Coil electric conductor device and manufacture method thereof

Abstract

The invention provides a coil electric conductor device and a manufacture method thereof. The method comprises the following steps of: a lower leading-out end step, a coil conductor step, a casting step and an upper leading-out end step, wherein the coil conductor step comprises a connection point step: printing a coil conductor, wherein cavities can be generated at the tip position of a lower leading-out end and the middle position of the tip position of the coil conductor if the thickness of the tip position of the coil conductor is less than that of the middle part of the coil conductor; drying again; printing first connection points at the positions of the cavities; then casting a layer of ferrite pulp film; and printing second connection points the area of which is larger than that of the first connection points on the first connection points after the ferrite pulp film is dried; in the casting step, casting a layer of ferrite pulp film, and exposing the second connection points out of the ferrite pulp film; drying, and then repeating the coil conductor step, the connection point step and the casting step on the ferrite pulp film for several times so as to form the coil conductor.

Description

technical field [0001] The invention relates to a manufacturing method of a coil electric conductor device and the coil electric conductor device. Background technique [0002] Conventionally, a laminated coil device such as a chip inductor device includes laminated ceramic layers and a coil conductor having a certain shape, and the coil conductor ends are connected between layers through connection points to form a spiral coil conductor. [0003] In recent years, with the wide application of electronic components, while paying attention to the performance of components, the requirements for miniaturization and low thickness of components are becoming more and more intense. In order to meet these requirements, the line width and thickness of coil conductors need to be thinner. To get bigger, on the other hand, the ceramic layer has to get thinner. However, if the thickness of the coil conductor is increased and the ceramic layer is thinned, the thickness of the overlapped p...

AI Technical Summary

Problems solved by technology

However, at the connection point, due to the superposition of the height of the conductor and the height of the connection point, the total height here is larger than that of other parts, which is easy to cause short circuit of the coil conductors of the upper and lower layers.

Moreover, it will also cause the laminated device to form a protrusion at the connection point, which will cause trouble to the use of the device

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