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Method for preparing gluing component

A component and gluing technology, applied in the field of optical glue, can solve problems such as bubbles on the edge of decorative ink

Active Publication Date: 2013-10-02
ANHUI JINGZHUO OPTICAL DISPLAY TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

OCA is a non-substrate double-sided adhesive in an adhesive state. The adhesive component obtained by bonding the panel and the sensor circuit with the OCA using the traditional process is easy to produce air bubbles on the edge of the decorative ink.

Method used

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  • Method for preparing gluing component
  • Method for preparing gluing component
  • Method for preparing gluing component

Examples

Experimental program
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Effect test

preparation example Construction

[0033] Such as figure 1 Shown, the preparation method of the adhesive assembly of an embodiment, comprises the following steps:

[0034] S10, providing a first base material and a second base material.

[0035] The first base material and the second base material refer to parts that need to be bonded with transparent optical adhesive. In the touch screen field, the first substrate is a panel, and the second substrate is a sensor circuit.

[0036] S20. Bonding the first base material and the second base material by using transparent optical adhesive to obtain the bonded first base material and the second base material.

[0037] Transparent optical glue includes the following components in the following weight percentages:

[0038]

[0039] The polymer resin may be selected from at least one of acrylate polymer, epoxy resin and polyvinyl ether.

[0040] The organic monomer may be selected from at least one of acrylate and vinyl ether.

[0041] The organic solvent may be ...

Embodiment 1

[0059] Add 50 g of polymethyl methacrylate, 29 g of ethyl acrylate and 1 g of quinone diazide into 20 g of tetrahydrofuran solution, and mix well to prepare transparent optical adhesive 1. After laminating the panel and the sensor circuit with transparent optical adhesive 1, defoaming treatment was performed at 40°C and a pressure of 0.65Mpa for 40 minutes to remove the air bubbles in the transparent optical adhesive 1. Next, use a wavelength of 365nm and an energy of 3000mj / cm 2 The ultraviolet light irradiates the transparent optical adhesive to harden the transparent optical adhesive 1 . The electronic device obtained after laminating the panel and the sensor circuit with the transparent optical adhesive 1 has almost no air bubbles and has a flat surface.

Embodiment 2

[0061] Add 80g polymethyl methacrylate, 10g ethyl ethacrylate and 3.8g diazonaphthoquinonesulfonyl chloride to 5g cyclohexanone, then add 0.5g p-methoxyphenol, 0.2g diisononyl phthalate ester and 0.5g of fatty acid ester, mixed evenly to prepare transparent optical adhesive 2. After laminating the panel and the sensor circuit with transparent optical adhesive 2, defoaming treatment was performed at 80°C and a pressure of 0.6Mpa for 10 minutes to remove air bubbles in the transparent optical adhesive 2. Next, use a wavelength of 365nm and an energy of 500mj / cm 2 The ultraviolet light is irradiated to the transparent optical adhesive to harden the transparent optical adhesive 2 . The electronic device obtained after laminating the panel and the sensor circuit with the transparent optical adhesive 2 has almost no bubbles and a flat surface.

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Abstract

A method for preparing a gluing component comprises the following steps: providing a first base material and a second base material; adopting transparent optical cement to glue the first base material and the second base material; heating and debubbling the first base material and the second base material which are glued; and adopting ultraviolet light to irradiate and harden the first base material and the second base material which are heated, debubbled and glued, and obtaining the gluing component. According to the method for preparing the gluing component, the transparent optical cement is softened and has a certain fluidity through the heating and debubbling, so that a gap between glued objects can be sufficiently filled; meanwhile, bubbles between the transparent optical cement and the glued objects are removed completely through the vacuum debubbling treatment; and then the transparent optical cement is hardened through ultraviolet light irradiation, so that a gluing property is sufficiently achieved, gas molecules in the hardened optical cement has low possibility of accumulation, then visually visible accumulated bubbles are not formed, and accordingly, the problem of bubbles of the gluing component can be effectively solved.

Description

technical field [0001] The invention relates to the field of optical adhesives, in particular to a method for preparing adhesive components. Background technique [0002] Currently, there are two types of adhesives used for bonding electronic devices: Optically Clear Adhesive (OCA for short) and Liquid Optically Clear Adhesive (LOCA for short). [0003] When the electronic device is bonded, especially when the panel and the sensor circuit are bonded, since the panel is printed with decorative ink, there is a gap in thickness between the frame of the panel and the window area. OCA is a non-substrate double-sided adhesive in an adhesive state. The adhesive component obtained by bonding the panel and the sensor circuit with the OCA using the traditional process is easy to generate air bubbles at the edge of the decorative ink. Contents of the invention [0004] Based on this, it is necessary to provide a method for preparing an adhesive component with less air bubbles. [0...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J5/00C09J5/06C09J4/02C09J4/06
Inventor 唐根初刘伟唐彬董绳财
Owner ANHUI JINGZHUO OPTICAL DISPLAY TECH CO LTD
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