The invention relates to a
gyroscope with a vibrating structure, produced by micromachining in a thin
wafer, which comprises a movable inertial
assembly (1) comprising at least one movable
mass (50) able to vibrate in the plane of the
wafer along a drive axis x and along a sense axis y roughly perpendicular to the x-axis, an interdigital sensor comb (90) and an interdigital drive comb (70). It furthermore comprises at least one additional interdigital comb (10a), called the quadrature-error compensation comb, connected to the
mass (50) and which has two asymmetric air gaps e and λe, λ being a positive real number, for subjecting the
mass to an adjustable electrostatic stiffness due to
coupling between the x-axis and the y-axis by applying a variable
DC voltage V to this comb, the
adjustable stiffness allowing compensation for the
quadrature error of the
gyroscope.