Wilkinson power divider based on glass through hole technology

Abstract

The invention discloses a Wilkinson power divider based on a glass through hole technology. The Wilkinson power divider comprises a parallel plate condenser unit, a rewiring layer, three-dimensional solenoid inductor units and an isolating resistor; the power divider is composed of a reactance network consisting of lumped parameter elements, the three-dimensional solenoid inductor units and the parallel plate condenser unit which are compact in structure and low in loss are adopted, solenoid inductors passing through a glass substrate are taken as the lumped parameter elements of the power divider, the solenoid inductors take full advantage of the characteristics of glass through hole vertical arrangement and low electric loss, the power divider is small in area, large in inductance valueand low in loss, and the dimensions of the power divider are greatly decreased; the volume of the power divider is greatly reduced, and the performance of the power divider is guaranteed while the integration level of the circuit is improved. According to the power divider disclosed by the invention, input signal power can be halved into two output ports, the power divider has the advantages of low power loss, high port isolation, small phase difference, compact dimensions and the like, and the power divider is particularly applicable for micro three-dimensional heterogeneous integration packaging.

Description

technical field [0001] The invention belongs to the technical field of microwave passive devices, and in particular relates to a Wilkinson power splitter based on through-glass-hole technology. Background technique [0002] Heterogeneous three-dimensional integration is an advanced packaging technology. It realizes the horizontal interconnection and vertical communication of different chips through glass vias and glass substrates, which significantly improves the performance of the circuit and reduces the packaging size of the communication system. However, traditional RF passive devices, such as power splitters, filters, antennas, etc., usually contain inductors with large inductance values ​​and large intrinsic dimensions, which cannot be integrated into the same package with other communication circuit units, and still require Placed on the printed circuit board outside the package structure, resulting in an increase in the size of the entire communication system. [000...

AI Technical Summary

Problems solved by technology

[0004] Traditional power splitters are generally prepared on the surface of a lossy silicon substrate, which has a large signal loss. For example, the insertion loss of the microstrip line power splitter prepared by Najieb.N et al. has reached 3.5dB, and the low temperature The insertion loss of the co-fired ceramic power divider reaches 4.1dB

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