38results about How to "Raise the pyrolysis temperature" patented technology

The invention relates to composition of a thermosetting resin. The thermosetting resin comprises dicyclopentadiene epoxy resin, benzoxazine, maleimide, styrene / maleic anhydride copolymer, filler, flame retardant and imidazole accelerant. The thermosetting resin is used for a high-speed transmission copper foil laminated plate, has the dielectric properties of low dielectric constant and low dissipation factor, and can be used for a high-speed signal transmission copper foil laminated plate. In addition, the thermosetting resin does not contain halogens, thereby having the advantage of environmental protection.

The invention discloses a biomass pyrolysis system and method through self-sufficient energy. The biomass pyrolysis system comprises a feeding device, a pyrolysis device, a separating and cooling device, an air flue gas component and a generating power component, wherein the pyrolysis device is connected with the feeding device so as to perform pyrolysis on the biomass raw materials; the separating and cooling device is connected with the pyrolysis device so as to receive and separate coke and pyrolysis gas output by the pyrolysis device; the air flue gas component is connected with the separating and cooling device so as to combust the pyrolysis gas and the preheated air and respectively feed the gas back to the feeding device and the pyrolysis device; and the generating power component is connected with the air flue gas component so as to convert the heat of the pyrolysis gas and the preheated air into mechanical energy and supplement the power source of the pyrolysis device and the separating and cooling device. According to the biomass pyrolysis system, the energy of the biomass pyrolysis gas product is subjected to gradient utilization, and the system has the advantages of self-sufficient energy, low cost and the like.

The invention discloses a thermosetting resin composition, which comprises the following components: bifunctional or multifunctional epoxy resin, styrene-maleic anhydride copolymer SMA as a curing agent with styrene / maleic anhydride molar ratio of 5-12:1, low-bromine or high-bromine BPA type epoxy resin or tetrabromo bisphenol A as a fire retardant, an accelerator and a solvent. The resin composition after curing has quite low dielectric property, higher heat reliability and better toughness, has quite low dielectric constant and dielectric loss coefficient, high Td, better toughness and excellent PCB processability with a copper-clad plate made of glass fiber cloth and other reinforcing materials, is suitable for manufacturing a copper-clad plate and a semi-cured plate for PCB, and can also be used in common application of the epoxy resin, such as molding resin, composite materials for buildings, automobiles and aviation, and the like.

The present invention provides a phosphorus compound of formula (I).The phosphorus compound is prepared by reacting a compound of formula (II) with alkylene carbonate.As compared with the conventional phosphorus compounds as flame-resistant additives, the phosphorus compound of the present invention has not only a high pyrolysis temperature but also excellent solubility in most of the organic solvents with high or low polarity, and is therefore a suitable flame-resistant additive for use in thermosetting or thermoplastic resins.

A polylactide derivative according to the present invention is expressed by the following general formula (1) or general formula (2):In general formula (1), one of X1-X5 is an aldehyde group, one of the other four is an alkoxy group, and the other three are hydrogen atoms.In general formula (2), one of R1-R3 is selected from a chlorine atom, fluorine atom, aldehyde group, alkoxy group, alkyl group and ester, while the other two are selected from the chlorine atom, fluorine atom, aldehyde group, alkoxy group, alkyl group, ester, and hydrogen atom.

The invention discloses a disc type reactor which comprises a drying or pyrolyzing tray (1), a rotation driving device used for driving the tray (1) to rotate and a gas distributing device used for conveying high-temperature gas into the tray (1). The gas distributing device comprises a gas distributing unit which is arranged under the tray (1) and can rotate along with the tray (1) and a hot blast main pipe (2) used for supplying gas to the gas distributing unit. The gas distributing unit communicates with the upper space of the tray (1), and the rotation driving device is located outside the gas distributing device. By adoption of the disc type reactor, higher drying or pyrolyzing temperatures can be obtained, and therefore the disc type reactor can meet pyrolyzing and upgrading requirements of coal of more types, central gas supply is adopted, and the height of a bed can be effectively decreased.

The invention discloses a method for preparing nanometer magnesium oxide through a plasma high temperature pyrolysis method, which belongs to the technical field of preparation of inorganic nanometer materials. According to the method, bischofite is used as a raw material, a plasma super-high-temperature rapid pyrolysis treatment is carried out on the bischofite, and a pyrolyzed crude product is simply treated to prepare high-purity nanometer magnesium oxide. The preparation method mainly comprises the following steps: triggering thermal plasma, and maintaining the stable operation of the thermal plasma; directly adding the bischofite into a plasma high-temperature arc zone to carry out pyrolysis; quenching a high temperature pyrolysis product and collecting a rough pyrolysis product; washing, filtering, drying and roasting the rough pyrolysis product to obtain the high-purity nanometer magnesium oxide with particle diameter being smaller than 50 nm and Mgo percentage composition being greater than 99%. The method disclosed by the invention can be used in direct pyrolysis of a large amount of bischofite rest after bromine and potassium extraction of salt lake brine, the pyrolysis speed is fast (within milliseconds), no wastewater is generated in the pyrolysis process, the added value of the product is high, the process is simple, and industrialization is easy to realize.

The invention discloses a novel triazole fluorescent coordination polymer and a preparation method and application thereof, and belongs to the technical field of organic synthesis. The chemical formula of the novel triazole fluorescent coordination polymer is Zn(C9H6O4)(C7H10N6).(H2O)2, the novel triazole fluorescent coordination polymer belongs to monoclinic crystal systems and has a space group of P21 / c(No.14), and has cell parameters: alpha is equal to gamma and is equal to 90 degrees, and beta is equal to 110.9890 (10) degrees; the novel triazole fluorescent coordination polymer uses Zn (OAc)2.2H2O, 5-methyl isophthalic acid and 1,3-bis(1, 2, 4-triazolo)-propane as reactants, and is prepared by a hydrothermal method. The novel triazole fluorescent coordination polymer is good in thermal stability and high in luminous intensity, is a new product synthesized in a laboratory, and is simple in preparation method and wide in application.

The invention discloses a thermoset resin composition, comprising the following ingredients of: bifunctional groups or polyfunctional group epoxy resin, phenylethylene-maleic anhydride copolymer (SMA) as a curing agent, diallyl bisphenol A-like allylphenol as a co-curing agent and a toughening agent, low-bromine or high-bromine BPA-type epoxy resin or tetrabromobisphenol A (TBBPA or TBBA) as a fire retardant, a proper accelerator and a solvent. The inventive resin composition has, after being cured, relatively low dielectric property and superior thermal reliability and toughness, includes, in contrast to a cooper clad laminate manufactured by reinforcing materials such as glass fiber cloth, relatively low dielectric constant (called Dk for short) and electric loss tangent (called Df for short), high Tg, high thermal cracking temperature (called Td for short), excellent toughness and favorable PCB processibility, is quite suitable for manufacturing the cooper clad laminate for PCB and prepreg, and can also applied to general uses of the epoxy resin, such as molding plastics and the like, and to composite materials for construction, automobile and aviation.