The invention belongs to a kind of special solder paste for welding multi-level packaging chip components, which is specifically suitable for the application of the service temperature after welding is higher than 240 ℃, including tin alloy, nano metal, rare earth alloy and solder paste, tin alloy The powder is one or a mixture of tin-silver alloy powder, tin-antimony alloy powder, tin-copper alloy powder and tin-lead alloy powder; the nano-metal powder is one of copper powder, lead powder, titanium powder, cobalt powder and gold powder or multiple mixtures; the active ingredients of the described soldering paste include hydrogenated rosin, diethylene glycol monohexyl ether, succinic acid, tolyltriazole and citric acid; its preparation method includes preparing tin alloy powder, Nano-metal powder, rare-earth alloy powder, flux paste and mixing steps, adopting the invention of this technical solution, by adding elemental metal particles or alloy particles to the solder paste, and adding corresponding nano-auxiliary additives, the preparation cost is lower than Nano solder paste is easy to implement and has a wider range of applications.