Packaging technology for novel fingerprint lock device
A packaging process and fingerprint lock technology, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as reducing the height of modules, improve product reliability, increase the contact area of interconnecting wires, and reduce the total thickness Effect
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0037] Embodiment 1: a kind of packaging technology for novel fingerprint lock device, described novel fingerprint lock device comprises fingerprint identification chip 1, ceramic cover plate 15, flexible PCB board 16 and data processing chip 17, the fingerprint identification chip 1 A high dielectric constant layer 18 is arranged between the sensing area and the ceramic cover plate 2, and the flexible PCB board 16 and the data processing chip 17 are both electrically connected to the fingerprint identification chip 1;
[0038] Several blind holes 2 are distributed on the upper surface of the fingerprint identification chip 1, and the blind holes 2 of the fingerprint identification chip 1 have an aluminum pad 3, and the aluminum pad 3 extends from the bottom of the blind hole 2 to the middle of the blind hole 2, and The surface of the aluminum pad 3 in the hole 2 is filled with a nickel metal layer 4, and the nickel metal layer 4 extends from the middle of the blind hole 2 to t...
Embodiment 2
[0052] Embodiment 2: A kind of packaging technology for novel fingerprint lock device, described novel fingerprint lock device comprises fingerprint identification chip 1, ceramic cover plate 15, flexible PCB board 16 and data processing chip 17, the fingerprint identification chip 1 A high dielectric constant layer 18 is arranged between the sensing area and the ceramic cover plate 2, and the flexible PCB board 16 and the data processing chip 17 are both electrically connected to the fingerprint identification chip 1;
[0053] Several blind holes 2 are distributed on the upper surface of the fingerprint identification chip 1, and the blind holes 2 of the fingerprint identification chip 1 have an aluminum pad 3, and the aluminum pad 3 extends from the bottom of the blind hole 2 to the middle of the blind hole 2, and The surface of the aluminum pad 3 in the hole 2 is filled with a nickel metal layer 4, and the nickel metal layer 4 extends from the middle of the blind hole 2 to t...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com