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Packaging technology for novel fingerprint lock device

A packaging process and fingerprint lock technology, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as reducing the height of modules, improve product reliability, increase the contact area of ​​interconnecting wires, and reduce the total thickness Effect

Active Publication Date: 2015-06-03
苏州科阳半导体有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The Touch ID packaging structure announced by Apple’s patent text is realized by wire bonding, but only grooves are dug on the surface of the chip to reduce the height of the module after wire bonding. Therefore, in the packaging technology of advanced fingerprint chips, there are still no I have not seen the packaging form and patent of the fingerprint identification chip that really adopts the wafer-level TSV packaging technology

Method used

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  • Packaging technology for novel fingerprint lock device
  • Packaging technology for novel fingerprint lock device
  • Packaging technology for novel fingerprint lock device

Examples

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Effect test

Embodiment 1

[0037] Embodiment 1: a kind of packaging technology for novel fingerprint lock device, described novel fingerprint lock device comprises fingerprint identification chip 1, ceramic cover plate 15, flexible PCB board 16 and data processing chip 17, the fingerprint identification chip 1 A high dielectric constant layer 18 is arranged between the sensing area and the ceramic cover plate 2, and the flexible PCB board 16 and the data processing chip 17 are both electrically connected to the fingerprint identification chip 1;

[0038] Several blind holes 2 are distributed on the upper surface of the fingerprint identification chip 1, and the blind holes 2 of the fingerprint identification chip 1 have an aluminum pad 3, and the aluminum pad 3 extends from the bottom of the blind hole 2 to the middle of the blind hole 2, and The surface of the aluminum pad 3 in the hole 2 is filled with a nickel metal layer 4, and the nickel metal layer 4 extends from the middle of the blind hole 2 to t...

Embodiment 2

[0052] Embodiment 2: A kind of packaging technology for novel fingerprint lock device, described novel fingerprint lock device comprises fingerprint identification chip 1, ceramic cover plate 15, flexible PCB board 16 and data processing chip 17, the fingerprint identification chip 1 A high dielectric constant layer 18 is arranged between the sensing area and the ceramic cover plate 2, and the flexible PCB board 16 and the data processing chip 17 are both electrically connected to the fingerprint identification chip 1;

[0053] Several blind holes 2 are distributed on the upper surface of the fingerprint identification chip 1, and the blind holes 2 of the fingerprint identification chip 1 have an aluminum pad 3, and the aluminum pad 3 extends from the bottom of the blind hole 2 to the middle of the blind hole 2, and The surface of the aluminum pad 3 in the hole 2 is filled with a nickel metal layer 4, and the nickel metal layer 4 extends from the middle of the blind hole 2 to t...

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PUM

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Abstract

The invention discloses a packaging technology for a novel fingerprint lock device. The novel fingerprint lock device comprises a fingerprint recognition chip, a ceramic cover plate, a flexible PCB and a data processing chip. The packaging technology comprises the following steps: filling the surfaces of aluminum welding pads in blind holes of the fingerprint recognition chip with nickel metal layers to extend out of the upper surface and form bulges so as to form bonding pad thickening parts; coating the upper surface, having the bonding pad thickening parts, of the fingerprint recognition chip with a temporary bonding adhesive layer; bonding a glass supporting plate with the surface, having the bonding pad thickening parts, of the fingerprint recognition chip through the temporary bonding adhesive layer; thinning the lower surface opposite to the upper surface of the fingerprint recognition chip so as to reduce the thickness of the fingerprint recognition chip to about 150-300 microns; sequentially forming a first tapered blind hole, a second tapered blind hole and third tapered blind holes in the lower surface of the fingerprint recognition chip by etching gradually. After wafer-level chip packaging technology and a silicon through hole technology are integrated, a set of novel process is formed, so that the thickness is reduced, the total thickness of a product is greatly reduced and the reliability of the product is greatly improved.

Description

technical field [0001] The invention relates to a packaging process for a novel fingerprint lock device, which belongs to the technical field of semiconductor packaging. Background technique [0002] In terms of advanced packaging technology for fingerprint chips, after the release of Apple's iPhone 5S and its matching Touch ID fingerprint recognition technology, it announced a brand new fingerprint recognition chip. , which uses the wafer-level packaging technology to dig grooves on the side of each chip and redo the pads, and then uses the well-known low loop height (low loop height) wire bonding technology to complete the module packaging in the later stage to reduce the mold Group height is a transitional technology that mixes wafer-level packaging and traditional packaging. The Touch ID packaging structure announced by Apple’s patent text is realized by wire bonding, but only grooves are dug on the surface of the chip to reduce the height of the module after wire bondi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/50H01L21/60
Inventor 黄双武赖芳奇王邦旭吕军刘辰
Owner 苏州科阳半导体有限公司
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