51results about How to "Fully fill the gap" patented technology

The invention relates to a pressure welding method for large-area target which belongs to the welding field of metallic materials, and the method comprises the following steps that: (1) a roughening treatment is applied to the surface to be welded of the target; (2) the surface to be welded of a backplane is processed into a non-planar structure; (3) the surfaces to be welded of the target and backplane are washed and dried: (4) the backplane is heated and the preheated target or target at normal temperature is placed on the backplane and pressed, so as to deform the curved surface of the backplane till a bonding between two surfaces to be welded is achieved by pressing; (5) the target and the backplane are heated to the temperature which is 0.50 to 0.85 time of the melting point of one with lower melting point in the both and welded under the condition of heat insulation after being clamped tightly. The method has low processing requirement for the equipment and the surface to be welded and can ensure that no oxygen problem exists between the large-area target and the surface to be welded of the backplane, the air around the contacting surface between the target and the backplaneis completely discharged, firm bonding between the target and the backplane is realized in the atmosphere environment, simultaneously the microstructure performance of the target is not affected and problems of severe deformation, etc do not happen to the bonding surface between the target and the backplane.

The invention provides a high temperature resistant and low-modulus heat conducting organic silicon material which is prepared from the following raw materials: silicone oil, heat conducting powder filler, a low-modulus auxiliary, a high temperature resistant auxiliary, a crosslinking agent and a platinum catalyst, wherein the mass ratio of the silicone oil to the heat conducting powder filler is (90-110):(900-1,100); the mass ratio of the heat conducting powder filler to the low-modulus auxiliary is 100:(0.5-2); the mass ratio of the silicone oil, the high temperature resistant auxiliary, the crosslinking agent and the platinum catalyst is 100:(0.1-1):(5-15):(0.1-0.2) in turn. The invention belongs to the technical field of organic silicone. The heat conducting organic silicon material provided by the invention has the advantages of high long-term stability of heat dissipation in a high-temperature condition, low modulus, easy gap fitting, low thermal resistance and no oil leakage or volatilization; automatic adhesive dispensing construction can be realized; a better interface heat conducting material is provided between a heating component of an electronic appliance and a heat dissipation device or apparatus.

The invention discloses a novel 3D printer and a printing process control method thereof. The novel 3D printer comprises a printer body which comprises a cabinet, a first support and a second support, wherein the first support and the second support are arranged on the two sides of the cabinet; a laser scanning device is arranged on the bottom face of the cabinet, a reflector is arranged in the center of the bottom face of the cabinet, and a resin groove is formed over the reflector; high-transmitting quartz glass is fixedly arranged on the bottom face of the resin groove and fixedly arranged on an iron plate, a lifting table is arranged over the resin groove, and the iron plate is connected with a first lifting device; and the lifting table is connected with a second lifting device which is arranged on the first support, and a resin extrusion mechanism is arranged on the second support. As the first lifting device, the second lifting device and the resin extrusion mechanism are in linkage, the control process is simplified according to the 3D printer and the printing process control method of the 3D printer; and in addition, accurate control over the resin flake thickness of the section profile of a product is facilitated.

The invention belongs to the technical field of a rubber conveyor belt product, and particularly relates to a straight conveyor belt finger-model connector and a preparation method thereof. The straight conveyor belt finger-model connector comprises a straight finger-model skeleton structure, wherein the straight finger-model skeleton structure comprises a straight canvas layer; a rubberizing layer is arranged on the surface of the straight finger-model skeleton structure; a textile layer playing a reinforcement effect is arranged on the rubberizing layer; and a coverage rubber layer is arranged on the textile layer. The preparation method of the straight conveyor belt finger-model connector comprises the following steps of (1) stripping coverage adhesive; (2) removing residual adhesive; (3) cutting a finger model; (4) coating adhesive cement; (5) splicing the finger model; (6) forming a finger-model connector; and (7) vulcanizing the finger-model connector. Due to the adoption of the straight conveyor belt finger-model connector, the strength of the connector is improved; and the preparation method is simple and easy to operate.

A tungsten-based material with both solid solution and dispersion strengthening and a preparation method thereof belong to the technical field of powder preparation engineering. The preparation method uses industrially pure W powder and Zr and M metals as raw materials. First, ZrM amorphous strips are obtained by arc melting and strip quenching technology; Mixing and preparing materials; finally, the materials are ball milled, pressed and sintered to obtain blocks (W 100‑a Zr a ) 100‑b m b Tungsten-based materials. The tungsten-based material includes W, Zr and M elements, wherein M is one of Fe, Co and Ni elements, a and b are atomic percentages, and their values ​​are 0.5≤a≤8, 0<b≤3. The invention can fully fill the gap between W powder particles to obtain a high-density sintered body of tungsten-based materials; the obtained product has both solid solution and dispersion double strengthening characteristics; it is beneficial to improve the strengthening and toughening effect of tungsten-based materials, and greatly broadens the The preparation of materials controls process parameters, which helps to reduce material production costs and improve material yield and production efficiency.

The invention relates to a low-quantity super-hydrophobic packaging paper and a preparation method thereof, comprising packaging base paper, a hydrophobic coating, a micron-structure coating and a nano-structure coating; the hydrophobic coating is composed of low melting point wax; the micron structure The coating is composed of high melting point wax; the nanostructure coating is composed of modified nano silicon dioxide. The packaging base paper is obtained by wax emulsion coating and modified silica coating, and then soft roll calendering; the mixed wax is in the state of micron particles, which can fully fill the gaps between the fibers on the surface of the paper; at the same time, the hydrophobic nano-silica particles are filled Between the fiber and the micron wax, a hydrophobic micro-nano structure is formed, which can significantly improve the hydrophobicity of the paper, increase the contact angle and reduce the rolling angle; the whole production process is simple to operate, low energy consumption, environmentally friendly, and does not involve fluorine chemicals or organic solvents. It has a good application prospect.