The invention discloses a manufacturing method for a
printed circuit board coveried with
coating copper layers, and relates to the circuit board production and
manufacturing technology field. The manufacturing method comprises the following steps: firstly, a circuit board with a surface covered with
copper foil is provided, part of
copper is etched in a position, corresponding to a position of the circuit board needing drilling of a through hole, of the
copper foil surface, thus a recess groove is formed in the
copper foil surface, and the size of the recess groove is more than the hole
diameter of through hole; secondly, the through hole in the first step is drilled; thirdly, full plate
electroplating is carried out, and thus the surface of the circuit board and the inner wall of the through hole are covered with copper layersl fourthly, the through hole is subjected to resin filling, the resin for filling is subjected to flatting
processing, and thus the outer surface of the covering copper layer is flat. The manufacturing method facilitates to remove the filling resin at the dense hole, manufacturing of
copper coating is carried out after part of the recess groove is subjected to electrocoppering, and electrocoppering in the recess groove leaves
copper reduction allowance for board wearing, and facilities flatting
processing of the hole position. In addition, the contact area of the covered copper layer and the surface
copper foil of the circuit board are increased, and the
bonding strength is high.