Stacked multi-encapsulation structure device, semiconductor encapsulation structure and manufacturing method thereof

Abstract

The invention relates to a semiconductor encapsulation structure which comprises a baseplate, a chip and a sealant compound; wherein the baseplate contains a plurality of electric contacts which are positioned on the upper surface of the baseplate; the chip is fixedly and electrically connected to the upper surface of the baseplate; and the sealant compound covers the baseplate and the chip and exposes out of the lower surface of the baseplate, wherein the sealant compound contains a plurality of openings, and each opening encloses and exposes out of each electric contact.

Description

technical field [0001] The present invention relates to a stacked multi-package structure device, and more particularly to a lower package structure of a stacked multi-package structure device. The sealing compound has an opening to surround and expose the electrical contacts of the substrate. Background technique [0002] At present, the stacked multi-package structure (Package on Package; POP) device mainly refers to disposing one semiconductor package structure on another semiconductor package structure, and its basic purpose is to increase the density to produce greater functions per unit space and better regional performance, thereby reducing the total area and cost of the entire stacked multi-package construction device. [0003] Referring to FIG. 1, U.S. Patent No. 7,101,731, entitled "Semiconductor multi-package module having inverted second package stacked over die-up flip-chip ball grid array (BGA) package), its prior art discloses the structure of a stacked multi...

AI Technical Summary

Problems solved by technology

[0006] However, the lower encapsulation compound 117 of the lower package structure 110 of the known stacked multi-package structure device 150 does not have any openings, which surrounds and exposes the pads 115 or the solder balls 128

Therefore, the known stacked multi-package structure device 150 cannot reduce the risk of solder extrusion after soldering (solder extrusion risk), and thus cannot reduce the possibility of short circuits between lines.

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