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A kind of nanoparticle doping realizes high temperature service solder paste and preparation method thereof

A high-temperature service, nano-particle technology, applied in the direction of welding equipment, manufacturing tools, welding media, etc., can solve the problems of solder paste melting, high melting point, narrow use range, etc.

Active Publication Date: 2021-07-06
CHONGQING QUNWIN ELECTRONICS MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] With the high speed of communication equipment and the high density of integrated circuits, the complexity of semiconductor devices is getting higher and higher, which puts forward higher requirements for packaging technology. With the expansion of multi-level packaging, printed circuit boards ( PCB) welding multiple times, in order to increase the production speed, after the first A side is welded, when the B side is welded next, during the second (multiple) welding, the temperature of the printed circuit board (PCB) is higher, Usually above 240°C, when solder paste with a low melting point (usually at 216°C) is used, because the temperature of the printed circuit board (PCB) is higher than that of the low melting point during secondary (or multiple) soldering Solder paste will cause the already welded solder paste with low melting point in service to melt again, resulting in false welding of the already welded A side, seriously affecting the quality of welding and reducing product performance; when using solder paste with high melting point in service When soldering solder paste, the melting point of the solder paste itself is required to be high. Although it solves the technical problem that the A-side solder paste that has been welded is not easy to melt during the second (or multiple) soldering, but in the first A-side soldering, Requires high melting point and high cost
In the current existing technology, solder paste cannot fully meet the requirements, either the cost is too high, or the performance cannot be achieved, or the use range is narrow

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] Take 30 grams of tin metal material and 70 grams of silver metal material, and put them into the intermediate frequency furnace through the feed port. The temperature of the intermediate frequency furnace is set at 1100-1200 °C. Stainless steel container, cooled for later use;

[0033] Pour the master alloy obtained in the above steps into a stainless steel container and fully mix it with 1000 grams of tin powder at a temperature of 200-300 ° C, stir for 60 minutes, and then let it stand for 180 minutes to make an alloy for later use;

[0034] When the temperature drops to 150-180°C, add potassium metal powder with a mass percentage of 8 grams to the alloy prepared above, stir for 60 minutes, raise the temperature to 200-300°C, let it stand for 20 minutes, scoop out and cool , made into an alloy for use;

[0035] The above alloy is prepared into tin alloy powder through powder atomization forming equipment through classification and screening;

[0036] Then take 25 gr...

Embodiment 2

[0041] Take 10 grams of tin metal material and 100 grams of copper metal material, and put them into the intermediate frequency furnace through the feed port. The temperature of the intermediate frequency furnace is set at 1100-1200 °C. Stainless steel container, cooled for later use;

[0042]Pour the master alloy obtained in the above steps into a stainless steel container and fully mix it with 1000 grams of tin powder at a temperature of 200-300 ° C, stir for 60 minutes, and then let it stand for 180 minutes to make an alloy for later use;

[0043] When the temperature drops to 150-180°C, add 9 grams of potassium by mass percentage to the alloy prepared above, stir for 60 minutes, raise the temperature to 200-300°C, let stand for 20 minutes, scoop out and cool, and make Alloy for use;

[0044] The above alloy is prepared into tin alloy powder through powder atomization forming equipment through classification and screening;

[0045] Then take 25 grams of copper and 0.4 gra...

Embodiment 3

[0050] Take 10 grams of tin metal material and 100 grams of antimony metal material, and put them into the intermediate frequency furnace through the feed port. The temperature of the intermediate frequency furnace is set at 650-800 °C. Stainless steel container, cooled for later use;

[0051] Take 63 grams of tin metal material and 37 grams of lead metal material, and put them into the intermediate frequency furnace through the feed port. The temperature of the intermediate frequency furnace is set at 1300-1400 °C. Stainless steel container, cooled for later use;

[0052] Pour the master alloy obtained in the above steps into a stainless steel container and fully mix it with 1000 grams of tin powder at a temperature of 200-300 ° C, stir for 60 minutes, and then let it stand for 180 minutes to make an alloy for later use;

[0053] When the temperature drops to 150-180°C, add potassium metal powder with a mass percentage of 12 grams to the alloy prepared above, stir for 60 min...

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Abstract

The invention belongs to a kind of nano-particle doping to achieve high-temperature service solder paste, which is specifically suitable for applications where the service temperature after welding is higher than 270°C, including tin alloys, nano-metals, rare earth alloys and solder pastes. The tin alloy powder It is a mixture of one or two kinds of tin-silver alloy powder, tin-antimony alloy powder and tin-copper alloy powder; the nano-metal powder is one or more mixtures of copper powder, nickel powder, titanium powder, cobalt powder and gold powder; The active ingredients of the solder paste include hydrogenated rosin, diethylene glycol monohexyl ether, succinic acid, tolyltriazole and citric acid; its preparation method includes preparing tin alloy powder, nanometer metal powder, rare earth alloy Powder, flux paste and mixing steps, adopting the invention of this technical scheme, by adding a certain proportion of nano-element metal particles or alloy particles in the solder paste, and adding corresponding nano-auxiliary additives, the preparation cost is lower than that of nano-soldering Paste, and easy to implement, a wider range of applications.

Description

technical field [0001] The invention belongs to nano particle doping to achieve high-temperature service solder paste and a preparation method thereof, and is particularly suitable for applications where the service temperature after welding is higher than 270°C. Background technique [0002] With the high speed of communication equipment and the high density of integrated circuits, the complexity of semiconductor devices is getting higher and higher, which puts forward higher requirements for packaging technology. With the expansion of multi-level packaging, printed circuit boards ( PCB) welding multiple times, in order to increase the production speed, after the first side A is welded, then when the B side is welded, the temperature of the printed circuit board (PCB) is higher during the second (multiple) welding, Usually above 240°C, when solder paste with a low melting point (usually at 216°C) is used, because the temperature of the printed circuit board (PCB) is higher ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/362
CPCB23K35/362
Inventor 吴玫
Owner CHONGQING QUNWIN ELECTRONICS MATERIAL CO LTD
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