The invention discloses an electrotyping forming method of a
waveguide assembly. The electrotyping forming method includes the following steps that a transition
copper layer and a transition
nickel layer are sequentially manufactured on a mandrel in a plating manner; the mandrel is soaked in a plating solution, a
copper plating additive is added,
copper is manufactured on the transition
nickel layer in a plating manner obtain an electroformed layer under the stirring condition that the
current density is 2-6 A / dm<2> and the temperature is 20-30 DEG C, wherein the
size ratio of the plating solution to the
copper plating additive is 1:(0.003-0.01), the plating solution comprises
copper sulfate of 150-250 g / L,
chloride ions of 100-200 ppm, and
sulfuric acid of 50-100 mL / L, and UN3610 serves as the
copper plating additive; and the mandrel, the transition copper layer and the transition
nickel layer are removed through
chemical dissolution, and the
waveguide assembly is obtained. By means of the electrotyping forming method of the
waveguide assembly, the electroformed layer which is fine in
crystallization, compact in texture and good in tenacity can be obtained by selecting the appropriate plating solution, the appropriate
copper plating additive and the appropriate copper plating condition,
machining of the waveguide assembly is facilitated, and the rate of qualified products is increased.