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Liquid metal thermal interface material capable of 50-80 DEG C heat dissipation and without side leakage

A technology of thermal interface materials and liquid metals, applied in the field of indium alloys, can solve problems such as no solutions, achieve low production costs, simple processing and smelting methods, and facilitate large-scale production and practical application

Inactive Publication Date: 2019-07-02
杭州辰卓科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Countries have invested a lot of manpower and physics in in-depth research, but there is no relatively mature solution

Method used

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  • Liquid metal thermal interface material capable of 50-80 DEG C heat dissipation and without side leakage

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] A liquid metal thermal interface material with 50-80 degree heat dissipation and no side leakage. In terms of weight percentage, the alloy composition of the middle layer is: Co: 0.2wt.%, Zn: 5.0wt.%, Ga: 1.0wt.%, Mn: 0.5wt.%, Si: 0.1wt.%, Ge: 0.8wt .%, the balance is indium.

[0018] The preparation method of the above-mentioned heat dissipation material includes the following processing steps: (a) After the alloy is configured according to the required components, it is put into an induction furnace for melting, and is protected by a graphite crucible and argon; heat preservation at 300-400 degrees for 10 minutes After the alloy melt is fully stirred evenly by electromagnetic stirring, it is introduced into the graphite mold for casting; (b) The ingot is cold-rolled, and the reduction of each rolling pass is 10-20% until the required rolling is achieved. Thickness (0.1-0.5mm).

[0019] The matrix phase of the material has a melting point of 92 degrees, while the env...

Embodiment 2

[0021] A liquid metal thermal interface material with 50-80 degree heat dissipation and no side leakage. In terms of weight percentage, the alloy composition of the middle layer is: Co: 0.4wt.%, Zn: 6.0wt.%, Ga: 2.0wt.%, Mn: 0.8wt.%, Si: 0.2wt.%, Ge: 1.2wt .%, the balance is indium.

[0022] The preparation method of the above-mentioned heat dissipation material includes the following processing steps: (a) After the alloy is configured according to the required components, it is put into an induction furnace for melting, and is protected by a graphite crucible and argon; heat preservation at 300-400 degrees for 10 minutes After the alloy melt is fully stirred evenly by electromagnetic stirring, it is introduced into the graphite mold for casting; (b) The ingot is cold-rolled, and the reduction of each rolling pass is 10-20% until the required rolling is achieved. Thickness (0.1-0.5mm).

[0023] The matrix phase of the material has a melting point of 98 degrees, while the env...

Embodiment 3

[0025] A liquid metal thermal interface material with 50-80 degree heat dissipation and no side leakage. In terms of weight percentage, the alloy composition of the middle layer is: Co: 0.3wt.%, Zn: 5.2wt.%, Ga: 1.5wt.%, Mn: 0.6wt.%, Si: 0.1wt.%, Ge: 0.9wt .%, the balance is indium.

[0026] The preparation method of the above-mentioned heat dissipation material includes the following processing steps: (a) After the alloy is configured according to the required components, it is put into an induction furnace for melting, and is protected by a graphite crucible and argon; heat preservation at 300-400 degrees for 10 minutes After the alloy melt is fully stirred evenly by electromagnetic stirring, it is introduced into the graphite mold for casting; (b) The ingot is cold-rolled, and the reduction of each rolling pass is 10-20% until the required rolling is achieved. Thickness (0.1-0.5mm).

[0027] The matrix phase of the material has a melting point of 94 degrees, while the env...

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Abstract

The invention discloses a liquid metal thermal interface material capable of 50-80 DEG C heat dissipation and without side leakage. An interlayer alloy is prepared from the compositions in percentageby weight: 0.2-0.4 wt.% of Co, 5.0-6.0 wt.% of Zn, 1.0-2.0 wt.% of Ga, 0.5-0.8 wt.% of Mn, 0.1-0.2 wt.% of Si, 0.8-1.2 wt.% of Ge, and the balance of In. According to the liquid metal thermal interface material, side leakage of common liquid metal is avoided, and meanwhile, the beneficial liquid metal thermal interface material is provided for the field of the electronic industry, wherein the field of the electronic industry is in urgent need of efficient cooling. It can be predicted that the successful industrialization of the liquid metal thermal interface material can obtain the great social value and economic value.

Description

technical field [0001] The invention relates to the technical field of alloys, in particular to an indium alloy. Background technique [0002] With the rapid development of science and technology, the requirements for electronic devices are getting higher and higher. At the same time, electronic devices are also developing in the direction of integration and miniaturization. At the same time, high reliability, flexibility, compactness and easy maintenance are required. This demand brings new challenges to the materials used in electronic devices, manufacturing processes and electronic circuits. The miniaturization and high power of devices inevitably require high heat dissipation efficiency, so high-density heat dissipation seriously restricts the development of power electronics technology. Internationally, more stringent requirements have been put forward for the heat dissipation of electronic power devices. [0003] A cooling system can be simply summarized into two p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C28/00C22C1/02
CPCC22C1/02C22C28/00
Inventor 刘亚军
Owner 杭州辰卓科技有限公司
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