488results about How to "Increase connection area" patented technology

The present invention discloses that a primary and a secondary winding coil are respectively wound around the core and are separated by an insulating layer; and the secondary winding coil has a winding portion wound around the core through at least a circle to define two winding terminals, wherein each winding terminal of the winding portion is connected with an extending section extended to the outside of the transformer and is connected with an electricity connecting section at the rear end thereof. The electricity connecting section has plural pins electrically welded on a circuit board, thereby the extending section that is connected with a rectification switch and increases the contact areas with the air for achieving a heat-dispersing effect and the electricity connecting section are crossing connected between the secondary winding coil and the circuit board to save the space on the circuit board for arranging the secondary winding coil.

Provided is a chip-type semiconductor ceramic electronic component having a ceramic body composed of a semiconductor ceramic, first external electrodes formed on the both end surfaces of the ceramic body, and second external electrodes extending to cover the surfaces of the first external electrodes and a part of a side surface of the ceramic body. The electronic component has a small resistance value variance and a small thermal shock resistance change, and in the electronic component, excellent substrate mounting is performed. When a curvature radius of a corner section of the ceramic body is expressed by R([mu]m), the maximum thickness of a layer brought into contact with the ceramic body, among the first external electrode layers, from an end surface of the ceramic body is expressed by y ([mu]m), and the minimum thickness of a layer brought into contact with the side surfaces of the ceramic body, among the second external electrodes, from the apex of the corner section of the ceramic body is expressed by x ([mu]m), an inequality of 20<=R<=50 is satisfied, and when 0.5<=x<=1.1, an inequality of -0.4x+0.6<=y<=0.4 is satisfied, and when 1.1<=x<=9.0, an inequality of -0.0076x+0.16836<=y<=0.4 is satisfied.

A manufacturing method for a wiring circuit board includes the steps of: forming a board on a surface of a metal layer directly or indirectly through an etching barrier layer; forming an insulating film on the surface of the metal layer; polishing the insulating film to an extent to which a top face of the bump is exposed; and forming a solder ball on the top face of the bump.

The invention belongs to the technical field of accessories for assembling profiles, and particularly relates to a compound angle code for corner combinations of the profiles. The compound angle code for the corner combinations of the profiles comprises a first angle code body and a second angle code body which are symmetrically arranged, wherein a first diversion groove which extends along first connection arms and second connection arms is formed in the inner side face of a corner, a first gel injection groove is formed in the outer side face of an adjacent portion of each two adjacent first connection arms, a second gel injection groove is formed in the outer side face of an adjacent portion of each two adjacent second connection arms, a second diversion groove is formed in the outer side face of the corner, a third diversion groove is formed in a corner on an adjacent face of the first angle code body and the second angle code body, the third diversion groove is respectively communicated with the first diversion groove, the first gel injection grooves, the second gel injection grooves and the second diversion groove, and forth diversion grooves respectively communicated with the first diversion groove and the second diversion groove are formed in a corner on a side face of the first angle code body, far away from the adjacent face, and a corner on a side face of the second angle code body, far away from the adjacent face. When used, the compound angle code for the corner combinations of the profiles can improve connection strength of the profiles after the corner combinations, simultaneously can improve flatness of corner combination portions of the profiles, and prevents water from leaking through the corner combination portions of the profiles.

A vehicle body front part structure of a vehicle capable of suppressing the upward deformation of side members and pitching in collision by securely transmitting an input in the collision from the side members to an apron member. Rigid members (20) are fixedly installed across the front end part (8c) of the apron member (8) and the side members (2), and the forward parts of the rigid members (20) are tilted diagonally downward so as to form a roughly linear shape from the apron member (8) toward the side members (2) as viewed from the side of the vehicle to distributedly transmit the input into the side members in the collision of the vehicle to the apron member (8) through the rigid members (20) and to suppress the upward deformation of the side members (2) by the rigid member (20).