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Special soldering tin paste used for welding multi-stage package patch element

A technology for chip components and solder paste, which is applied in welding media, welding equipment, welding/cutting media/materials, etc., can solve the problems of high temperature of printed circuit boards, reduced product performance, and high production costs, and achieves a wide range of applications. , The effect of low preparation cost and high service temperature

Active Publication Date: 2020-01-07
深圳群崴半导体材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, for this type of packaging form, the existing technology has the following problems: during the first and second (multiple) soldering, the temperature of the printed circuit board (PCB) is relatively high, usually above 240°C, and the solder paste with a low melting point in service , which will melt the formed solder joints again, resulting in false soldering of the soldered components, which seriously affects the quality of the soldering and reduces the performance of the product; Multiple times) during soldering, the solder melted at high temperature will be sucked into the small hole inside the colloid due to the capillary phenomenon of the bottom filling glue gap, causing the component to short circuit
However, this welding material has two disadvantages compared with solder paste: 1. The main raw material of sintered silver paste is precious metal silver, and the production cost is relatively high; 2. Devices soldered with sintered silver paste are not conducive to rework or repair

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] Take 30 grams of tin metal material and 70 grams of silver metal material, and put them into the intermediate frequency furnace through the feeding port. The temperature of the intermediate frequency furnace is set at 1100-1200 °C. Stainless steel container, cooled for later use;

[0037] Pour the master alloy obtained in the above steps into a stainless steel container and fully mix it with 1000 grams of tin powder at a temperature of 200-300 ° C, stir for 60 minutes, and then let it stand for 180 minutes to make an alloy for later use;

[0038]When the temperature drops to 150-180°C, add potassium metal powder with a mass percentage of 8 grams to the alloy prepared above, stir for 60 minutes, raise the temperature to 200-300°C, let it stand for 20 minutes, scoop out and cool , made into an alloy for use;

[0039] The above alloy is prepared into tin alloy powder through powder atomization forming equipment through classification and screening;

[0040] Take again, 2...

Embodiment 2

[0045] Take 10 grams of tin metal material and 100 grams of copper metal material, and put them into the intermediate frequency furnace through the feed port. The temperature of the intermediate frequency furnace is set at 1100-1200 °C. Stainless steel container, cooled for later use;

[0046] Pour the master alloy obtained in the above steps into a stainless steel container and fully mix it with 1000 grams of tin powder at a temperature of 200-300 ° C, stir for 60 minutes, and then let it stand for 180 minutes to make an alloy for later use;

[0047] When the temperature drops to 150-180°C, add 9 grams of potassium to the alloy prepared above, stir for 60 minutes, raise the temperature to 200-300°C, let stand for 20 minutes, scoop out and cool, and make Alloy for use;

[0048] The above alloy is prepared into tin alloy powder through powder atomization forming equipment through classification and screening;

[0049] Take again, 0.25 grams of copper and 0.4 grams of silver a...

Embodiment 3

[0054] Take 10 grams of tin metal material and 100 grams of antimony metal material, and put them into the intermediate frequency furnace through the feed port. The temperature of the intermediate frequency furnace is set at 650-800 °C. Stainless steel container, cooled for later use;

[0055] Take 63 grams of tin metal material and 37 grams of lead metal material, and put them into the intermediate frequency furnace through the feed port. The temperature of the intermediate frequency furnace is set at 1300-1400 °C. Stainless steel container, cooled for later use;

[0056] Pour the master alloy obtained in the above steps into a stainless steel container and fully mix it with 1000 grams of tin powder at a temperature of 200-300 ° C, stir for 60 minutes, and then let it stand for 180 minutes to make an alloy for later use;

[0057] When the temperature drops to 150-180°C, add 12 grams of potassium metal powder to the alloy prepared above, stir for 60 minutes, raise the tempera...

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Abstract

The invention belongs to special soldering tin paste used for welding a multi-stage package patch element and particularly applicable to the occasion with the service temperature higher than 240 DEG Cafter welding. The special soldering tin paste comprises a tin alloy, nanometer metal, a rare earth alloy and soldering aid paste. Tin alloy powder is a mixture of one or two of tin silver alloy powder, tin antimony alloy powder, tin copper alloy powder and tin lead alloy powder. Nanometer metal powder is a mixture of one or two of copper powder, lead powder, titanium powder, cobalt powder and gold powder. Effective components of the soldering aid paste comprise hydrogenated rosin, diethylene glycol monohexyl ether, succinic acid, methyl-1H-benzotriazole and citric acid. A manufacturing method of the paste comprises a few steps of preparing the tin alloy powder, the nanometer metal powder, the rare earth alloy powder and the weld aid paste and mixing. By the adoption of the technical scheme, elementary-substance metal particles or alloy particles are added into the tin paste, corresponding nanometer auxiliary additives are added, thus the preparation cost is lower than that of nanometer soldering paste, and the special soldering tin paste is easy to achieve and wide in application range.

Description

technical field [0001] The invention relates to a solder paste specially used for welding of multi-level packaging chip components, and is particularly suitable for applications where the service temperature after welding is higher than 240°C. The invention is an invention patent for a new use, which changes the composition and proportion of the solder paste originally used for welding multi-level packaging chip components. Background technique [0002] Interconnect solder joints provide electrical and mechanical connections and are an essential building block in electronic devices. Solder paste, as a new type of soldering material, has been widely used in the packaging of SMT components in recent years. Solder paste is a paste made of solder alloy powder and flux uniformly mixed. It is a kind of paste with the rapid development of SMT technology. It is a high-end soldering material that provides solder for reflow soldering to form solder joints, flux that promotes cleaning...

Claims

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Application Information

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IPC IPC(8): B23K35/02B23K35/26B23K35/40
CPCB23K35/025B23K35/40B23K35/262
Inventor 林文良
Owner 深圳群崴半导体材料有限公司
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