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Thermolysis cream, and prepartion method

A technology of heat dissipation paste and thermal conductivity, which is applied in the field of heat dissipation paste and its preparation, and can solve the problems of affecting heat transfer effect and low thermal impedance

Inactive Publication Date: 2007-02-21
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the sheet-shaped thermal interface material 10 cannot completely fill the gap 50, so that there is still a gap 51 between the radiator 20 and the heating element 30, and the high thermal resistance caused by air will still affect the heat transfer effect.
[0004] In addition, the thermal resistance of the thermal interface material itself is another factor that affects the heat transfer effect. Traditional thermal interface materials seldom take this factor into account. Thermal paste with low thermal impedance

Method used

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  • Thermolysis cream, and prepartion method
  • Thermolysis cream, and prepartion method
  • Thermolysis cream, and prepartion method

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Embodiment Construction

[0022] The thermal paste and its preparation method will be further described in detail below with reference to the accompanying drawings and embodiments.

[0023] The thermal paste of this embodiment includes a polymer matrix with a thermal conductivity of 0.1-0.2W / mK (W / m·K) and a thermally conductive filler with a thermal conductivity of 20-1000W / mK. The thermally conductive filler and the polymer matrix The mass ratio is 3:1~7:1.

[0024] The optimal mass ratio of the above-mentioned thermally conductive filler to the polymer matrix is ​​4:1, and the resulting heat dissipation paste has the best heat dissipation effect and the minimum thermal resistance. The polymer matrix is ​​a polyhydroxy ester substance. The particle size of the thermally conductive filler is less than 1 μm, preferably 0.5-1 μm. The thermally conductive filler includes zinc oxide powder, aluminum nitride powder, silicon carbide powder and the like.

[0025] The preparation method of the thermal past...

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Abstract

This invention relates to a method for preparing heat-dissipation grease, which comprises a polymer matrix and a heat-conducting filler at a weight ratio of (3-7): 1. The thermal conductivity coefficients of the polymer matrix and the heat-conducting filler are 0.1-0.2 W / mK and 20-1000 W / mK, respectively. The method comprises: providing a polymer matrix and a heating-conducting filler, and mixing at a weight ratio of (3-7): 1 to obtain the heat-dissipation grease.

Description

【Technical field】 [0001] The invention relates to a thermal interface material, in particular to a thermal paste with lower resistance and a preparation method thereof. 【Background technique】 [0002] In recent years, with the rapid development of the integration process of semiconductor devices, the degree of integration of semiconductor devices has become higher and higher, and the volume of devices has become smaller and smaller. The demand for heat dissipation has become an increasingly important issue. To meet this requirement, various heat dissipation methods such as fan heat dissipation, water-cooled auxiliary heat dissipation, and heat pipe heat dissipation are widely used, and certain heat dissipation effects have been obtained. [0003] figure 1 It is a schematic diagram of the state of use of the radiator in the prior art. Due to the unavoidable surface roughness of the radiator 20 and the heating component 30, a gap 50 is formed between the radiator 20 and the h...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09K5/08
CPCH01L23/3737H01L2924/0002H01L2924/3011H01L23/42H01L2924/00
Inventor 萧博元
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD
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