The invention discloses a chemical
copper plating solution and a method for chemical
copper plating. The chemical
copper plating solution comprises the components including, by
mass concentration, a main salt, a
reducing agent, a complexing agent, a stabilizer, an accelerator, a surfactant and the balance
ultrapure water. The chemical
copper plating solution further comprises a pH value
regulator and an additive, wherein the additive is
polyvinylpyrrolidone and
sodium diphenylaminesulfonate. The chemical
copper plating method comprises the steps of alkaline oil removal, micro-
etching, preimpregnation, activation,
peptization and
copper deposition. Alkaline oil removal, micro-
etching, preimpregnation, activation and
peptization are pretreatment procedures to adsorb colloidal
palladium particles to a PCB to be plated with copper. In the
copper deposition process, copper ions are catalytically reduced to the PCB to be plated with copper through the chemical
copper plating solution. In the chemical copper plating solution, the
polyvinylpyrrolidone and the
sodium diphenylaminesulfonate are used as the combined additive, so that the chemical copper plating solution has the characteristics of being
environmentally friendly, low in price and easy to obtain, and the copper plating effect can be effectively improved while the copper plating rate is ensured.