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Chip-type semiconductor ceramic electronic component

一种电子元器件、半导体的技术，应用在电气元件、电阻器零部件、电阻器等方向，达到减小偏差、增大连接面积、减小电阻变化的效果

Active Publication Date: 2010-12-22
MURATA MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a result, since the distance between the first external electrode 13a and the first external electrode 13b of each chip-type semiconductor ceramic electronic component 11 varies, the variation in resistance value becomes a big problem.

Method used

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  • Chip-type semiconductor ceramic electronic component

Examples

Experimental program
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Embodiment 1

[0063] First, prepare BaCO 3 , PbO, SrCO 3 , CaCO 3 , TiO, Er as a semiconducting agent 2 o 3 , Mn as a characteristic improver 2 o 3 , SiO as a sintering aid 2 As the starting material, and prepare the starting material shown in Table 1 and weighed according to the proportion shown in the following formula.

[0064] ((Ba, Pb, Sr, Ca) 0.0096 Er 0.004 ) TiO 3 +0.0005MnO 2 +0.02SiO2 2

[0065] Next, add pure water to various weighed starting materials, mix and pulverize them together with PSZ balls in a ball mill, after drying, pre-fire at 1150°C for 2 hours, and then pulverize them together with PSZ balls in a ball mill again to obtain Burnt powder. Next, an acrylic organic binder, a dispersant, and water were added to the obtained calcined powder, mixed with PSZ balls for 15 hours, granulated, and dried to obtain a ceramic raw material.

[0066] Then, the obtained ceramic raw material is used to form an unfired mother substrate, and after the binder is removed, t...

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Abstract

Provided is a chip-type semiconductor ceramic electronic component having a ceramic body composed of a semiconductor ceramic, first external electrodes formed on the both end surfaces of the ceramic body, and second external electrodes extending to cover the surfaces of the first external electrodes and a part of a side surface of the ceramic body. The electronic component has a small resistance value variance and a small thermal shock resistance change, and in the electronic component, excellent substrate mounting is performed. When a curvature radius of a corner section of the ceramic body is expressed by R([mu]m), the maximum thickness of a layer brought into contact with the ceramic body, among the first external electrode layers, from an end surface of the ceramic body is expressed by y ([mu]m), and the minimum thickness of a layer brought into contact with the side surfaces of the ceramic body, among the second external electrodes, from the apex of the corner section of the ceramic body is expressed by x ([mu]m), an inequality of 20<=R<=50 is satisfied, and when 0.5<=x<=1.1, an inequality of -0.4x+0.6<=y<=0.4 is satisfied, and when 1.1<=x<=9.0, an inequality of -0.0076x+0.16836<=y<=0.4 is satisfied.

Description

technical field [0001] The present invention relates to a PTC (Positive Temperature Coefficient, positive temperature coefficient) thermistor, an NTC (Negative Temperature Coefficient, negative temperature coefficient) thermistor, and a chip-type semiconductor ceramic in which ceramic bodies such as resistors are formed from semiconductor ceramics Electronic Component. Background technique [0002] In recent years, miniaturization and surface packaging are being developed in the field of electronic equipment. For example, chips are also being developed in chip-type semiconductor ceramic electronic components such as PTC thermistors, NTC thermistors, and resistors. As such a chip-formed semiconductor electronic component, for example, a chip-type semiconductor ceramic electronic component as in Patent Document 1 is known. Image 6 It is a schematic cross-sectional view of a conventional chip-type semiconductor ceramic electronic component 11 shown in Patent Document 1. FIG. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01C1/142H01C7/02H01C7/04H01C7/10
CPCH01C1/142H01C7/04H01C7/02H01C7/10
Inventor 胜木隆与阿部吉晶
Owner MURATA MFG CO LTD
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