The invention discloses a photon chip packaging structure based on a grating interface, and a manufacturing method for the photon chip packaging structure. The structure is characterized in that the structure comprises a photoelectron chip; an interconnection medium, wherein the surface, opposite to the photoelectron chip, of the interconnection medium is provided with a convex block; and an optical fiber coupling structure which is fixed on the photoelectron chip and is used for coupling with a back reflection grating on the photoelectron chip. The structure is provided with a multi-layer medium, the multi-layer medium is provided with a via hole, and the interior of the via hole is provided with an interconnection metal. The structure employs the mature rewiring technology, is simple in technology, achieves the leading-out of input / output interfaces, and can flexibly distribute the input / output interfaces according to the subsequent integration needs, thereby achieving the interlayer connection, avoiding the employing of the silicon through hole technology, and protecting the performance of the photoelectron chip. In addition, the photoelectron chip is disposed at the same side of the interconnection medium and a substrate, thereby enabling the photoelectron chip to be connected in an inverted buckling manner, improving the transmission speed, and improving the heat-dissipation effect.