The invention provides a method of alloying a
wafer after wiring, comprising the following steps: placing a
wafer after wiring in a cavity, feeding
nitrogen used as a carrier gas into the cavity continuously, and raising the temperature in the cavity to a first preset temperature; keeping the cavity at the first preset temperature, and feeding a
mixed gas containing a preset percentage of
hydrogen into the cavity at a preset flow rate for a first preset time, wherein the flow rate is greater than a flow rate threshold; and after feeding of the
mixed gas ends, feeding
nitrogen into the cavity again until the cavity where the
wafer is located is filled with pure
nitrogen, and cooling the cavity in a pure
nitrogen atmosphere. According to the method, by optimizing an alloying menu in a
semiconductor manufacturing technology (namely, increasing the flow rate at which a preset percentage of
hydrogen is fed during alloying), the Si ((
silicon)
dangling bond near the interface is passivated effectively, the interface
state density is reduced greatly, and the quality of
gate oxide is repaired. Therefore, the characteristic of the C-
V curve of an NMOS
capacitor is changed, frequency failure is improved, and the product yield is improved.