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Composition of thermosetting resin and copper foil laminated plate

A thermosetting and resin technology, applied in the direction of layered products, metal layered products, chemical instruments and methods, etc., can solve the problems of poor flame resistance, environmental pollution, low dielectric constant dissipation coefficient, etc., and achieve low dissipation coefficient, low Dielectric constant, the effect of overcoming environmental pollution

Active Publication Date: 2012-08-08
ELITE MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] It can be seen from the above description that in the existing technology for making circuit boards, no matter whether enough halogen-containing flame retardants are added to the thermosetting resin, the problems of poor flame resistance and environmental pollution cannot be effectively solved at the same time; therefore, the main purpose of the present invention It is to provide a composition of thermosetting resin with low dielectric constant and low dissipation coefficient. In the production process, a halogen-free and flame-retardant flame retardant is used to replace the halogen-containing flame-retardant in the prior art. agents to solve the above two problems at the same time

Method used

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  • Composition of thermosetting resin and copper foil laminated plate
  • Composition of thermosetting resin and copper foil laminated plate
  • Composition of thermosetting resin and copper foil laminated plate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0048] The composition of the thermosetting resin used in this embodiment contains 100 parts by weight of dicyclopentadiene epoxy resin, 100 parts by weight of phosphorus-containing hardening resin as a flame retardant, 65 parts by weight of styrene / maleic anhydride copolymer, 40 parts by weight of benzoxazine, 50 parts by weight of maleimide, 0.12 parts by weight of imidazole catalyst and 90 parts by weight of fused silica are used as fillers.

[0049] The fiber cloth is dipped in a solution containing the composition of the thermosetting resin. Then, the fiber cloth is dried at a temperature of 110 to 195° C. to prepare a B-state adhesive sheet for printed circuit boards. Then, the upper and lower sides of the adhesive sheet were covered with 35 μm thick copper foil, and heated and pressed with a vacuum press to prepare the copper foil laminate for high-speed signal transmission in Example 1.

Embodiment 2

[0051] The difference from Example 1 is that the content of maleimide in the composition of the thermosetting resin is changed from 50 parts by weight to 35 parts by weight, and the filler is changed to 70 parts by weight of kaolin. For the rest, the composition of the thermosetting resin and the copper foil laminate for high-speed signal transmission were prepared in the same manner as in Example 1.

Embodiment 3

[0053] Different from Example 1, the content of styrene / maleic anhydride copolymer is changed from 65 parts by weight to 80 parts by weight in the composition of the thermosetting resin, and the content of benzoxazine is changed from 40 parts by weight to 30 parts by weight. The content of silicon dioxide is changed from 90 parts by weight to 70 parts by weight. For the rest, the composition of the thermosetting resin and the copper foil laminate for high-speed signal transmission were prepared in the same manner as in Example 1.

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Abstract

The invention relates to composition of a thermosetting resin. The thermosetting resin comprises dicyclopentadiene epoxy resin, benzoxazine, maleimide, styrene / maleic anhydride copolymer, filler, flame retardant and imidazole accelerant. The thermosetting resin is used for a high-speed transmission copper foil laminated plate, has the dielectric properties of low dielectric constant and low dissipation factor, and can be used for a high-speed signal transmission copper foil laminated plate. In addition, the thermosetting resin does not contain halogens, thereby having the advantage of environmental protection.

Description

technical field [0001] The present invention relates to a thermosetting resin composition, in particular to a thermosetting resin composition with low dielectric constant and low dissipation factor, and used for making copper foil laminates for high-speed signal transmission. Background technique [0002] With the advancement of technology, people rely more and more on electronic products, and the most representative electronic products such as personal computers, notebook computers, personal digital assistants (PDAs) and mobile phones are integrating more and more functions in the product, and therefore, the circuit boards of electronic products have begun to be highly integrated, multi-layered and miniaturized. [0003] With the development of integration and miniaturization, signals between circuits are transmitted at a very high speed, so the problems of signal delay and transmission loss have become very serious and urgently need to be solved. Since the degree of signa...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08L25/08C08K13/02C08K5/357C08K3/36C08K3/34B32B15/092B32B15/20
Inventor 甘若兰余利智周立明彭义仁
Owner ELITE MATERIAL
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