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Special solder paste for soldering multi-level package SMT components

A technology for chip components and solder paste, applied in welding equipment, welding media, welding/cutting media/materials, etc., can solve the problems of high temperature of printed circuit boards, reduced product performance, and high production costs, achieving a wide range of applications. , the effect of high service temperature and low preparation cost

Active Publication Date: 2022-02-15
深圳群崴半导体材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, for this type of packaging form, the existing technology has the following problems: during the first and second (multiple) soldering, the temperature of the printed circuit board (PCB) is relatively high, usually above 240°C, and the solder paste with a low melting point in service , which will melt the formed solder joints again, resulting in false soldering of the soldered components, which seriously affects the quality of the soldering and reduces the performance of the product; Multiple times) during soldering, the solder melted at high temperature will be sucked into the small hole inside the colloid due to the capillary phenomenon of the bottom filling glue gap, causing the component to short circuit
However, this welding material has two disadvantages compared with solder paste: 1. The main raw material of sintered silver paste is precious metal silver, and the production cost is relatively high; 2. Devices soldered with sintered silver paste are not conducive to rework or repair

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] Take 30 grams of tin metal material and 70 grams of silver metal material, and put them into the intermediate frequency furnace through the feed port. The temperature of the intermediate frequency furnace is set at 1100-1200 °C. Stainless steel container, cooled for later use;

[0037] Pour the master alloy obtained in the above steps into a stainless steel container and fully mix it with 1000 grams of tin powder at a temperature of 200-300 ° C, stir for 60 minutes, and then let it stand for 180 minutes to make an alloy for later use;

[0038]When the temperature drops to 150-180°C, add potassium metal powder with a mass percentage of 8 grams to the alloy prepared above, stir for 60 minutes, raise the temperature to 200-300°C, let it stand for 20 minutes, scoop out and cool , made into an alloy for use;

[0039] The above alloy is prepared into tin alloy powder through powder atomization forming equipment through classification and screening;

[0040] Take again, 25 g...

Embodiment 2

[0045] Take 10 grams of tin metal material and 100 grams of copper metal material, and put them into the intermediate frequency furnace through the feed port. The temperature of the intermediate frequency furnace is set at 1100-1200 °C. Stainless steel container, cooled for later use;

[0046] Pour the master alloy obtained in the above steps into a stainless steel container and fully mix it with 1000 grams of tin powder at a temperature of 200-300 ° C, stir for 60 minutes, and then let it stand for 180 minutes to make an alloy for later use;

[0047] When the temperature drops to 150-180°C, add 9 grams of potassium in the alloy prepared above, stir for 60 minutes, raise the temperature to 200-300°C, let it stand for 20 minutes, scoop out and cool, and make Alloyed for use;

[0048] The above alloy is prepared into tin alloy powder through powder atomization forming equipment through classification and screening;

[0049] Take again, 0.25 grams of copper and 0.4 grams of sil...

Embodiment 3

[0054] Take 10 grams of tin metal material and 100 grams of antimony metal material, and put them into the intermediate frequency furnace through the feed port. The temperature of the intermediate frequency furnace is set at 650-800 °C. Stainless steel container, cooled for later use;

[0055] Take 63 grams of tin metal material and 37 grams of lead metal material, and put them into the intermediate frequency furnace through the feed port. The temperature of the intermediate frequency furnace is set at 1300-1400 °C. Stainless steel container, cooled for later use;

[0056] Pour the master alloy obtained in the above steps into a stainless steel container and fully mix it with 1000 grams of tin powder at a temperature of 200-300 ° C, stir for 60 minutes, and then let it stand for 180 minutes to make an alloy for later use;

[0057] When the temperature drops to 150-180°C, add 12 grams of potassium metal powder to the alloy prepared above, stir for 60 minutes, raise the tempera...

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Abstract

The invention belongs to a kind of special solder paste for welding multi-level packaging chip components, which is specifically suitable for the application of the service temperature after welding is higher than 240 ℃, including tin alloy, nano metal, rare earth alloy and solder paste, tin alloy The powder is one or a mixture of tin-silver alloy powder, tin-antimony alloy powder, tin-copper alloy powder and tin-lead alloy powder; the nano-metal powder is one of copper powder, lead powder, titanium powder, cobalt powder and gold powder or multiple mixtures; the active ingredients of the described soldering paste include hydrogenated rosin, diethylene glycol monohexyl ether, succinic acid, tolyltriazole and citric acid; its preparation method includes preparing tin alloy powder, Nano-metal powder, rare-earth alloy powder, flux paste and mixing steps, adopting the invention of this technical solution, by adding elemental metal particles or alloy particles to the solder paste, and adding corresponding nano-auxiliary additives, the preparation cost is lower than Nano solder paste is easy to implement and has a wider range of applications.

Description

technical field [0001] The invention relates to a solder paste specially used for welding of multi-level packaging chip components, and is particularly suitable for applications where the service temperature after welding is higher than 240°C. The invention is an invention patent for a new use, which changes the composition and proportion of the solder paste originally used for welding multi-level packaging chip components. Background technique [0002] Interconnect solder joints provide electrical and mechanical connections and are an essential building block in electronic devices. Solder paste, as a new type of soldering material, has been widely used in the packaging of SMT components in recent years. Solder paste is a paste made of solder alloy powder and flux uniformly mixed. It is a kind of paste with the rapid development of SMT technology. It is a high-end soldering material that provides solder for reflow soldering to form solder joints, flux that promotes cleaning...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/02B23K35/26B23K35/40
CPCB23K35/025B23K35/40B23K35/262
Inventor 林文良
Owner 深圳群崴半导体材料有限公司
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