by weight, modified
bisphenol A
epoxy resin, modified
bisphenol F
epoxy resin, an -SH group modified amine curing agent, 692
epoxy active
diluent, a
silane coupling agent and a special
accelerant. According to the epoxylite low temperature cured type high strength
adhesive, the problems are solved that a common epoxylite adhesive is not sufficient in curing cross-linked density and poor in adhesive force in a low temperature environment, can be cured from a low temperature (15 DEG C) to a normal temperature, can reach high cross-linking density as usual without
post curing, is small in smell, is extremely low in
toxicity and good in
toughness, is not fractured at the low temperature, can maintain a good constitutive property after being cured, thus guarantee
structural stability, has good adhesive strength both for most
metal and non-
metal building materials, is used in the low temperature environment, is matched with carbon
fiber for curing construction and adhesive curing for
waterproofing, anti-
corrosion paints and other low temperature application occasions, and is widely applied to many fields of
electron, buildings, chemical building materials and the like.