91results about How to "Reduces the possibility of short circuits" patented technology

The invention provides a negative plate for a lithium slurry battery. The negative plate comprises an insulated sealing frame, a lithium-containing metal body and an intercalated lithium collector structure layer, wherein the intercalated lithium collector structure layer, the lithium-containing metal body and another intercalated lithium collector structure layer form a sandwich composite structure; the insulated sealing frame seals the surrounding margins of the sandwich composite structure; and the material of the intercalated lithium collector structure layer contains the lithium intercalated material which can intercalate lithium in the charge and discharge process of the lithium slurry battery. The intercalated lithium collector structure layer in the negative plate can play the roleof intercalating lithium during charging, and avoid the deposition of lithium on the surface of the lithium-containing metal body to form lithium dendrites, thereby improving the safety of the battery. Besides, the lithium-containing metal body can also be used as a lithium source to effectively supplement the consumption on positive electrode lithium of the side reaction in the process of negative SEI membrane formation and battery cycle. In addition, a common collector of the lithium-containing metal body and the intercalated lithium collector structure layer makes the current collection effect uniform, and avoids the occurrence of heating and so on caused by high-rate charge and discharge.

In a polymer electrolyte battery including a battery element having a cathode and an anode coiled through a polymer electrolyte, a section of the battery element perpendicular to the coiling axis has a curved form. As compared with a polymer electrolyte battery having a flat plate type battery element curved, the former battery has an extremely low possibility of short-circuit at the end of an electrode and excellent battery characteristics.

The present invention discloses an array substrate, a touch control display panel and a touch control display device. The array substrate comprises a substrate, a display area and a non-display area around the display area. The non-display area is provided with a driving chip. The display area comprises a plurality of data lines which are electrically connected to the driving chip through multiple first connection lines. The data lines are corresponding to the first connection lines one to one. The array substrate also comprises multiple touch control electrode blocks which are electrically connected to the driving chip through multiple touch control signal lines. In the non-display area, the multiple touch control signal lines and the multiple first connection lines are not overlapped in a direction perpendicular to the substrate. According to the array substrate, the touch control display panel and the touch control display device, the capacitance between the touch control signal lines and the first connection lines is reduced, and thus the possibilities of electrostatic discharge and open or short circuit caused by the electrostatic discharge are reduced.

The invention discloses a preparation method of a high-density garnet all-solid electrolyte under low temperature and an application of the high-density garnet all-solid electrolyte. The method comprises the following steps: 1) adding raw materials to a ball milling tank according to the stoichiometric ratio of LLZO, adding isopropanol as a grinding aid and carrying out ball milling and drying; 2)compacting the dried powders in a corundum porcelain boat, and then, carrying out heating and roasting to prepare LLZO precursor powders; 3) further milling a part of the LLZO precursor powders through high-energy ball milling; 4) mixing and pressing the LLZO precursor powders and the LLZO precursor powders obtained after high-energy ball milling into a sheet to obtain an electrolyte sheet; and 5) placing the electrolyte sheet into the corundum porcelain boat for powder embedded sintering to obtain a high-purity LLZO electrolyte sheet. Compared with other solid state sintering methods, the method is lower in sintering temperature and sheet compressing pressure of the garnet electrolyte sheet, thereby reducing production cost of the garnet electrolyte.

The invention discloses an array substrate. The array substrate comprises a substrate body, connection terminals, a flat layer and pixel electrodes; the connecting terminals are positioned on the substrate body, arranged close to the boundary of the substrate body, and electrically connected with a flexible circuit board; the flat layer is positioned on the substrate body, and a first boundary ofthe flat layer is positioned outside the connecting terminals; the pixel electrodes are positioned on the flat layer; and at least part of the first boundary of the flat layer are recessed inwardly toform recess parts, and a planar part is formed between two adjacent recess parts by cutting. The invention discloses a display panel. Thus, short circuit caused by residual metal is reduced.

The invention provides a grid stack structure and a method for manufacturing the grid stack structure. The grid stack structure comprises an isolation medium layer, wherein the isolation medium layer is formed on a grid and embedded into the grid; a side wall is used for covering the opposite side surfaces of the isolation medium layer; and the isolation medium layer positioned on an active region is thicker than the isolation medium layer positioned on a connecting region. The method for manufacturing the grid stack structure comprises the following steps of: eliminating a part of thickness of the grid, wherein the eliminated thickness of the grid on the active region is greater than the thickness of the grid on the connecting region so as to expose the opposite inner walls in the side wall; and forming the isolation medium layer on the grid, wherein the isolation medium layer covers the exposed inner walls. The invention also provides a semiconductor and a manufacturing method thereof. By the invention, the probability that a short circuit is formed between the grid and a second contact hole can be reduced; and process compatibility can be formed between a first contact hole and the second contact hole.

An enhancement-depletion-mode inverter includes a load transistor and a drive transistor. The load transistor has a top gate architecture with a first source, a first drain, a load channel region, a first semiconductor layer, and a first gate electrode. A load gate dielectric is in the load channel region, and has a load dielectric thickness. The load transistor is configured to operate in a depletion mode. The drive transistor has a bottom gate architecture with a second source, a second drain, a drive channel region, a second semiconductor layer, and a second gate electrode. A drive gate dielectric is in the drive channel region, and has a drive dielectric thickness that is different from the load dielectric thickness. The drive transistor is configured to operate in a normal mode or an enhancement mode. The first source is electrically connected to the second drain and the first gate.

The invention relates to a cylindrical battery cell, a battery, an electric device, a manufacturing method and a manufacturing system. The cylindrical battery cell includes a shell having an opening and an electrode assembly. The electrode assembly is arranged in the shell, the electrode assembly comprises a diaphragm and a tab, in the axial direction of the electrode assembly, the tab is locatedat one end of the electrode assembly and extends towards the opening, the tab comprises a first part and a second part, the second part surrounds the periphery of the first part, and the diaphragm wraps the second part to isolate the second part from the shell; in the axial direction, the first part exceeds the second part and the diaphragm, and the second part does not exceed the diaphragm. The battery cell provided by the invention aims to solve the technical problem of short circuit of the battery cell.

The invention provides a manufacturing method of a semiconductor structure. The method is characterized by comprising the following steps: covering a second medium layer on a first medium layer and comprising the following steps: firstly, forming a first contact hole with less inner diameter in the second medium layer; then etching the first medium layer so as to form a second contact hole with greater inner diameter; and finally, filling electric conducting materials in the first contact hole and the second contact hole so as to form contact plugs. Correspondingly, the invention also provides a semiconductor structure. The semiconductor structure and the manufacturing method are beneficial to the reduction of contact resistance.

This invention claims a thermoelectric module (1), comprising a first substrate (11a) having a first surface (111a); a second substrate (11b) having a second surface (111b) opposite to the first substrate (111a); multiple thermoelectric elements (3) which are arranged and resisted with the first surface (111a) and the second surface (111b); multiple electrodes (5, 7) which are arranged on the first surface (111a) and the second surface (111b) and are connected with one or more of the multiple thermoelectric elements (3); a grounded electrode (9) arranged above at least one of the first surface (111a) and the second surface (111b); multiple electrodes (5, 7) having multiple rows (30) having two or more electrodes arranged in the length direction in at least one of the first surface (111a) and the second surface (111b); the grounded electrode (9) being located between two adjacent rows of multiple rows (30).

Producing a variable thickness dielectric stack includes providing a substrate with a first patterned conductive layer thereon. A first dielectric thin film is deposited using ALD and a first patterned deposition inhibitor layer, which is subsequently removed, to form a first patterned conformal dielectric layer having a first pattern. A second dielectric thin film is deposited using ALD and a second patterned deposition inhibitor layer to form a second patterned conformal dielectric layer having a second pattern. A second patterned conductive layer is formed with at least a portion of the first and second patterned conductive layers overlapping each other forming an overlap region. A portion of the first or second pattern extends into the overlap region such that one portion of the overlap region includes the first and second dielectric thin films, and another portion of the overlap region includes only the first or second dielectric thin film.

The invention belongs to the technical field of lithium ion batteries, and particularly relates to a novel adjustable SOC symmetric battery and a preparation method thereof. The symmetric battery comprises working electrodes, a counter electrode, an isolating membrane, an electrolyte and a packaging shell, and the working electrode, the counter electrode, the isolating membrane and the electrolyteare packaged in the packaging shell; wherein the working electrodes are two same-polarity electrodes, and a first tab is arranged on one side of each working electrode; the counter electrode is a metal lithium sheet, a second tab is arranged on one side of the counter electrode, and the first tab and the second tab are oppositely arranged; two side surfaces of each working electrode are providedwith at least one layer of isolating membrane, and two side surfaces of the counter electrode are provided with at least one layer of isolating membrane. According to a symmetric battery, the SOC of the working electrode can be adjusted in real time according to actual requirements; according to the preparation method, the situation that the performance of the lithium battery is reduced due to pole piece damage, pole piece resistance increase and the like can be eliminated, so that the impedance performance of the positive and negative electrode materials of the lithium battery to-be-tested under different SOCs can be evaluated more accurately and efficiently, and more comprehensive basic evaluation data can be obtained.

The present invention provides a solenoid and electrical connector assembly which includes a solenoid body having a pair of electrical terminals disposed on opposite sides of a plunger component and a connector having two corresponding electrical terminals and a non-conductive blade or tongue disposed therebetween. When assembled, the tongue of the connector seats between the terminals on the solenoid body and inhibits corrosion and ingress of foreign matter in the region between the terminals of the solenoid.

The invention provides a coil electric conductor device and a manufacture method thereof. The method comprises the following steps of: a lower leading-out end step, a coil conductor step, a casting step and an upper leading-out end step, wherein the coil conductor step comprises a connection point step: printing a coil conductor, wherein cavities can be generated at the tip position of a lower leading-out end and the middle position of the tip position of the coil conductor if the thickness of the tip position of the coil conductor is less than that of the middle part of the coil conductor; drying again; printing first connection points at the positions of the cavities; then casting a layer of ferrite pulp film; and printing second connection points the area of which is larger than that of the first connection points on the first connection points after the ferrite pulp film is dried; in the casting step, casting a layer of ferrite pulp film, and exposing the second connection points out of the ferrite pulp film; drying, and then repeating the coil conductor step, the connection point step and the casting step on the ferrite pulp film for several times so as to form the coil conductor.

A panel having touch function is disclosed. The panel includes a plurality of films, a plurality of touch electrodes arranged on different film layers, a plurality of leading wires respectively corresponding to the touch electrodes, and a touch chip. The leading wires electrically connect the touch electrodes to the touch chip, wherein the leading wires connecting a portion of the touch electrodes are arranged on a first film layer of the film layers and the leading wires connecting other portions of the touch electrodes are arranged on a second film layer of the film layers. In addition, a display device is also disclosed. In this way, the short circuit is avoided, and the possibility of failed touch electrode is also reduced.

The invention provides a polar plate for a polar plate for a battery, a manufacturing method of the polar plate, a polar plate group with the polar plates and a lead storage battery. The polar plate comprises a current collector and a active substance layer kept by the current collector, wherein the current collector is an expanded grid manufactured with a cutting and drawing method, the polar plate is composed of two protruding end parts with protrusions and a flat middle part between the two end parts, the thickness of each end part is more than that of the middle part, and when the thickness of the middle part is set to be H2 and the height difference between each end part and the middle part is H1, the ratio of H1 / H2 is 3-9%. According to the invention, by means of designing the polar plate to be provided with protrusions at the end parts to form the protruding end parts with the protrusions and making the thickness of each end part of the polar plate more than that of other parts of the polar plate, a distance between a positive polar plate and a negative polar plate is properly enlarged, so that the cycle life, capacity and charging efficiency of the battery are greatly increased.

The invention relates to a conducting wire frame and a method for manufacturing the same; in one-time manufacturing flow, a stamping and material extrusion mode is utilized to mold a plurality of regions on each material strip with same sectional area; blocks with different thicknesses are formed in each region through the stamping and material extrusion mode; through the blocks with different thicknesses, a radiation pedestal and a power connection part of the conducting wire frame are formed; then, an insulating shell for covering the radiation pedestal and the power connection part is molded in each region; and further, the conducting wire frame is formed in each region of the material strip. Therefore, the method simplifies the manufacturing flow and reduces the production cost.

Provided are a piezoelectric vibrator and a high efficient method manufacturing the same. The piezoelectric vibrator (70, 72) includes a tuning-fork vibrator (78) having a base (74) and legs (76a, 76b). The piezoelectric vibrator (70, 72) is formed as a laminate of two piezoelectric substrates (80, 82), an intermediate electrode (84), surface electrodes (86, 88, 90), and a whole surface electrode (94). The surface electrodes (86, 88, 90) are divided by division portions (92a, 92b) extending from the base (74) to the legs (76a, 76b). The division portions (92a, 92b) are formed wider at portions joining to a circuit board than at the other portions. The division portions (92a, 92b) are formed by dividing an electrode formed on the whole surface of a piezoelectric plate constituting the vibrator (78) by means of a dicer, or by dividing the electrode by means of laser irradiation or etching. The tuning-fork vibrator exhibits good insulation reliability at the time of mounting on a circuit board, and has a high vibrator sensitivity and a high S / N ratio.

The invention relates to a semiconductor encapsulation structure which comprises a baseplate, a chip and a sealant compound; wherein the baseplate contains a plurality of electric contacts which are positioned on the upper surface of the baseplate; the chip is fixedly and electrically connected to the upper surface of the baseplate; and the sealant compound covers the baseplate and the chip and exposes out of the lower surface of the baseplate, wherein the sealant compound contains a plurality of openings, and each opening encloses and exposes out of each electric contact.

The invention relates to a pre-charging apparatus used for a voltage source converter and with a line fault detection function. The pre-charging apparatus is characterized by comprising a pre-charging contactor K, a voltage-boosting transformer T, a current-limiting resistor R, a high-voltage-resistant rectifying bridge D, a direct current voltage sensor LEMU and a main control panel CPU. By integrating the pre-charging function and the line fault detection function of the voltage source converter, the pre-charging function and the line fault detection function can be obtained at the same time.

The invention discloses a method for embedding a flat copper wire by using a split stator core. The method comprises the following steps of: bending and forming the flat copper wire to form a hairpintype flat copper wire; sequentially inserting the welding ends of a plurality of hairpin type flat copper wires into the wire inserting holes of the base tool; arranging a winding on a base tool whileinserting tool sectioning structures into the arranged winding, and completing pre-arrangement of the winding when a plurality of tool sectioning structures are spliced into a full-circle tool sectioning above the base tool; inserting all the stator sectioning structures into a pre-arranged winding according to a mode of taking down one tool sectioning structure and then inserting one stator sectioning structure, and splicing the stator sectioning structures into a whole-circle stator sectioning of an embedded wire after the stator sectioning structures are inserted into the pre-arranged winding. According to the invention, the winding is inserted into the stator iron core after the whole forming process is completed, so that the flat copper wire is prevented from being formed in the stator iron core, the possibility of short circuit between the stator iron core and the winding is reduced, the percent of pass of the coil inserting stator can be improved, and the material cost is reduced.

The invention provides an air conditioner, comprising: a housing that includes an intake panel and an exhaust panel connected with each other; an intake grid frame arranged at an opening of the intakepanel and releasably connected with the intake panel; a purifying module arranged in the intake grid frame and allowing gas to flow into the housing, wherein the inner edge of the opening of the intake panel is recessed into the intake panel to form a guide structure, and the intake grid frame is guided into the opening of the intake panel through a guide structure. The air conditioner has the advantages that the intake panel is releasably connected with the intake grid frame, maintaining the intake grid frame is facilitated, and production rate of air conditioners is increased.

A copper-ring-free double-interface smart card packaging framework belongs to the technical field of electronic information, comprises a substrate and a chip bearing surface (9) arranged at the center of the substrate and is characterized in that the substrate comprises a base layer (1), a first contact layer (2) and a second contact layer (3). The base layer (1) is a middle layer and surrounds the chip bearing surface (9) and a soldering hole (6). The first contact layer (2) is wrapped on the front side of the base layer (1), the second contact layer (3) is wrapped on the reverse surface of the base layer (1), the soldering hole (6) is arranged on the second contact layer (3), and soldering blocks (7) and conductive wires (5) connected with the soldering blocks (7) are distributed on the surface of the second contact layer (3). The chip bearing surface (9) is respectively connected with the first contact layer (2) and the second contact layer (3) through a lead wire (10) in welding mode. Compared with the prior art, the copper-ring-free double-interface smart card packaging framework is not provided with a copper ring or a conductive wire connected with the copper ring, and accordingly has the advantages of saving materials, reducing cost, being simple and convenient in structure, reasonable and the like.

The invention discloses an external motor power conversion circuit of a permanent magnet reluctance type double rotor motor. The external motor power conversion circuit comprises a power supply, three-phase windings of a stator, and four parallel bridge arms. The upper end of each bridge arm is connected with a positive output end of the power supply, and the lower end is connected with a negative output end of the power supply. Each bridge arm is formed by connecting two switching tubes in series, and the two switching tubes are each connected with a power diode in parallel in the reverse direction. With regard to two adjacent bridge arms, and a phase of windings of the stator is connected in series between an emitter of the switching tube at the upper half bridge arm of one bridge arm and a collector of the switching tube at the lower half bridge arm of the other bridge arm. The external motor power conversion circuit designed for the special structure of an external motor of the permanent magnet reluctance type double rotor motor can guarantee the efficient operation of the external motor of the permanent magnet reluctance type double rotor motor, reduces the use of switching devices, improves the control performance of the external motor of the permanent magnet reluctance type double rotor motor, reduces operation cost, and promotes the application of the permanent magnet reluctance type double rotor motor.

A connector module is provided with first and second bus bars which are respectively formed by a metal plate, a control board on which an electronic component is mounted, and case member which is formed by insulative resin and houses the control board therein. Connector parts to be connected with respective counterpart connectors are integrally formed with the case member.

The invention discloses an inductive anti-leakage protector, which comprises a power shell. Copper metal detection switch devices are respectively installed on the left and right sides inside the power shell. The inductive anti-leakage protector is inductively powered by a copper metal plug. Power supply starts when the copper metal plug is plugged, and no power is supplied when a plug of other size or material is plugged. Meanwhile, limit ball and lock ball structures are designed. When a copper column plug is plugged, the limit balls are locked for limiting, so as to ensure good contact of internal contacts and start power supply. Through passive leakage protection, added intelligent induction, active defense of ball limit devices and O-shaped sealing rings, the inductive anti-leakage protector can achieve an anti-leakage effect under different application conditions. By adding active defense of the intelligent anti-leakage function, high integration of the control circuit can be achieved. The power consumption of the product is low, and the product is completely packaged. Stable working conditions of a chip and a weak current part are ensured, and thus, the operation of the product can meet the requirements of various working conditions.

A light emitting diode display device includes a display board comprising a plurality of unit pixels, a drive circuit board including a plurality of drive circuit regions corresponding to the plurality of unit pixels, and a plurality of bumps interposed between the plurality of unit pixels and the plurality of drive circuit regions. The plurality of unit pixels comprises a first unit pixel including a first P electrode. The plurality of drive circuit regions comprises a first drive circuit region corresponding to the first unit pixel and a first pad connected to a first drive transistor, the plurality of bumps includes a first solder in contact with the first pad, and a first bump on the first solder and including a first filler in contact with the first P electrode, the first solder includes at least one of tin and silver, and the first filler includes copper or nickel.

The present invention provides a chip component package and a semiconductor device capable of suppressing short circuits with adjacent pads or components even if the amount of the conductive adhesive is increased to increase the contact area between the chip component and the conductive adhesive. . A chip component mounting body in which a chip component (2) is mounted on a printed wiring board (1) through a conductive adhesive (3), is characterized in that the chip component has a corner (2b), and the corner The ridgeline of the part is arranged toward the pad part (1a) side of the printed wiring board, and the angle (α) formed by the surface adjacent to the ridgeline of the corner part of the chip component and the surface of the pad part becomes an acute angle. is carried.

The invention discloses a dual-power switching protection device, and belongs to the technical field of the power protection. The protection device comprises a protection shell, a movable contact, a controller, and a driving cylinder; a cavity is formed in the protection shell, a protection end cover is arranged at the cavity of the protection shell, and a partition plate is arranged in the cavityin the protection shell to divide the cavity into a working cavity; main static contacts, output static contacts and standby static contacts are respectively arranged in the working cavity from top to the bottom; two main static contacts, two output static contacts and two standby static contacts are provided, and the gaps are formed between two main static contacts, between two output static contacts and between two standby static contacts; the movable contact is arranged in the gap in a sliding way, a standby movable contact is arranged at the top of the movable contact, a sliding channel is formed on the partition plate, and the standby movable contact is cooperated on the protection shell and the partition plate; one side of a stop plate is connected with a driving cylinder, the controller is electrically connected with each of the driving cylinder, the main static contact, the output static contact and the standby static contact. The dual-power switching protection device disclosed by the invention is simple in structure and low in cost, the dirt retention is greatly reduced while the normal operation of the dual-power switching is unaffected, and the short-circuit possibility of the device is reduced.