157results about How to "Excellent heat-resistance" patented technology

Disclosed is a resin composition for printed wiring boards that comprises (A) a polyimide resin that has hexafluoroisopropanol groups and a siloxane structure and (B) a heat curable resin. The resin composition has excellent solvent resistance and excellent heat resistance with little temperature variation in the modulus of elasticity.

The present invention relates to a novel bacteriophage having an E.-coli-specific bactericidal activity, a composition for the prevention or treatment of infectious diseases caused by Enterotoxigenic E.-coli comprising the bacteriophage as an active ingredient, an antibiotic comprising the bacteriophage as an active ingredient, a feed additive composition comprising the bacteriophage as an active ingredient, a sanitizer or cleaner comprising the bacteriophage as an active ingredient, and a method for treating colibacillosis using the bacteriophage. The novel bacteriophage of the present invention has a specific bactericidal activity against pathogenic E. coli, and excellent acid- and heat-resistance. Therefore, the novel bacteriophage can be used for the prevention or treatment of swine colibacillosis, which is an infectious disease caused by pathogenic E.-coli, and can also be widely used in animal feed additive compositions, sanitizers, and cleaners.

The invention provides an epoxy resin adhesive for potting a PVDF hollow fiber membrane. The epoxy resin adhesive comprises a component A and a component B at a mass ratio of 100 to (15-35), wherein the component A comprises 50-70 parts of epoxy resin, 5-15 parts of a toughening agent and 1-5 parts of a defoaming agent, the component B comprise an amine curing agent, the epoxy resin comprises bisphenol A diglycidyl ether; the toughening agent is a low-molecular polyurethane or polyol glycidyl ether; and the defoaming agent is one or more selected from organic phosphonic acid, polysiloxane, fatty alcohol, fatty acid ester and hydrophobic silicon oxide. The epoxy resin adhesive provided by the invention has the advantages of excellent mechanical property, aging resistance, heat resistance, corrosion resistance, good flexibility and the like, especially, the flexibility is enhanced and the problems of breakage and soaking of a membrane fiber during the potting of the epoxy resin adhesive are solved.

The present invention relates to an exothermic container to be used in a microwave oven which cooks foods using a magnetron. The exothermic container absorbs a portion of the microwaves generated by the magnetron and generates heat to cook foods in the cooking chamber of the microwave oven. The exothermic container to be used in the microwave oven is produced by the steps of providing an exothermic enamel glaze, coating a metal container to be produced into an enameled container (low carbon steel plate, aluminum, and stainless steel to be produced into an enameled container) with the exothermic enamel glaze provided in the previous step, drying the resulting structure, firing the resulting structure to vitrify same, and cooling the resulting structure, to thereby achieve improved resistance against hot temperatures, improved exothermic performance,; and higher quality as compared to conventional exothermic container products (silicon rubber and ferrite). A method for producing the exothermic enamel glaze involves mixing or adding (MnZn-based, MgCuZn-based, NiZn-based) ferrite, having high magnetic permeability, and alloy powders of (Fe-Si-based, Fe-Si-Al-based, Fe-Si-B-based, Fe-Si-B-Co-based, Fe-Ni-based, etc.) soft magnetic metal materials to the glaze (glass frit) commonly used in enameling, to thereby provide the glaze with exothermic properties for absorbing microwaves (2.45GHz) and for converting the absorbed microwaves into thermal energy in a microwave oven.